The global Fan-Out Wafer Level Packaging market was valued at US$ 1409.5 million in 2022 and is projected to reach US$ 4829.4 million by 2029, at a CAGR of 19.2% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The Fan-Out WLP technique involves cutting and separating the chip and then embedding the chip inside the panel. The procedure is to attach the chip face down to the Carrier, and the chip spacing should conform to the Pitch specification of the circuit design, while the receiver performs Molding to form a Panel. Follow-up will be separation, sealant panel and a vehicle for sealant panel Wafer shape, also called reconstruct Wafer (Reconstituted Wafer), can be widely used standard Wafer process, need is formed on the sealant panel circuit design. Since the area of the sealing panel is larger than that of the chip, not only can I/O contacts be made into the wafer area by Fan-In method; It can also be Fanned Out on a plastic mold to accommodate more I/O contacts.
This report aims to provide a comprehensive presentation of the global market for Fan-Out Wafer Level Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fan-Out Wafer Level Packaging. This report contains market size and forecasts of Fan-Out Wafer Level Packaging in global, including the following market information:
Global Fan-Out Wafer Level Packaging Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The industry's leading producers are TSMC, ASE Technology Holding Co., and JCET Group, which accounted for 44.97%, 16.03% and 11.81% of revenue in 2019, respectively.
We surveyed the Fan-Out Wafer Level Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Fan-Out Wafer Level Packaging Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Fan-Out Wafer Level Packaging Market Segment Percentages, by Type, 2022 (%)
- High Density Fan-Out Package
- Core Fan-Out Package
Global Fan-Out Wafer Level Packaging Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Fan-Out Wafer Level Packaging Market Segment Percentages, by Application, 2022 (%)
- CMOS Image Sensor
- A Wireless Connection
- Logic and Memory Integrated Circuits
- Mems and Sensors
- Analog and Hybrid Integrated Circuits
- Others
Global Fan-Out Wafer Level Packaging Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Fan-Out Wafer Level Packaging Market Segment Percentages, By Region and Country, 2022 (%)
- North America
- US
- Canada
- Mexico
- Europe
- Germany
- France
- U.K.
- Italy
- Russia
- Nordic Countries
- Benelux
- Rest of Europe
- Asia
- China
- Japan
- South Korea
- Southeast Asia
- India
- Rest of Asia
- South America
- Brazil
- Argentina
- Rest of South America
- Middle East & Africa
- Turkey
- Israel
- Saudi Arabia
- UAE
- Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
- Key companies Fan-Out Wafer Level Packaging revenues in global market, 2018-2023 (estimated), ($ millions)
- Key companies Fan-Out Wafer Level Packaging revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
- TSMC
- ASE Technology Holding Co.
- JCET Group
- Amkor Technology
- Siliconware Technology (SuZhou) Co.
- Nepes
Outline of Major Chapters:
- Chapter 1: Introduces the definition of Fan-Out Wafer Level Packaging, market overview.
- Chapter 2: Global Fan-Out Wafer Level Packaging market size in revenue.
- Chapter 3: Detailed analysis of Fan-Out Wafer Level Packaging company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
- Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
- Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
- Chapter 6: Sales of Fan-Out Wafer Level Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
- Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
- Chapter 8: The main points and conclusions of the report.
