Report overview
MEMS solder has a series of advantages such as high tensile strength, corrosion resistance, excellent thermal creep properties, compatibility with other precious metals, excellent electrical conductivity, excellent thermal conductivity, etc.
This report contains market size and forecasts of MEMS Packaging Solder in global, including the following market information:
Global MEMS Packaging Solder Market Revenue, 2018-2023, 2023-2030, ($ millions)
Global MEMS Packaging Solder Market Sales, 2018-2023, 2023-2030, (Tons)
Global top five MEMS Packaging Solder companies in 2022 (%)
The global MEMS Packaging Solder market was valued at million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million by 2030.
Solder Wire Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of MEMS Packaging Solder include Mitsubishi Materials Corporation, Henkel, Nordson Corporation, Indium Corporation, Materion, Tamura, Nihon Superior, KAWADA and Sandvik Materials Technology, etc. In 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the MEMS Packaging Solder manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global MEMS Packaging Solder Market, by Type, 2018-2023, 2023-2030 ($ Millions) & (Tons)
Global MEMS Packaging Solder Market Segment Percentages, by Type, 2022 (%)
Solder Wire
Solder Paste
Preformed Solder
Global MEMS Packaging Solder Market, by Application, 2018-2023, 2023-2030 ($ Millions) & (Tons)
Global MEMS Packaging Solder Market Segment Percentages, by Application, 2022 (%)
Consumer Electronics
Automotive Electronics
Medical Industry
Others
Global MEMS Packaging Solder Market, By Region and Country, 2018-2023, 2023-2030 ($ Millions) & (Tons)
Global MEMS Packaging Solder Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies MEMS Packaging Solder revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies MEMS Packaging Solder revenues share in global market, 2022 (%)
Key companies MEMS Packaging Solder sales in global market, 2018-2023 (Estimated), (Tons)
Key companies MEMS Packaging Solder sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Mitsubishi Materials Corporation
Henkel
Nordson Corporation
Indium Corporation
Materion
Tamura
Nihon Superior
KAWADA
Sandvik Materials Technology
Miller Welding
Lincoln Electric
Shenzhen Huamao Xiang Electronics
Shenzhen Fu Ying Da Industrial Technology
Morning Sun Technology
Kunpeng Precision Intelligent Technology
Guangzhou Xiangyi Electronic Technology
Guangzhou Pudi Lixin Technology
Suzhou Silicon Age Electronic Technology
