Report overview
Advanced Electronic Packaging Materials include electronic packaging and electronic assembly materials. The main types of materials are: potting, encapsulation and plastic packaging materials, ceramics and glass, soldering materials, electroplating and deposition of metal coatings, bonding materials, printed circuit board materials , packaging substrates, adhesives for electronic packaging and assembly, lower fillers and coatings, and thermal management materials, etc. The report mainly studies electronic-grade adhesives and functional film materials.
This report aims to provide a comprehensive presentation of the global market for Advanced Electronic Packaging Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Advanced Electronic Packaging Materials. This report contains market size and forecasts of Advanced Electronic Packaging Materials in global, including the following market information:
Global Advanced Electronic Packaging Materials Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The global Advanced Electronic Packaging Materials market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is to reach $ Million.
Electronic Grade Adhesives Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Advanced Electronic Packaging Materials include Panasonic, Henkel, Shin-Etsu MicroSi, Lord, Nitto, Sumitomo Bakelite, Darbond Technology, Huitian New Material and Crystal Clear Electronic Material, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Advanced Electronic Packaging Materials companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Advanced Electronic Packaging Materials Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Advanced Electronic Packaging Materials Market Segment Percentages, by Type, 2022 (%)
Electronic Grade Adhesives
Functional Film Material
Global Advanced Electronic Packaging Materials Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Advanced Electronic Packaging Materials Market Segment Percentages, by Application, 2022 (%)
Integrated Circuit Packaging
Smart Terminal Packaging
Power Battery
Photovoltaic Cell Packaging
Global Advanced Electronic Packaging Materials Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Advanced Electronic Packaging Materials Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Advanced Electronic Packaging Materials revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Advanced Electronic Packaging Materials revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Panasonic
Henkel
Shin-Etsu MicroSi
Lord
Nitto
Sumitomo Bakelite
Darbond Technology
Huitian New Material
Crystal Clear Electronic Material
Cybrid Technologies
Suzhou Shihua Technology
Outline of Major Chapters:
Chapter 1: Introduces the definition of Advanced Electronic Packaging Materials, market overview.
Chapter 2: Global Advanced Electronic Packaging Materials market size in revenue.
Chapter 3: Detailed analysis of Advanced Electronic Packaging Materials company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Advanced Electronic Packaging Materials in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
