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Semiconductor Packaging and Test Equipment Market, Global Outlook and Forecast 2023-2029

Semiconductor Packaging and Test Equipment Market, Global Outlook and Forecast 2023-2029

  • Published on : 21 March 2023
  • Pages :116
  • Report Code:SMR-7609095

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Report overview

The rapid expansion of semiconductor chip application is one of the primary factors contributing to the growth of the semiconductor packaging and test market in China. The use of semiconductor chips has expanded broadly with rising demands from various industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Packaging and Test Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Packaging and Test Equipment. This report contains market size and forecasts of Semiconductor Packaging and Test Equipment in global, including the following market information:
Global Semiconductor Packaging and Test Equipment Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Semiconductor Packaging and Test Equipment Market Sales, 2018-2023, 2024-2029, (Units)
Global top five Semiconductor Packaging and Test Equipment companies in 2022 (%)
The global Semiconductor Packaging and Test Equipment market was valued at US$ 11930 million in 2022 and is projected to reach US$ 17630 million by 2029, at a CAGR of 5.7% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
In China and China Taiwan, Semiconductor Packaging and Test Equipment key players include TEL, DISCO, ASM, etc. China and China Taiwan top three manufacturers hold a share over 40%.
In terms of product, Wafer Probe Station is the largest segment of Cobalt, with a share over 35%. And in terms of application, the largest application is OSAT, followed by IDMs.
We surveyed the Semiconductor Packaging and Test Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Packaging and Test Equipment Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Semiconductor Packaging and Test Equipment Market Segment Percentages, by Type, 2022 (%)
Wafer Probe Station
Die Bonder
Dicing Machine
Test handler
Sorter
Global Semiconductor Packaging and Test Equipment Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Semiconductor Packaging and Test Equipment Market Segment Percentages, by Application, 2022 (%)
Integrated Device Manufacturer (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
Global Semiconductor Packaging and Test Equipment Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Semiconductor Packaging and Test Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Packaging and Test Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Semiconductor Packaging and Test Equipment revenues share in global market, 2022 (%)
Key companies Semiconductor Packaging and Test Equipment sales in global market, 2018-2023 (Estimated), (Units)
Key companies Semiconductor Packaging and Test Equipment sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
TEL
DISCO
ASM
Tokyo Seimitsu
Besi
Semes
Cohu, Inc.
Techwing
Kulicke & Soffa Industries
Fasford
Advantest
Hanmi semiconductor
Shinkawa
Shen Zhen Sidea
DIAS Automation
Outline of Major Chapters:
Chapter 1: Introduces the definition of Semiconductor Packaging and Test Equipment, market overview.
Chapter 2: Global Semiconductor Packaging and Test Equipment market size in revenue and volume.
Chapter 3: Detailed analysis of Semiconductor Packaging and Test Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Semiconductor Packaging and Test Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Semiconductor Packaging and Test Equipment capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.