Report overview
Radiation hardening is a technique of making electronics and semiconductors devices resistant to damage caused by radiation. Radiation hardened devices are primarily used in high altitude applications where radiation could damage functioning of electronic components. Radiation tolerant components are employed in satellite system power supply, switching regulators, and microprocessors in military and space applications. The prevention of gamma radiation and neutron radiation caused by nuclear reactors is possible due to radiation hardened components.
This report aims to provide a comprehensive presentation of the global market for Radiation Hardened Electronics and Semiconductors, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Radiation Hardened Electronics and Semiconductors. This report contains market size and forecasts of Radiation Hardened Electronics and Semiconductors in global, including the following market information:
Global Radiation Hardened Electronics and Semiconductors Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The global Radiation Hardened Electronics and Semiconductors market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is to reach $ Million.
Processors & Controllers Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Radiation Hardened Electronics and Semiconductors include Honeywell Aerospace, BAE Systems, Microchip Technology, Xilinx Incorporation, Texas Instruments, Maxwell Technologies, Intersil Corporation, Atmel Corporation and Analog Devices Corporation, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Radiation Hardened Electronics and Semiconductors companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Radiation Hardened Electronics and Semiconductors Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Radiation Hardened Electronics and Semiconductors Market Segment Percentages, by Type, 2022 (%)
Processors & Controllers
Power Management
ASICs
FPGAs
Other
Global Radiation Hardened Electronics and Semiconductors Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Radiation Hardened Electronics and Semiconductors Market Segment Percentages, by Application, 2022 (%)
Aerospace & Defense
Space
Global Radiation Hardened Electronics and Semiconductors Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Radiation Hardened Electronics and Semiconductors Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Radiation Hardened Electronics and Semiconductors revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Radiation Hardened Electronics and Semiconductors revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Honeywell Aerospace
BAE Systems
Microchip Technology
Xilinx Incorporation
Texas Instruments
Maxwell Technologies
Intersil Corporation
Atmel Corporation
Analog Devices Corporation
ST Microelectronics
Outline of Major Chapters:
Chapter 1: Introduces the definition of Radiation Hardened Electronics and Semiconductors, market overview.
Chapter 2: Global Radiation Hardened Electronics and Semiconductors market size in revenue.
Chapter 3: Detailed analysis of Radiation Hardened Electronics and Semiconductors company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Radiation Hardened Electronics and Semiconductors in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
