Report overview
Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.
This report aims to provide a comprehensive presentation of the global market for Wafer-level Packaging Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer-level Packaging Equipment. This report contains market size and forecasts of Wafer-level Packaging Equipment in global, including the following market information:
Global Wafer-level Packaging Equipment Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Wafer-level Packaging Equipment Market Sales, 2018-2023, 2024-2029, (K Units)
Global top five Wafer-level Packaging Equipment companies in 2022 (%)
The global Wafer-level Packaging Equipment market was valued at US$ 2676.3 million in 2022 and is projected to reach US$ 4831.3 million by 2029, at a CAGR of 8.8% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global Wafer-level Packaging Equipment key players include Applied Materials, Tokyo Electron, KLA-Tencor Corporation, EV Group, etc. Global top four manufacturers hold a share nearly 60%.
China Taiwan is the largest market, with a share about 30%, followed by China Mainland, and North America, both have a share about 35 percent.
In terms of product, Fan-in WLP is the largest segment, followed by Fan-out WLP, etc.
We surveyed the Wafer-level Packaging Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer-level Packaging Equipment Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Wafer-level Packaging Equipment Market Segment Percentages, by Type, 2022 (%)
Fan In
Fan Out
Others
Global Wafer-level Packaging Equipment Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Wafer-level Packaging Equipment Market Segment Percentages, by Application, 2022 (%)
Integrated Circuit Fabrication Process
Semiconductor Industry
Microelectromechanical Systems (MEMS)
Other
Global Wafer-level Packaging Equipment Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Wafer-level Packaging Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer-level Packaging Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Wafer-level Packaging Equipment revenues share in global market, 2022 (%)
Key companies Wafer-level Packaging Equipment sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Wafer-level Packaging Equipment sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Applied Materials
Tokyo Electron
KLA-Tencor Corporation
EV Group
Tokyo Seimitsu
Disco
SEMES
Suss Microtec
Veeco/CNT
Rudolph Technologies
Outline of Major Chapters:
Chapter 1: Introduces the definition of Wafer-level Packaging Equipment, market overview.
Chapter 2: Global Wafer-level Packaging Equipment market size in revenue and volume.
Chapter 3: Detailed analysis of Wafer-level Packaging Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Wafer-level Packaging Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Wafer-level Packaging Equipment capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
