Report overview
A System in a Package (SiP) or system-in-package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked using package on package. The SiP performs all or most of the functions of an electronic system, and is typically used inside a mobile phone, digital music player, etc. Dies containing integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together. A SiP is like a system on a chip (SoC) but less tightly integrated and not on a single semiconductor die.
SiP dies can be stacked vertically or tiled horizontally, unlike less dense multi-chip modules, which place dies horizontally on a carrier. SiP connects the dies with standard off-chip wire bonds or solder bumps, unlike slightly denser three-dimensional integrated circuits which connect stacked silicon dies with conductors running through the die.
The System in a Package (SIP) and 3D Packaging industry can be broken down into several segments, non 3D Packaging, 3D Packaging, etc.
This report aims to provide a comprehensive presentation of the global market for System In a Package (SIP) and 3D Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding System In a Package (SIP) and 3D Packaging. This report contains market size and forecasts of System In a Package (SIP) and 3D Packaging in global, including the following market information:
Global System In a Package (SIP) and 3D Packaging Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global System In a Package (SIP) and 3D Packaging Market Sales, 2018-2023, 2024-2029, (M Pieces)
Global top five System In a Package (SIP) and 3D Packaging companies in 2022 (%)
The global System In a Package (SIP) and 3D Packaging market was valued at US$ 8752.2 million in 2022 and is projected to reach US$ 24000 million by 2029, at a CAGR of 15.5% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The top four global manufacturers of system-level packaging are Amkor, Spil, JCET and ASE, with a combined market share of 57 percent. According to the research study, the Non-3D Packaging type market held a significant share of the of the System in a Package (SIP) and 3D Packaging market. In 2019, the Non-3D Packaging type market accounting for 83% of the global System in a Package (SIP) and 3D Packaging market.
Based on application, the Consumer Electronics segment accounted for significant market share in 2019. Consumer Electronics segment is anticipated to continue to dominate the market during the forecast period.
Asia-Pacific held a key market revenue share of the System in a Package (SIP) and 3D Packaging market in 2019 which account for 59%. The increasing adoption of System in a Package (SIP) and 3D Packaging is expected to offer lucrative opportunities for vendors. In 2019, Amkor, SPIL, JCET ranked top 3 of the revenue share in global market. Leading companies will witness a stable growth in the following five years.
We surveyed the System In a Package (SIP) and 3D Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global System In a Package (SIP) and 3D Packaging Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (M Pieces)
Global System In a Package (SIP) and 3D Packaging Market Segment Percentages, by Type, 2022 (%)
Non 3D Packaging
3D Packaging
Global System In a Package (SIP) and 3D Packaging Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (M Pieces)
Global System In a Package (SIP) and 3D Packaging Market Segment Percentages, by Application, 2022 (%)
Telecommunications
Automotive
Medical Devices
Consumer Electronics
Other
Global System In a Package (SIP) and 3D Packaging Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (M Pieces)
Global System In a Package (SIP) and 3D Packaging Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies System In a Package (SIP) and 3D Packaging revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies System In a Package (SIP) and 3D Packaging revenues share in global market, 2022 (%)
Key companies System In a Package (SIP) and 3D Packaging sales in global market, 2018-2023 (Estimated), (M Pieces)
Key companies System In a Package (SIP) and 3D Packaging sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Amkor
SPIL
JCET
ASE
Powertech Technology Inc
TFME
ams AG
UTAC
Huatian
Nepes
Chipmos
Suzhou Jingfang Semiconductor Technology Co
Outline of Major Chapters:
Chapter 1: Introduces the definition of System In a Package (SIP) and 3D Packaging, market overview.
Chapter 2: Global System In a Package (SIP) and 3D Packaging market size in revenue and volume.
Chapter 3: Detailed analysis of System In a Package (SIP) and 3D Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of System In a Package (SIP) and 3D Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global System In a Package (SIP) and 3D Packaging capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
