IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.
This report aims to provide a comprehensive presentation of the global market for IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging. This report contains market size and forecasts of IC Packaging in global, including the following market information:
- Global IC Packaging Market Revenue, 2018-2023, 2024-2029, ($ millions)
- Global IC Packaging Market Sales, 2018-2023, 2024-2029, (M Pcs)
Global top five IC Packaging companies in 2022 (%)
The global IC Packaging market was valued at US$ 39060 million in 2022 and is projected to reach US$ 50150 million by 2029, at a CAGR of 3.6% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global IC Packaging key players include ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, etc. Global top five manufacturers hold a share over 45%.
China Taiwan is the largest market, with a share over 40%, followed by China and South Korea, both have a share over 45%.
We surveyed the IC Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global IC Packaging Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (M Pcs)
Global IC Packaging Market Segment Percentages, by Type, 2022 (%)
- DIP
- SOP
- QFP
- QFN
- BGA
- CSP
- LGA
- WLP
- FC
- Others
Global IC Packaging Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (M Pcs)
Global IC Packaging Market Segment Percentages, by Application, 2022 (%)
Global IC Packaging Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (M Pcs)
Global IC Packaging Market Segment Percentages, By Region and Country, 2022 (%)
- North America
- US
- Canada
- Mexico
- Europe
- Germany
- France
- U.K.
- Italy
- Russia
- Nordic Countries
- Benelux
- Rest of Europe
- Asia
- China
- Japan
- South Korea
- Southeast Asia
- India
- Rest of Asia
- South America
- Brazil
- Argentina
- Rest of South America
- Middle East & Africa
- Turkey
- Israel
- Saudi Arabia
- UAE
- Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
- Key companies IC Packaging revenues in global market, 2018-2023 (Estimated), ($ millions)
- Key companies IC Packaging revenues share in global market, 2022 (%)
- Key companies IC Packaging sales in global market, 2018-2023 (Estimated), (M Pcs)
- Key companies IC Packaging sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
- ASE
- Amkor
- SPIL
- STATS ChipPac
- Powertech Technology
- J-devices
- UTAC
- JECT
- ChipMOS
- Chipbond
- KYEC
- STS Semiconductor
- Huatian
- MPl(Carsem)
- Nepes
- FATC
- Walton
- Unisem
- NantongFujitsu Microelectronics
- Hana Micron
- Signetics
- LINGSEN
Outline of Major Chapters:
- Chapter 1: Introduces the definition of IC Packaging, market overview.
- Chapter 2: Global IC Packaging market size in revenue and volume.
- Chapter 3: Detailed analysis of IC Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
- Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
- Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
- Chapter 6: Sales of IC Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
- Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
- Chapter 8: Global IC Packaging capacity by region & country.
- Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
- Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
- Chapter 11: The main points and conclusions of the report.
