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Alumina DBC (Direct Bond Copper Substrate) Market, Global Outlook and Forecast 2023-2029

Alumina DBC (Direct Bond Copper Substrate) Market, Global Outlook and Forecast 2023-2029

  • Published on : 30 March 2023
  • Pages :119
  • Report Code:SMR-7622465

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Report overview

DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic.
This report studies the Al2O3 DBC ceramic substrate.
This report aims to provide a comprehensive presentation of the global market for Alumina DBC (Direct Bond Copper Substrate), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Alumina DBC (Direct Bond Copper Substrate). This report contains market size and forecasts of Alumina DBC (Direct Bond Copper Substrate) in global, including the following market information:
Global Alumina DBC (Direct Bond Copper Substrate) Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Alumina DBC (Direct Bond Copper Substrate) Market Sales, 2018-2023, 2024-2029, (K Sq.m)
Global top five Alumina DBC (Direct Bond Copper Substrate) companies in 2022 (%)
The global Alumina DBC (Direct Bond Copper Substrate) market was valued at US$ 284.3 million in 2022 and is projected to reach US$ 506.9 million by 2029, at a CAGR of 8.6% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
In global alumina DBC substrate production market,Europe took the main share(about 41%)?South Korea took 29% share.
The global market is dominated by few players, two of the world's largest manufacturers occupy for over 60% of global market share in 2019. Rogers/Curamik is the largest producer.
We surveyed the Alumina DBC (Direct Bond Copper Substrate) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Alumina DBC (Direct Bond Copper Substrate) Market, by Thickness, 2018-2023, 2024-2029 ($ Millions) & (K Sq.m)
Global Alumina DBC (Direct Bond Copper Substrate) Market Segment Percentages, by Thickness, 2022 (%)
0.38mm and Below
Above 0.38mm
Global Alumina DBC (Direct Bond Copper Substrate) Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Sq.m)
Global Alumina DBC (Direct Bond Copper Substrate) Market Segment Percentages, by Application, 2022 (%)
IGBT Module
Others
Global Alumina DBC (Direct Bond Copper Substrate) Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Sq.m)
Global Alumina DBC (Direct Bond Copper Substrate) Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Alumina DBC (Direct Bond Copper Substrate) revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Alumina DBC (Direct Bond Copper Substrate) revenues share in global market, 2022 (%)
Key companies Alumina DBC (Direct Bond Copper Substrate) sales in global market, 2018-2023 (Estimated), (K Sq.m)
Key companies Alumina DBC (Direct Bond Copper Substrate) sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Rogers/Curamik
KCC
Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics)
Heraeus Electronics
Nanjing Zhongjiang New Material Science & Technology
NGK Electronics Devices
Littelfuse IXYS
Remtec
Stellar Industries Corp
Tong Hsing (acquired HCS)
Zibo Linzi Yinhe High-Tech Development
BYD
Shengda Tech
Ecocera
Chengdu Wanshida Ceramic Industry
Outline of Major Chapters:
Chapter 1: Introduces the definition of Alumina DBC (Direct Bond Copper Substrate), market overview.
Chapter 2: Global Alumina DBC (Direct Bond Copper Substrate) market size in revenue and volume.
Chapter 3: Detailed analysis of Alumina DBC (Direct Bond Copper Substrate) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by thickness, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Alumina DBC (Direct Bond Copper Substrate) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Alumina DBC (Direct Bond Copper Substrate) capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.