purchase customization

1 Market Overview    

1.1 Product Overview and Scope of 3D IC & 2.5D IC Packaging 

1.2 Segment by Type    

1.2.1 Europe Market Size YoY Growth Rate Analysis by Type: 2023 VS 2030    

1.2.2 3D TSV    

1.2.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

1.3 Segment by Application  

1.3.1 Europe Market Size YoY Growth Rate Analysis by Application: 2023 VS 2030    

1.3.2    Automotive

1.3.3    Consumer electronics

1.3.4    Medical devices

1.3.5    Military & aerospace

1.3.6    Telecommunication

1.3.7    Industrial sector and smart technologies

1.4 Europe Market Growth Prospects    

1.4.1 Europe Revenue Estimates and Forecasts (2019-2030)    

1.4.2 Europe Production Estimates and Forecasts (2019-2030)  

2 Europe Growth Trends    

2.1 Industry Trends    

2.1.1 SWOT Analysis    

2.1.2 PESTEL Analysis    

2.1.3 Porter’s Five Forces Analysis    

2.2 Potential Market and Growth Potential Analysis    

3 Market Competition by Manufacturers  

3.1 Europe Production by Manufacturers (2019-2023)    

3.2 Europe Revenue Market Share by Manufacturers (2019-2023)    

3.3 Market Share by Company Type (Tier 1, Tier 2, and Tier 3)    

3.4 Europe Average Price by Manufacturers (2019-2023)    

3.5 Manufacturers Production Sites, Area Served, Product Type    

3.6 Market Competitive Situation and Trends    

3.6.1 Market Concentration Rate    

3.6.2 Europe 5 and 10 Largest Players Market Share by Revenue    

3.6.3 Mergers & Acquisitions, Expansion  

4 Production by Region

4.1 Europe Production    

4.1.1 Europe Production YoY Growth Rate (2019-2023)    

4.1.2 Europe Production, Revenue, Price and Gross Margin (2019-2024)  

5 Consumption by Region  

5.1 Europe    

5.1.1 Europe Consumption by Country    

5.1.2 Europe Sales, Consumption, Export, Import (2019-2023)    

5.1.1 Germany    

5.2.2 United Kingdom

5.3.3 France

5.4.4 Italy

5.5.5 Spain

5.6.6 Netherlands

5.7.7 Belgium

6 Segment by Type   

6.1 Europe Production Market Share by Type (2019-2024)    

6.2 Europe Revenue Market Share by Type (2019-2024)    

6.3 Europe Price by Type (2019-2024) 

7 Segment by Application  

7.1 Europe Production Market Share by Application (2019-2024)    

7.2 Europe Revenue Market Share by Application (2019-2024)    

7.3 Europe Price by Application (2019-2024)  

8 Key Companies Profiled    

8.1 STMicroelectronics (Switzerland)    

8.1.1 STMicroelectronics (Switzerland) Corporation Information    

8.1.2 STMicroelectronics (Switzerland) Product Portfolio    

8.1.3 STMicroelectronics (Switzerland) Production Capacity, Revenue, Price and Gross Margin (2019-2024)    

8.1.4 STMicroelectronics (Switzerland) Main Business and Markets Served    

8.1.5 STMicroelectronics (Switzerland) Recent Developments/Updates    

8.2 Infineon Technologies AG (Germany)    

8.2.1 Infineon Technologies AG (Germany) Corporation Information    

8.2.2 Infineon Technologies AG (Germany) Product Portfolio    

8.2.3 Infineon Technologies AG (Germany) Production Capacity, Revenue, Price and Gross Margin (2019-2024)    

8.2.4 Infineon Technologies AG (Germany) Main Business and Markets Served    

8.2.5 Infineon Technologies AG (Germany) Recent Developments/Updates    

8.3 ASE Group (Netherlands)    

8.3.1 ASE Group (Netherlands) Corporation Information    

8.3.2 ASE Group (Netherlands) Product Portfolio    

8.3.3 ASE Group (Netherlands) Production Capacity, Revenue, Price and Gross Margin (2019-2024)    

8.3.4 ASE Group (Netherlands) Main Business and Markets Served    

8.3.5 ASE Group (Netherlands) Recent Developments/Updates    

8.4 AMS AG (Austria)    

8.4.1 AMS AG (Austria) Corporation Information    

8.4.2 AMS AG (Austria) Product Portfolio    

8.4.3 AMS AG (Austria) Production Capacity, Revenue, Price and Gross Margin (2019-2024)    

8.4.4 AMS AG (Austria) Main Business and Markets Served    

8.4.5 AMS AG (Austria) Recent Developments/Updates    

8.5 S