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Epoxy resin is used in the packaging of various electronic parts, including capacitors and LED packaging materials; epoxy molding materials are also widely used in the packaging of semiconductors and integrated circuits.
This report contains market size and forecasts of Epoxy Resin For Electronic Packaging in global, including the following market information:

• Global Epoxy Resin For Electronic Packaging Market Revenue, 2018-2023, 2023-2030, ($ millions)
• Global Epoxy Resin For Electronic Packaging Market Sales, 2018-2023, 2023-2030, (Tons)
• Global top five Epoxy Resin For Electronic Packaging companies in 2022 (%)

The global Epoxy Resin For Electronic Packaging market was valued at million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million by 2030.
Bisphenol A Epoxy Resin Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Epoxy Resin For Electronic Packaging include Osaka Soda, Hexion, Epoxy Base Electronic, Huntsman, Aditya Birla Chemicals, DIC, Olin Corporation, Kukdo Chemical and Nan Ya Plastics, etc. In 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Epoxy Resin For Electronic Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Epoxy Resin For Electronic Packaging Market, by Type, 2018-2023, 2023-2030 ($ Millions) & (Tons)
Global Epoxy Resin For Electronic Packaging Market Segment Percentages, by Type, 2022 (%)

• Bisphenol A Epoxy Resin
• Bisphenol F Epoxy Resin
• Novolac Epoxy Resin
• Other

Global Epoxy Resin For Electronic Packaging Market, by Application, 2018-2023, 2023-2030 ($ Millions) & (Tons)
Global Epoxy Resin For Electronic Packaging Market Segment Percentages, by Application, 2022 (%)

• Semiconductor Encapsulation
• Electronic Components
• LED
• Other

Global Epoxy Resin For Electronic Packaging Market, By Region and Country, 2018-2023, 2023-2030 ($ Millions) & (Tons)
Global Epoxy Resin For Electronic Packaging Market Segment Percentages, By Region and Country, 2022 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis
The report also provides analysis of leading market participants including:

• Key companies Epoxy Resin For Electronic Packaging revenues in global market, 2018-2023 (Estimated), ($ millions)
• Key companies Epoxy Resin For Electronic Packaging revenues share in global market, 2022 (%)
• Key companies Epoxy Resin For Electronic Packaging sales in global market, 2018-2023 (Estimated), (Tons)
• Key companies Epoxy Resin For Electronic Packaging sales share in global market, 2022 (%)

Further, the report presents profiles of competitors in the market, key players include:

• Osaka Soda
• Hexion
• Epoxy Base Electronic
• Huntsman
• Aditya Birla Chemicals
• DIC
• Olin Corporation
• Kukdo Chemical
• Nan Ya Plastics
• Chang Chun Plastics
• SHIN-A T&C