Report overview
Flip chip die attach is a method for making electrical connections to a chip, where the chip is inverted and its bond pads are connected to a corresponding pattern of bond pads on a substrate.
This report contains market size and forecasts of Semi-Automatic Flip Chip Bonders in global, including the following market information:
Global Semi-Automatic Flip Chip Bonders Market Revenue, 2018-2023, 2023-2030, ($ millions)
Global Semi-Automatic Flip Chip Bonders Market Sales, 2018-2023, 2023-2030, (K Units)
Global top five Semi-Automatic Flip Chip Bonders companies in 2022 (%)
The global Semi-Automatic Flip Chip Bonders market was valued at US$ million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million by 2030.
Ultra-low load Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Semi-Automatic Flip Chip Bonders include BESI, ASMPT, Muehlbauer, K&S, Hamni, SET, Athlete FA, Toray and Tresky, etc. In 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Semi-Automatic Flip Chip Bonders manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semi-Automatic Flip Chip Bonders Market, by Type, 2018-2023, 2023-2030 ($ Millions) & (K Units)
Global Semi-Automatic Flip Chip Bonders Market Segment Percentages, by Type, 2022 (%)
Ultra-low load
Ultra-high load
Global Semi-Automatic Flip Chip Bonders Market, by Application, 2018-2023, 2023-2030 ($ Millions) & (K Units)
Global Semi-Automatic Flip Chip Bonders Market Segment Percentages, by Application, 2022 (%)
Industrial
Construction
Others
Global Semi-Automatic Flip Chip Bonders Market, By Region and Country, 2018-2023, 2023-2030 ($ Millions) & (K Units)
Global Semi-Automatic Flip Chip Bonders Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semi-Automatic Flip Chip Bonders revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Semi-Automatic Flip Chip Bonders revenues share in global market, 2022 (%)
Key companies Semi-Automatic Flip Chip Bonders sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Semi-Automatic Flip Chip Bonders sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
BESI
ASMPT
Muehlbauer
K&S
Hamni
SET
Athlete FA
Toray
Tresky
