Report overview
FOWLP is a chip packaging technology that is used to package an IC, while the IC is still part of the wafer.
This report aims to provide a comprehensive presentation of the global market for Fan-out Wafer Level Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fan-out Wafer Level Packaging. This report contains market size and forecasts of Fan-out Wafer Level Packaging in global, including the following market information:
Global Fan-out Wafer Level Packaging Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The global Fan-out Wafer Level Packaging market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
In terms of geography, APAC led the global FOWLP market. According to analysts, the region will continue to dominate this market during the forecast period as well and this will mainly attribute to the presence of major semiconductor industries in the region.
We surveyed the Fan-out Wafer Level Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Fan-out Wafer Level Packaging Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Fan-out Wafer Level Packaging Market Segment Percentages, by Type, 2022 (%)
200mm Wafer Level Packaging
300mm Wafer Level Packaging
Other
Global Fan-out Wafer Level Packaging Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Fan-out Wafer Level Packaging Market Segment Percentages, by Application, 2022 (%)
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC
Other
Global Fan-out Wafer Level Packaging Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Fan-out Wafer Level Packaging Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Fan-out Wafer Level Packaging revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Fan-out Wafer Level Packaging revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
STATS ChipPAC
TSMC
Texas Instruments
Rudolph Technologies
SEMES
SUSS MicroTec
STMicroelectronics
Veeco/CNT
Outline of Major Chapters:
Chapter 1: Introduces the definition of Fan-out Wafer Level Packaging, market overview.
Chapter 2: Global Fan-out Wafer Level Packaging market size in revenue.
Chapter 3: Detailed analysis of Fan-out Wafer Level Packaging company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Fan-out Wafer Level Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
