Report overview
This report aims to provide a comprehensive presentation of the global market for Wafer Grinder (Wafer Thinning Equipment), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Grinder (Wafer Thinning Equipment). This report contains market size and forecasts of Wafer Grinder (Wafer Thinning Equipment) in global, including the following market information:
Global Wafer Grinder (Wafer Thinning Equipment) Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Wafer Grinder (Wafer Thinning Equipment) Market Sales, 2018-2023, 2024-2029, (Units)
Global top five Wafer Grinder (Wafer Thinning Equipment) companies in 2022 (%)
The global Wafer Grinder (Wafer Thinning Equipment) market was valued at US$ 705.3 million in 2022 and is projected to reach US$ 1140 million by 2029, at a CAGR of 7.1% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global key players of wafer grinder (wafer thinning equipment) include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, etc. Global top three manufacturers hold a share over 84%. Japan is the largest producer of wafer grinder (wafer thinning equipment) holds a share over 57%. In terms of product, full automatic is the largest segment, with a share over 68%. And in terms of application, the largest application is 300 mm wafer, with a share over 78%.
We surveyed the Wafer Grinder (Wafer Thinning Equipment) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Grinder (Wafer Thinning Equipment) Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Grinder (Wafer Thinning Equipment) Market Segment Percentages, by Type, 2022 (%)
Full Automatic
Semi Automatic
Global Wafer Grinder (Wafer Thinning Equipment) Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Grinder (Wafer Thinning Equipment) Market Segment Percentages, by Application, 2022 (%)
200 mm Wafer
300 mm Wafer
Others
Global Wafer Grinder (Wafer Thinning Equipment) Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Grinder (Wafer Thinning Equipment) Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Grinder (Wafer Thinning Equipment) revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Wafer Grinder (Wafer Thinning Equipment) revenues share in global market, 2022 (%)
Key companies Wafer Grinder (Wafer Thinning Equipment) sales in global market, 2018-2023 (Estimated), (Units)
Key companies Wafer Grinder (Wafer Thinning Equipment) sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
Daitron
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
Outline of Major Chapters:
Chapter 1: Introduces the definition of Wafer Grinder (Wafer Thinning Equipment), market overview.
Chapter 2: Global Wafer Grinder (Wafer Thinning Equipment) market size in revenue and volume.
Chapter 3: Detailed analysis of Wafer Grinder (Wafer Thinning Equipment) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Wafer Grinder (Wafer Thinning Equipment) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Wafer Grinder (Wafer Thinning Equipment) capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
