Report overview
This report contains market size and forecasts of Fully Automatic Semiconductor Molding Equipment in global, including the following market information:
Global Fully Automatic Semiconductor Molding Equipment Market Revenue, 2018-2023, 2023-2030, ($ millions)
Global Fully Automatic Semiconductor Molding Equipment Market Sales, 2018-2023, 2023-2030, (K Units)
Global top five Fully Automatic Semiconductor Molding Equipment companies in 2022 (%)
The global Fully Automatic Semiconductor Molding Equipment market was valued at million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million by 2030.
Hydraulic Semiconductor Molding System Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Fully Automatic Semiconductor Molding Equipment include TOWA, ASMPT, Besi, I-PEX, Yamada, TAKARA TOOL & DIE, Asahi Engineering, Tongling Fushi Sanjia and Nextool Technology and etc. In 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Fully Automatic Semiconductor Molding Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Fully Automatic Semiconductor Molding Equipment Market, by Type, 2018-2023, 2023-2030 ($ Millions) & (K Units)
Global Fully Automatic Semiconductor Molding Equipment Market Segment Percentages, by Type, 2022 (%)
Hydraulic Semiconductor Molding System
Electric Semiconductor Molding System
Global Fully Automatic Semiconductor Molding Equipment Market, by Application, 2018-2023, 2023-2030 ($ Millions) & (K Units)
Global Fully Automatic Semiconductor Molding Equipment Market Segment Percentages, by Application, 2022 (%)
Wafer Level Packaging
BGA Packaging
Flat Panel Packaging
Others
Global Fully Automatic Semiconductor Molding Equipment Market, By Region and Country, 2018-2023, 2023-2030 ($ Millions) & (K Units)
Global Fully Automatic Semiconductor Molding Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Fully Automatic Semiconductor Molding Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Fully Automatic Semiconductor Molding Equipment revenues share in global market, 2022 (%)
Key companies Fully Automatic Semiconductor Molding Equipment sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Fully Automatic Semiconductor Molding Equipment sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
TOWA
ASMPT
Besi
I-PEX
Yamada
TAKARA TOOL & DIE
Asahi Engineering
Tongling Fushi Sanjia
Nextool Technology
DAHUA Technology
