Report overview
This report contains market size and forecasts of Wafer Processing and Assembly Equipment in global, including the following market information:
Global Wafer Processing and Assembly Equipment Market Revenue, 2018-2023, 2023-2030, ($ millions)
Global Wafer Processing and Assembly Equipment Market Sales, 2018-2023, 2023-2030, (Units)
Global top five Wafer Processing and Assembly Equipment companies in 2022 (%)
The global Wafer Processing and Assembly Equipment market was valued at million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million by 2030.
Chemical Mechanical Polishing (CMP) Equipment Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Wafer Processing and Assembly Equipment include Applied Materials, ASML, Tokyo Electron, Lam Research, KLA, Hitachi High-Technologies, Disco, ASM Pacific Technology and Kulicke and Soffa Industries, etc. In 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Wafer Processing and Assembly Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Processing and Assembly Equipment Market, by Type, 2018-2023, 2023-2030 ($ Millions) & (Units)
Global Wafer Processing and Assembly Equipment Market Segment Percentages, by Type, 2022 (%)
Chemical Mechanical Polishing (CMP) Equipment
Etching Equipment
Thin Film Deposition Equipment
Photoresist Processing Equipment
Assembly Equipment
Global Wafer Processing and Assembly Equipment Market, by Application, 2018-2023, 2023-2030 ($ Millions) & (Units)
Global Wafer Processing and Assembly Equipment Market Segment Percentages, by Application, 2022 (%)
OEM
Aftermarket
Global Wafer Processing and Assembly Equipment Market, By Region and Country, 2018-2023, 2023-2030 ($ Millions) & (Units)
Global Wafer Processing and Assembly Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Processing and Assembly Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Wafer Processing and Assembly Equipment revenues share in global market, 2022 (%)
Key companies Wafer Processing and Assembly Equipment sales in global market, 2018-2023 (Estimated), (Units)
Key companies Wafer Processing and Assembly Equipment sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Applied Materials
ASML
Tokyo Electron
Lam Research
KLA
Hitachi High-Technologies
Disco
ASM Pacific Technology
Kulicke and Soffa Industries
BE Semiconductor
Towa
