Report overview
This report contains market size and forecasts of Wafer Bonding Equipment in global, including the following market information:
Global Wafer Bonding Equipment Market Revenue, 2018-2023, 2023-2030, ($ millions)
Global Wafer Bonding Equipment Market Sales, 2018-2023, 2023-2030, (Units)
Global top five Wafer Bonding Equipment companies in 2022 (%)
The global Wafer Bonding Equipment market was valued at 316.7 million in 2022 and is projected to reach US$ 461 million by 2030, at a CAGR of 5.5% during the forecast period 2023-2030.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million by 2030.
Fully Automatic Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Wafer Bonding Equipment include EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machinetool, Ayumi Industry, Shanghai Micro Electronics, U-Precision Tech and Hutem, etc. In 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Wafer Bonding Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Bonding Equipment Market, Ingecal, 2018-2023, 2023-2030 ($ Millions) & (Units)
Global Wafer Bonding Equipment Market Segment Percentages, Ingecal, 2022 (%)
Fully Automatic
Semi Automatic
Global Wafer Bonding Equipment Market, by Application, 2018-2023, 2023-2030 ($ Millions) & (Units)
Global Wafer Bonding Equipment Market Segment Percentages, by Application, 2022 (%)
MEMS
Advanced Packaging
CIS
Others
Global Wafer Bonding Equipment Market, By Region and Country, 2018-2023, 2023-2030 ($ Millions) & (Units)
Global Wafer Bonding Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Bonding Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Wafer Bonding Equipment revenues share in global market, 2022 (%)
Key companies Wafer Bonding Equipment sales in global market, 2018-2023 (Estimated), (Units)
Key companies Wafer Bonding Equipment sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
EV Group
SUSS MicroTec
Tokyo Electron
Applied Microengineering
Nidec Machinetool
Ayumi Industry
Shanghai Micro Electronics
U-Precision Tech
Hutem
Canon
Bondtech
TAZMO
TOK
