Report overview
During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-level, flip-chip, and through silicon via setups.
This report aims to provide a comprehensive presentation of the global market for Advanced Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Advanced Packaging. This report contains market size and forecasts of Advanced Packaging in global, including the following market information:
Global Advanced Packaging Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Advanced Packaging Market Sales, 2018-2023, 2024-2029, (K Units)
Global top five Advanced Packaging companies in 2022 (%)
The global Advanced Packaging market was valued at US$ 15310 million in 2022 and is projected to reach US$ 23360 million by 2029, at a CAGR of 6.2% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
ASE, Amkor, SPIL, Stats Chippac, PTI, JCET, J-Devices, UTAC, Chipmos, Chipbond, STS, Huatian, NFM, Carsem, Walton, Unisem, OSE, AOI, Formosa and NEPES are the key manufacturters of Advanced Packaging.
We surveyed the Advanced Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Advanced Packaging Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Advanced Packaging Market Segment Percentages, by Type, 2022 (%)
3.0 DIC
FO SIP
FO WLP
3D WLP
WLCSP
2.5D
Filp Chip
Global Advanced Packaging Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Advanced Packaging Market Segment Percentages, by Application, 2022 (%)
Analog & Mixed Signal
Wireless Connectivity
Optoelectronic
MEMS & Sensor
Misc Logic and Memory
Other
Global Advanced Packaging Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Advanced Packaging Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Advanced Packaging revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Advanced Packaging revenues share in global market, 2022 (%)
Key companies Advanced Packaging sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Advanced Packaging sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASE
Amkor
SPIL
Stats Chippac
PTI
JCET
J-Devices
UTAC
Chipmos
Chipbond
STS
Huatian
NFM
Carsem
Walton
Unisem
OSE
AOI
Formosa
NEPES
Outline of Major Chapters:
Chapter 1: Introduces the definition of Advanced Packaging, market overview.
Chapter 2: Global Advanced Packaging market size in revenue and volume.
Chapter 3: Detailed analysis of Advanced Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Advanced Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Advanced Packaging capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
