Through-Hole Electronics Packaging is the process by which the component leads are packed into the drilled holes on a bare printed circuit board. The Through-Hole Electronics Packaging offers number of advantages such as high-reliability, easy to solder/desolder and test and others. It also provides interconnections between upper and lower layers (vias) in non-plated hole technologies.
This report aims to provide a comprehensive presentation of the global market for Through-Hole Electronics Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through-Hole Electronics Packaging. This report contains market size and forecasts of Through-Hole Electronics Packaging in global, including the following market information:
- Global Through-Hole Electronics Packaging Market Revenue, 2018-2023, 2024-2029, ($ millions)
- Global Through-Hole Electronics Packaging Market Sales, 2018-2023, 2024-2029, (K Units)
Global top five Through-Hole Electronics Packaging companies in 2022 (%)
The global Through-Hole Electronics Packaging market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Plastic Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Through-Hole Electronics Packaging include AMETEK, Inc., Dordan Mfg, Dupont, Osram, The Plastiform Company, Kiva Container, Primex Plastics Corporation., Quality Foam Packaging Inc and Ameson Packaging, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
we surveyed the Through-Hole Electronics Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Through-Hole Electronics Packaging Market, by Material Type, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Through-Hole Electronics Packaging Market Segment Percentages, by Material Type, 2022 (%)
- Plastic
- Metal
- Glass
- Others
Global Through-Hole Electronics Packaging Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Through-Hole Electronics Packaging Market Segment Percentages, by Application, 2022 (%)
- Consumer Electronics
- Aerospace and Defense
- Automotive
- Telecommunications
- Others
Global Through-Hole Electronics Packaging Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Through-Hole Electronics Packaging Market Segment Percentages, By Region and Country, 2022 (%)
- North America
- US
- Canada
- Mexico
- Europe
- Germany
- France
- U.K.
- Italy
- Russia
- Nordic Countries
- Benelux
- Rest of Europe
- Asia
- China
- Japan
- South Korea
- Southeast Asia
- India
- Rest of Asia
- South America
- Brazil
- Argentina
- Rest of South America
- Middle East & Africa
- Turkey
- Israel
- Saudi Arabia
- UAE
- Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
- Key companies Through-Hole Electronics Packaging revenues in global market, 2018-2023 (Estimated), ($ millions)
- Key companies Through-Hole Electronics Packaging revenues share in global market, 2022 (%)
- Key companies Through-Hole Electronics Packaging sales in global market, 2018-2023 (Estimated), (K Units)
- Key companies Through-Hole Electronics Packaging sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
- AMETEK, Inc.
- Dordan Mfg
- Dupont
- Osram
- The Plastiform Company
- Kiva Container
- Primex Plastics Corporation.
- Quality Foam Packaging Inc
- Ameson Packaging
- Lithoflex, Inc.
- UFP Technologies
- Intel Corporation
- STMicroelectronics
- Advanced Micro Devices, Inc
- SAMSUNG
- GY Packaging
- Taiwan Semiconductor
- Outline of Major Chapters:
- Chapter 1: Introduces the definition of Through-Hole Electronics Packaging, market overview.
- Chapter 2: Global Through-Hole Electronics Packaging market size in revenue and volume.
- Chapter 3: Detailed analysis of Through-Hole Electronics Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
- Chapter 4: Provides the analysis of various market segments by material type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
- Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
- Chapter 6: Sales of Through-Hole Electronics Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
- Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
- Chapter 8: Global Through-Hole Electronics Packaging capacity by region & country.
- Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
- Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
- Chapter 11: The main points and conclusions of the report.
