Report overview
LED is the acronym of Light Emitting Diode. It is a kind of semiconductor device that is commonly used in indicator light and display board. LED is capable of transforming electric energy into light energy directly in high efficiency and its life-span can reach as long as tens of thousands hours to one hundred thousand hours. Compared to traditional bulbs, LED also bears the advantages of non-friable and power-saving and so on.
This report aims to provide a comprehensive presentation of the global market for Light Emitting Diode Packaging Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Light Emitting Diode Packaging Equipment. This report contains market size and forecasts of Light Emitting Diode Packaging Equipment in global, including the following market information:
Global Light Emitting Diode Packaging Equipment Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Light Emitting Diode Packaging Equipment Market Sales, 2018-2023, 2024-2029, (K Units)
Global top five Light Emitting Diode Packaging Equipment companies in 2022 (%)
The global Light Emitting Diode Packaging Equipment market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The requirements for LED packaging are strict. It is essential to use high-precision crystal solid machine to package no matter Lamp-LED or Surface Mount Device LED (SMD-LED). If LED chips were not placed into the package precisely, the luminescence efficiency of the overall packaging device will be influenced directly. Any deviation from the established position will prevent LED light to be reflected fully from the reflective cup, affecting LED?s brightness. So an advanced crystal solid machine with a PR System should be used in order to weld LED chips into the package precisely, without considering the quality of the lead frame. LEDs applied in different occasions and LEDs with different sizes, heat-dissipation methods and luminescence efficiency will have different types of LED packages. Currently, LED packages can be divided into the following types: Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED, Flip Chip-LED and so on.
We surveyed the Light Emitting Diode Packaging Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Light Emitting Diode Packaging Equipment Market, by Technology, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Light Emitting Diode Packaging Equipment Market Segment Percentages, by Technology, 2022 (%)
Die Singulation
Die Attached
LED Testing
Permanent Bonding
Substrate Separation
Global Light Emitting Diode Packaging Equipment Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Light Emitting Diode Packaging Equipment Market Segment Percentages, by Application, 2022 (%)
General Lighting
Flash Lighting
Automotive
Others
Global Light Emitting Diode Packaging Equipment Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Light Emitting Diode Packaging Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Light Emitting Diode Packaging Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Light Emitting Diode Packaging Equipment revenues share in global market, 2022 (%)
Key companies Light Emitting Diode Packaging Equipment sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Light Emitting Diode Packaging Equipment sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASM Pacific Tech
BESI
Kulicke & Soffa
Palomar Technologies
Towa
Daitron
Disco
Nordson Asymtek
Suss Microtec
Outline of Major Chapters:
Chapter 1: Introduces the definition of Light Emitting Diode Packaging Equipment, market overview.
Chapter 2: Global Light Emitting Diode Packaging Equipment market size in revenue and volume.
Chapter 3: Detailed analysis of Light Emitting Diode Packaging Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by technology, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Light Emitting Diode Packaging Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Light Emitting Diode Packaging Equipment capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
