Report overview
Electroplating refers to the electroplating of metal ions in electroplating solution to the surface of wafer to form metal interconnection in the process of chip manufacturing. At present, semiconductor electroplating is widely used, including the deposition of copper wire, nickel, gold, tin silver alloy and other metals, but mainly the deposition of metal copper. Copper wires can reduce the interconnection impedance, reduce the power consumption and cost of devices, and improve the speed, integration and device density of chips.
This report contains market size and forecasts of High Purity Electroplating Solution in global, including the following market information:
Global High Purity Electroplating Solution Market Revenue, 2018-2023, 2023-2030, ($ millions)
Global High Purity Electroplating Solution Market Sales, 2018-2023, 2023-2030, (Tons)
Global top five High Purity Electroplating Solution companies in 2022 (%)
The global High Purity Electroplating Solution market was valued at million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million by 2030.
Copper Electroplating Solution Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of High Purity Electroplating Solution include DuPont, BASF, Merck KGaA, Umicore, Transene, ADEKA, Shanghai Sinyang, PhiChem Corporation was and Besound Technology, etc. In 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the High Purity Electroplating Solution manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global High Purity Electroplating Solution Market, by Type, 2018-2023, 2023-2030 ($ Millions) & (Tons)
Global High Purity Electroplating Solution Market Segment Percentages, by Type, 2022 (%)
Copper Electroplating Solution
Gold Plating Solution
Tin Plating Solution
Manganese Nickel Electroplating Solution
Others
Global High Purity Electroplating Solution Market, by Application, 2018-2023, 2023-2030 ($ Millions) & (Tons)
Global High Purity Electroplating Solution Market Segment Percentages, by Application, 2022 (%)
Semiconductor Manufacturing and Packaging
Solar Cell Grid
Global High Purity Electroplating Solution Market, By Region and Country, 2018-2023, 2023-2030 ($ Millions) & (Tons)
Global High Purity Electroplating Solution Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies High Purity Electroplating Solution revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies High Purity Electroplating Solution revenues share in global market, 2022 (%)
Key companies High Purity Electroplating Solution sales in global market, 2018-2023 (Estimated), (Tons)
Key companies High Purity Electroplating Solution sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
DuPont
BASF
Merck KGaA
Umicore
Transene
ADEKA
Shanghai Sinyang
PhiChem Corporation was
Besound Technology
Krohn Industries
Microchemicals
NB Technologies
