Report overview
A SiC wafer is a semiconductor material that has excellent electrical and thermal properties. It is a high-performance semiconductor that is ideal for a wide variety of applications. In addition to its high thermal resistance, it also features a very high level of hardness.
This report contains market size and forecasts of SiC Wafer Laser Cutting Equipment in global, including the following market information:
Global SiC Wafer Laser Cutting Equipment Market Revenue, 2018-2023, 2023-2030, ($ millions)
Global SiC Wafer Laser Cutting Equipment Market Sales, 2018-2023, 2023-2030, (K Units)
Global top five SiC Wafer Laser Cutting Equipment companies in 2022 (%)
The global SiC Wafer Laser Cutting Equipment market was valued at million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million by 2030.
Fully-Automatic Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of SiC Wafer Laser Cutting Equipment include DISCO, ADT, TOKYO SEIMITSU, Laser Photonics, ACME, Delphi Laser, Han's Laser, Lumi Laser and LasFocus, etc. In 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the SiC Wafer Laser Cutting Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global SiC Wafer Laser Cutting Equipment Market, By Type, 2018-2023, 2023-2030 ($ Millions) & (K Units)
Global SiC Wafer Laser Cutting Equipment Market Segment Percentages, By Type, 2022 (%)
Fully-Automatic
Semi-Automatic
Global SiC Wafer Laser Cutting Equipment Market, By Application, 2018-2023, 2023-2030 ($ Millions) & (K Units)
Global SiC Wafer Laser Cutting Equipment Market Segment Percentages, By Application, 2022 (%)
Electronics Industry
Aerospace
Others
Global SiC Wafer Laser Cutting Equipment Market, By Region and Country, 2018-2023, 2023-2030 ($ Millions) & (K Units)
Global SiC Wafer Laser Cutting Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies SiC Wafer Laser Cutting Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies SiC Wafer Laser Cutting Equipment revenues share in global market, 2022 (%)
Key companies SiC Wafer Laser Cutting Equipment sales in global market, 2018-2023 (Estimated), (K Units)
Key companies SiC Wafer Laser Cutting Equipment sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
DISCO
ADT
TOKYO SEIMITSU
Laser Photonics
ACME
Delphi Laser
Han's Laser
Lumi Laser
LasFocus
Tianhong Laser
SHOLASER
Quick Laser
Laipu Technology
Beyond Laser
