Report overview
Laser grooving equipment for semiconductor is a kind of machine that through laser scribing, remove the Low-k substances in the wafer saw track and the coating formed by the metal wiring layer in advance, thereby reducing the occurrence of chip defects and improving chip production efficiency in the subsequent blade dicing process.
This report aims to provide a comprehensive presentation of the global market for Laser Grooving Equipment for Semiconductor, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Laser Grooving Equipment for Semiconductor. This report contains market size and forecasts of Laser Grooving Equipment for Semiconductor in global, including the following market information:
Global Laser Grooving Equipment for Semiconductor Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Laser Grooving Equipment for Semiconductor Market Sales, 2018-2023, 2024-2029, (Units)
Global top five Laser Grooving Equipment for Semiconductor companies in 2022 (%)
The global Laser Grooving Equipment for Semiconductor market was valued at US$ 359.8 million in 2022 and is projected to reach US$ 893.4 million by 2029, at a CAGR of 13.9% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global top five manufacturers of laser grooving equipment for semiconductor occupied for a share over 80 percent, key players are DISCO, ASM Laser Separation International (ALSI), EO Technics, Wuhan DR Laser Technology and Delphi Laser etc. Geographically speaking, Japan holds the most of global market share, about 30%. China holds about 25% of share, while North America followed by nearly 20%. In terms of product, the type of 12 Inch is the largest segment, with a share over 45%. And in terms of application, the largest application is semiconductor wafer, which takes nearly 70%.
We surveyed the Laser Grooving Equipment for Semiconductor manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Laser Grooving Equipment for Semiconductor Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Laser Grooving Equipment for Semiconductor Market Segment Percentages, by Type, 2022 (%)
8 Inch
12 Inch
Others
Global Laser Grooving Equipment for Semiconductor Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Laser Grooving Equipment for Semiconductor Market Segment Percentages, by Application, 2022 (%)
Semiconductor Wafer
Solar Cells
Global Laser Grooving Equipment for Semiconductor Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Laser Grooving Equipment for Semiconductor Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Laser Grooving Equipment for Semiconductor revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Laser Grooving Equipment for Semiconductor revenues share in global market, 2022 (%)
Key companies Laser Grooving Equipment for Semiconductor sales in global market, 2018-2023 (Estimated), (Units)
Key companies Laser Grooving Equipment for Semiconductor sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
DISCO
ASMPT
EO Technics
Wuhan Dr Laser Technology
Delphi Laser
Synova
Suzhou Maxwell Technologies
Suzhou Lumi Laser Technology
Han's Laser Technology
Outline of Major Chapters:
Chapter 1: Introduces the definition of Laser Grooving Equipment for Semiconductor, market overview.
Chapter 2: Global Laser Grooving Equipment for Semiconductor market size in revenue and volume.
Chapter 3: Detailed analysis of Laser Grooving Equipment for Semiconductor manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Laser Grooving Equipment for Semiconductor in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Laser Grooving Equipment for Semiconductor capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
