Report overview
Semiconductor Assembly and Packaging Equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Assembly and Packaging Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Assembly and Packaging Equipment. This report contains market size and forecasts of Semiconductor Assembly and Packaging Equipment in global, including the following market information:
Global Semiconductor Assembly and Packaging Equipment Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The global Semiconductor Assembly and Packaging Equipment market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is to reach $ Million.
Electroplating Equipment Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Semiconductor Assembly and Packaging Equipment include Advantest, Accrutech, Shinkawa, KLA-Tencor, Teradyne Inc., Amkor Technology, Tokyo Electron Limited, Lam Research Corporation and ASML Holding N.V, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Semiconductor Assembly and Packaging Equipment companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Assembly and Packaging Equipment Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Semiconductor Assembly and Packaging Equipment Market Segment Percentages, by Type, 2022 (%)
Electroplating Equipment
Inspection and Cutting Equipment
Lead Bonding Equipment
Chip Bonding Equipment
Others
Global Semiconductor Assembly and Packaging Equipment Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Semiconductor Assembly and Packaging Equipment Market Segment Percentages, by Application, 2022 (%)
Automotive
Enterprise Storage
Consumer Electronics
Healthcare Devices
Others
Global Semiconductor Assembly and Packaging Equipment Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Semiconductor Assembly and Packaging Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Assembly and Packaging Equipment revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Semiconductor Assembly and Packaging Equipment revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Advantest
Accrutech
Shinkawa
KLA-Tencor
Teradyne Inc.
Amkor Technology
Tokyo Electron Limited
Lam Research Corporation
ASML Holding N.V
Applied Materials
Toray Engineering
Kulicke & Soffa Industries
Hesse Mechatronics
Palomar Technologies
West Bond
DIAS Automation
Screen Holdings Co. Ltd
Hitachi High-Technologies Corporation
HYBONDASM Pacific Technology
Outline of Major Chapters:
Chapter 1: Introduces the definition of Semiconductor Assembly and Packaging Equipment, market overview.
Chapter 2: Global Semiconductor Assembly and Packaging Equipment market size in revenue.
Chapter 3: Detailed analysis of Semiconductor Assembly and Packaging Equipment company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Semiconductor Assembly and Packaging Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
