Report overview
Thick film hybrid integrated circuit (THIC) is a kind of hybrid integrated circuit, which is made of passive network on the same substrate by thick film process such as screen printing and sintering, and then assembled with discrete semiconductor chip or monolithic integrated circuit or micro component, and then packaged. The characteristics of thick film hybrid integrated circuit: compared with discrete component circuit, hybrid integrated circuit has the characteristics of high density, high reliability and better electrical performance; compared with PCB Compared with monolithic integrated circuit, it is flexible in design, simple in process, convenient in production of many varieties and small batch, and has wide parameter range, high precision, and can withstand high voltage and large output In terms of digital circuits, although semiconductor integrated circuits give full play to the characteristics of miniaturization, high reliability and large-scale low-cost production, thick film hybrid integrated circuits still maintain their advantages over semiconductor integrated circuits in many aspects, such as low-noise circuits, high-stability passive networks, high-frequency linear circuits High precision linear circuit, microwave circuit, high-voltage circuit, high-power circuit and mixed analog-to-digital circuit.
This report aims to provide a comprehensive presentation of the global market for Thick-Film Hybrid Integrated Circuits, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thick-Film Hybrid Integrated Circuits. This report contains market size and forecasts of Thick-Film Hybrid Integrated Circuits in global, including the following market information:
Global Thick-Film Hybrid Integrated Circuits Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Thick-Film Hybrid Integrated Circuits Market Sales, 2018-2023, 2024-2029, (K Units)
Global top five Thick-Film Hybrid Integrated Circuits companies in 2022 (%)
The global Thick-Film Hybrid Integrated Circuits market was valued at US$ 5847.8 million in 2022 and is projected to reach US$ 8059.6 million by 2029, at a CAGR of 4.7% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The main sales regions of thick film hybrid IC are Asia Pacific and North America, which together occupy about 60% of the global market share.
We surveyed the Thick-Film Hybrid Integrated Circuits manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Thick-Film Hybrid Integrated Circuits Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Thick-Film Hybrid Integrated Circuits Market Segment Percentages, by Type, 2022 (%)
Al2O3 Ceramic Substrate
BeO Ceramic Substrate
Ain Substrate
Others
Global Thick-Film Hybrid Integrated Circuits Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Thick-Film Hybrid Integrated Circuits Market Segment Percentages, by Application, 2022 (%)
Aviation and National Defense
Automotive Industry
Telecommunication and Computer Industry
Consumer Electronics
Others
Global Thick-Film Hybrid Integrated Circuits Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Thick-Film Hybrid Integrated Circuits Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Thick-Film Hybrid Integrated Circuits revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Thick-Film Hybrid Integrated Circuits revenues share in global market, 2022 (%)
Key companies Thick-Film Hybrid Integrated Circuits sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Thick-Film Hybrid Integrated Circuits sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
International Rectifier (Infineon)
Crane Interpoint
GE Aviation
VPT (HEICO)
MDI
MSK (Anaren)
Technograph Microcircuits
Cermetek Microelectronics
Midas Microelectronics
NAURA Technology Group Co., Ltd.
JRM
International Sensor Systems
Zhenhua Microelectronics Ltd.
Xin Jingchang Electronics Co.,Ltd
E-TekNet
China Electronics Technology Group Corporation
Kolektor Siegert GmbH
Advance Circtuit Technology
AUREL s.p.a.
Fenghua Advanced Technology Holding CO.,LTD,
Custom Interconnect
Integrated Technology Lab
Chongqing Sichuan Instrument Microcircuit Co., Ltd.
Outline of Major Chapters:
Chapter 1: Introduces the definition of Thick-Film Hybrid Integrated Circuits, market overview.
Chapter 2: Global Thick-Film Hybrid Integrated Circuits market size in revenue and volume.
Chapter 3: Detailed analysis of Thick-Film Hybrid Integrated Circuits manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Thick-Film Hybrid Integrated Circuits in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Thick-Film Hybrid Integrated Circuits capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
