Report overview
IC packaging substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging.
This report aims to provide a comprehensive presentation of the global market for IC Packaging Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging Substrate. This report contains market size and forecasts of IC Packaging Substrate in global, including the following market information:
Global IC Packaging Substrate Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global IC Packaging Substrate Market Sales, 2018-2023, 2024-2029, (K Sqm)
Global top five IC Packaging Substrate companies in 2022 (%)
The global IC Packaging Substrate market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
WB CSP Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of IC Packaging Substrate include Ibiden, Kinsus Interconnect Technology, Unimicron, Shinko Electric Industries, Semco, Simmtech, Nanya, Kyocera and LG Innotek, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the IC Packaging Substrate manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global IC Packaging Substrate Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global IC Packaging Substrate Market Segment Percentages, by Type, 2022 (%)
WB CSP
FC BGA
FC CSP
PBGA
SiP
BOC
Other
Global IC Packaging Substrate Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global IC Packaging Substrate Market Segment Percentages, by Application, 2022 (%)
Smart Phones
PC (Tablet, Laptop)
Wearable Devices
Others
Global IC Packaging Substrate Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global IC Packaging Substrate Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies IC Packaging Substrate revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies IC Packaging Substrate revenues share in global market, 2022 (%)
Key companies IC Packaging Substrate sales in global market, 2018-2023 (Estimated), (K Sqm)
Key companies IC Packaging Substrate sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Ibiden
Kinsus Interconnect Technology
Unimicron
Shinko Electric Industries
Semco
Simmtech
Nanya
Kyocera
LG Innotek
AT&S
ASE
Daeduck
Shennan Circuit
Zhen Ding Technology
KCC (Korea Circuit Company)
ACCESS
Shenzhen Fastprint Circuit Tech
AKM Meadville
Toppan Printing
Outline of Major Chapters:
Chapter 1: Introduces the definition of IC Packaging Substrate, market overview.
Chapter 2: Global IC Packaging Substrate market size in revenue and volume.
Chapter 3: Detailed analysis of IC Packaging Substrate manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of IC Packaging Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global IC Packaging Substrate capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
