Report overview
Silicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding and dot coating stacking technology, TSV can maximize the chip stacking density in three-dimensional direction, reduce the chip size, increase the transistor density of the chip, improve the electrical interconnection performance between layers, improve the chip operation speed, and reduce the power consumption, design difficulty and cost of the chip.
This report aims to provide a comprehensive presentation of the global market for Through-Silicon Vias (TSVs), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through-Silicon Vias (TSVs). This report contains market size and forecasts of Through-Silicon Vias (TSVs) in global, including the following market information:
Global Through-Silicon Vias (TSVs) Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The global Through-Silicon Vias (TSVs) market was valued at US$ 1848.1 million in 2022 and is projected to reach US$ 7357.7 million by 2029, at a CAGR of 21.8% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
At the regional level, Through-Silicon Vias (TSVs) products are mainly sold in North America, Europe and China, among which China accounts for about 24% of the global market in 2019.
Currently, major global suppliers include ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung, Tianshui Huatian Technology, etc. In 2019, These major enterprises account for more than 80% of the total share.
We surveyed the Through-Silicon Vias (TSVs) companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Through-Silicon Vias (TSVs) Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Through-Silicon Vias (TSVs) Market Segment Percentages, by Type, 2022 (%)
2.5D Through-Silicon Vias
3D Through-Silicon Vias
Global Through-Silicon Vias (TSVs) Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Through-Silicon Vias (TSVs) Market Segment Percentages, by Application, 2022 (%)
Mobile And Consumer Electronics
Communication Equipment
Automotive And Transportation Electronics
Global Through-Silicon Vias (TSVs) Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Through-Silicon Vias (TSVs) Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Through-Silicon Vias (TSVs) revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Through-Silicon Vias (TSVs) revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASE Technology Holding
Amkor Technology
Taiwan Semiconductor Manufacturing Company Limited
Intel Corporation
GLOBALFOUNDRIES
JCET Group
Samsung
Tianshui Huatian Technology
Outline of Major Chapters:
Chapter 1: Introduces the definition of Through-Silicon Vias (TSVs), market overview.
Chapter 2: Global Through-Silicon Vias (TSVs) market size in revenue.
Chapter 3: Detailed analysis of Through-Silicon Vias (TSVs) company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Through-Silicon Vias (TSVs) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
