Report overview
Thin Wafers Temporary Bonding Equipment is to closely combine two mirror polished homogeneous or heterogeneous wafers through chemical and physical actions. After wafer bonding, atoms at the interface react under the action of external forces to form a covalent bond, and make the bonding interface reach a specific bonding strength.
This report aims to provide a comprehensive presentation of the global market for Thin Wafers Temporary Bonding Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thin Wafers Temporary Bonding Equipment. This report contains market size and forecasts of Thin Wafers Temporary Bonding Equipment in global, including the following market information:
Global Thin Wafers Temporary Bonding Equipment Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Thin Wafers Temporary Bonding Equipment Market Sales, 2018-2023, 2024-2029, (Units)
Global top five Thin Wafers Temporary Bonding Equipment companies in 2022 (%)
The global Thin Wafers Temporary Bonding Equipment market was valued at US$ 141.8 million in 2022 and is projected to reach US$ 233.2 million by 2029, at a CAGR of 7.4% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The globalThin Wafers Temporary Bonding Equipment consumer market is mainly concentrated in China, Japan, Europe and the United States and other regions. Among them, China's Thin Wafers Temporary Bonding Equipment sales share is the largest, accounting for about 31% of the global market in 2019. Japan accounts for about 24%, while Europe and the United States account for about 14% and 9%.
Thin Wafers Temporary Bonding Equipment can be widely used in MEMS, Advanced Packaging, CMOS and others. The MEMS market is the largest consumer market, accounting for about 35% of the market in 2019. Advanced Packaging is the second largest market, about 31%.
EV group, suss microtec, Tokyo electron, AML, Mitsubishi, Ayumi industry, Smee, etc. EV group is the world's leading enterprise, accounting for 55% of the global revenue in 2019. Suss microtec is the second largest enterprise in the world, accounting for about 21% of the global market.
We surveyed the Thin Wafers Temporary Bonding Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Thin Wafers Temporary Bonding Equipment Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Thin Wafers Temporary Bonding Equipment Market Segment Percentages, by Type, 2022 (%)
Semi-Automatic Bonding Equipment
Fully Automatic Bonding Equipment
Global Thin Wafers Temporary Bonding Equipment Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Thin Wafers Temporary Bonding Equipment Market Segment Percentages, by Application, 2022 (%)
MEMS
Advanced Packaging
CMOS
Global Thin Wafers Temporary Bonding Equipment Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Thin Wafers Temporary Bonding Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Thin Wafers Temporary Bonding Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Thin Wafers Temporary Bonding Equipment revenues share in global market, 2022 (%)
Key companies Thin Wafers Temporary Bonding Equipment sales in global market, 2018-2023 (Estimated), (Units)
Key companies Thin Wafers Temporary Bonding Equipment sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
EV Group
SUSS MicroTec
Tokyo Electron
AML
Mitsubishi
Ayumi Industry
SMEE
Outline of Major Chapters:
Chapter 1: Introduces the definition of Thin Wafers Temporary Bonding Equipment, market overview.
Chapter 2: Global Thin Wafers Temporary Bonding Equipment market size in revenue and volume.
Chapter 3: Detailed analysis of Thin Wafers Temporary Bonding Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Thin Wafers Temporary Bonding Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Thin Wafers Temporary Bonding Equipment capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
