Report overview
Copper pillars are terminals used to ?flip-chip? IC chips to a substrate in a semiconductor package by TCFC (Thermal Compression Flip-Chip) technology. Copper pillars are formed on aluminum electrode pads of an IC chip. Copper pillar interconnects are seeing higher demand due to an increase in pin count with fine pad pitches integrated on an IC chip.
Copper pillars with dimensional uniformity can be formed on a silicon wafer by using fine plating pattern forming technology.
This report aims to provide a comprehensive presentation of the global market for Copper Pillar Bump (CPB), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Copper Pillar Bump (CPB). This report contains market size and forecasts of Copper Pillar Bump (CPB) in global, including the following market information:
Global Copper Pillar Bump (CPB) Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Copper Pillar Bump (CPB) Market Sales, 2018-2023, 2024-2029, (Million Units)
Global top five Copper Pillar Bump (CPB) companies in 2022 (%)
The global Copper Pillar Bump (CPB) market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Cu Bar Type Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Copper Pillar Bump (CPB) include Intel, Samsung, LB Semicon Inc, DuPont, FINECS, Amkor Technology, SHINKO ELECTRIC INDUSTRIES, ASE and Raytek Semiconductor,Inc., etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Copper Pillar Bump (CPB) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Copper Pillar Bump (CPB) Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Million Units)
Global Copper Pillar Bump (CPB) Market Segment Percentages, by Type, 2022 (%)
Cu Bar Type
Standard Cu Pillar
Fine pitch Cu Pillar
Micro-bumps
Others
Global Copper Pillar Bump (CPB) Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Million Units)
Global Copper Pillar Bump (CPB) Market Segment Percentages, by Application, 2022 (%)
12 Inches (300 mm)
8 Inches (200 mm)
Others
Global Copper Pillar Bump (CPB) Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Million Units)
Global Copper Pillar Bump (CPB) Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Copper Pillar Bump (CPB) revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Copper Pillar Bump (CPB) revenues share in global market, 2022 (%)
Key companies Copper Pillar Bump (CPB) sales in global market, 2018-2023 (Estimated), (Million Units)
Key companies Copper Pillar Bump (CPB) sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Intel
Samsung
LB Semicon Inc
DuPont
FINECS
Amkor Technology
SHINKO ELECTRIC INDUSTRIES
ASE
Raytek Semiconductor,Inc.
Winstek Semiconductor
Nepes
JiangYin ChangDian Advanced Packaging
sj company co., LTD.
SJ Semiconductor Co
Chipbond
Chip More
ChipMOS
Shenzhen Tongxingda Technology
MacDermid Alpha Electronics
Jiangsu CAS Microelectronics Integration
Tianshui Huatian Technology
JCET Group
Unisem Group
Powertech Technology Inc.
SFA Semicon
International Micro Industries
Outline of Major Chapters:
Chapter 1: Introduces the definition of Copper Pillar Bump (CPB), market overview.
Chapter 2: Global Copper Pillar Bump (CPB) market size in revenue and volume.
Chapter 3: Detailed analysis of Copper Pillar Bump (CPB) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Copper Pillar Bump (CPB) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Copper Pillar Bump (CPB) capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
