Report overview
Semiconductor packaging and assembly equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Assembly & Packaging Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Assembly & Packaging Equipment. This report contains market size and forecasts of Semiconductor Assembly & Packaging Equipment in global, including the following market information:
Global Semiconductor Assembly & Packaging Equipment Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Semiconductor Assembly & Packaging Equipment Market Sales, 2018-2023, 2024-2029, (Unit)
Global top five Semiconductor Assembly & Packaging Equipment companies in 2022 (%)
The global Semiconductor Assembly & Packaging Equipment market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The increase in application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment. The growth in complexity of semiconductor IC designs majorly drives the market. Recently, it has been observed that there is an increase in the need for semiconductor ICs that can perform multiple functions. Consequently, vendors have developed semiconductor ICs with complex architecture to address the rise in need for multi-functional ICs. The development of complex semiconductor ICs is a critical factor that impels the market growth during the forecast period.
We surveyed the Semiconductor Assembly & Packaging Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Assembly & Packaging Equipment Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Unit)
Global Semiconductor Assembly & Packaging Equipment Market Segment Percentages, by Type, 2022 (%)
Die Bonders
Wire Bonders
Packaging Equipment
Others
Global Semiconductor Assembly & Packaging Equipment Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Unit)
Global Semiconductor Assembly & Packaging Equipment Market Segment Percentages, by Application, 2022 (%)
IDMs
OSAT
Global Semiconductor Assembly & Packaging Equipment Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Unit)
Global Semiconductor Assembly & Packaging Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Assembly & Packaging Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Semiconductor Assembly & Packaging Equipment revenues share in global market, 2022 (%)
Key companies Semiconductor Assembly & Packaging Equipment sales in global market, 2018-2023 (Estimated), (Unit)
Key companies Semiconductor Assembly & Packaging Equipment sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASM Pacific Technology
Kulicke & Soffa Industries
Besi
Accrutech
Shinkawa
Palomar Technologies
Hesse Mechatronics
Toray Engineering
West Bond
HYBOND
DIAS Automation
Outline of Major Chapters:
Chapter 1: Introduces the definition of Semiconductor Assembly & Packaging Equipment, market overview.
Chapter 2: Global Semiconductor Assembly & Packaging Equipment market size in revenue and volume.
Chapter 3: Detailed analysis of Semiconductor Assembly & Packaging Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Semiconductor Assembly & Packaging Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Semiconductor Assembly & Packaging Equipment capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
