Report overview
Wafer Slicing Equipment(that is, the Wafer scribing machine) is mainly used for packaging, is the Wafer that contain a lot of chip (Wafer) into one device, a chip particles current industry are mainly composed of mechanical blade, including the main shaft, control system, etc., due to cutting matrix for semiconductor devices, so the product yield and higher control requirements.
This report aims to provide a comprehensive presentation of the global market for Wafer Slicing Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Slicing Equipment. This report contains market size and forecasts of Wafer Slicing Equipment in global, including the following market information:
Global Wafer Slicing Equipment Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Wafer Slicing Equipment Market Sales, 2018-2023, 2024-2029, (Units)
Global top five Wafer Slicing Equipment companies in 2022 (%)
The global Wafer Slicing Equipment market was valued at US$ 898.3 million in 2022 and is projected to reach US$ 1214.4 million by 2029, at a CAGR of 4.4% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global key wafer slicing equipment manufacturers include DISCO, Tokyo Seimitsu etc.The top 1 company hold a share about 60%.Chinese Mainland is the largest market, with a share about 40%, followed by Taiwan, China and South Korea with the share about 27% and 10%.
We surveyed the Wafer Slicing Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Slicing Equipment Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Slicing Equipment Market Segment Percentages, by Type, 2022 (%)
Blade Cutting Machine
Laser Cutting Machine
Global Wafer Slicing Equipment Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Slicing Equipment Market Segment Percentages, by Application, 2022 (%)
Pure Foundry
IDM
OSAT
LED
Photovoltaic
Global Wafer Slicing Equipment Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Slicing Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Slicing Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Wafer Slicing Equipment revenues share in global market, 2022 (%)
Key companies Wafer Slicing Equipment sales in global market, 2018-2023 (Estimated), (Units)
Key companies Wafer Slicing Equipment sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
DISCO
Tokyo Seimitsu
GL Tech Co Ltd
ASM
Synova
CETC Electronics Equipment Group Co., Ltd.
Shenyang Heyan Technology Co., Ltd.
Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
Hi-TESI
Tensun
Outline of Major Chapters:
Chapter 1: Introduces the definition of Wafer Slicing Equipment, market overview.
Chapter 2: Global Wafer Slicing Equipment market size in revenue and volume.
Chapter 3: Detailed analysis of Wafer Slicing Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Wafer Slicing Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Wafer Slicing Equipment capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
