Report overview
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
This report aims to provide a comprehensive presentation of the global market for Solder Ball Packaging Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solder Ball Packaging Material. This report contains market size and forecasts of Solder Ball Packaging Material in global, including the following market information:
Global Solder Ball Packaging Material Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Solder Ball Packaging Material Market Sales, 2018-2023, 2024-2029, (Million Units)
Global top five Solder Ball Packaging Material companies in 2022 (%)
The global Solder Ball Packaging Material market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Lead Solder Ball Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Solder Ball Packaging Material include Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material and Shenmao Technology, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Solder Ball Packaging Material manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Solder Ball Packaging Material Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Million Units)
Global Solder Ball Packaging Material Market Segment Percentages, by Type, 2022 (%)
Lead Solder Ball
Lead Free Solder Ball
Global Solder Ball Packaging Material Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Million Units)
Global Solder Ball Packaging Material Market Segment Percentages, by Application, 2022 (%)
BGA
CSP & WLCSP
Flip-Chip & Others
Global Solder Ball Packaging Material Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Million Units)
Global Solder Ball Packaging Material Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Solder Ball Packaging Material revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Solder Ball Packaging Material revenues share in global market, 2022 (%)
Key companies Solder Ball Packaging Material sales in global market, 2018-2023 (Estimated), (Million Units)
Key companies Solder Ball Packaging Material sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Indium Corporation
Jovy Systems
Outline of Major Chapters:
Chapter 1: Introduces the definition of Solder Ball Packaging Material, market overview.
Chapter 2: Global Solder Ball Packaging Material market size in revenue and volume.
Chapter 3: Detailed analysis of Solder Ball Packaging Material manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Solder Ball Packaging Material in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Solder Ball Packaging Material capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
