Report overview
This report aims to provide a comprehensive presentation of the global market for PCB Packaging Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding PCB Packaging Materials. This report contains market size and forecasts of PCB Packaging Materials in global, including the following market information:
Global PCB Packaging Materials Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global PCB Packaging Materials Market Sales, 2018-2023, 2024-2029, (Tons)
Global top five PCB Packaging Materials companies in 2022 (%)
The global PCB Packaging Materials market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Metal Packages Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of PCB Packaging Materials include DuPont, Evonik, EPM, Mitsubishi Chemical, Sumitomo Chemical, Mitsui High-tec, Tanaka, Shinko Electric Industries and Panasonic, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the PCB Packaging Materials manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global PCB Packaging Materials Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Tons)
Global PCB Packaging Materials Market Segment Percentages, by Type, 2022 (%)
Metal Packages
Plastic Packages
Ceramic Packages
Global PCB Packaging Materials Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Tons)
Global PCB Packaging Materials Market Segment Percentages, by Application, 2022 (%)
Single Layer Circuit Board
Multilayer Circuit Board
Other
Global PCB Packaging Materials Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Tons)
Global PCB Packaging Materials Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies PCB Packaging Materials revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies PCB Packaging Materials revenues share in global market, 2022 (%)
Key companies PCB Packaging Materials sales in global market, 2018-2023 (Estimated), (Tons)
Key companies PCB Packaging Materials sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
DuPont
Evonik
EPM
Mitsubishi Chemical
Sumitomo Chemical
Mitsui High-tec
Tanaka
Shinko Electric Industries
Panasonic
Hitachi Chemical
Kyocera Chemical
Gore
BASF
Henkel
AMETEK Electronic
Toray
Maruwa
Leatec Fine Ceramics
NCI
Chaozhou Three-Circle
Nippon Micrometal
Toppan
Dai Nippon Printing
Possehl
Ningbo Kangqiang
Outline of Major Chapters:
Chapter 1: Introduces the definition of PCB Packaging Materials, market overview.
Chapter 2: Global PCB Packaging Materials market size in revenue and volume.
Chapter 3: Detailed analysis of PCB Packaging Materials manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of PCB Packaging Materials in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global PCB Packaging Materials capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
