Download Free Sample Report

Direct Bonded Copper Substrate Market, Global Outlook and Forecast 2023-2029

Direct Bonded Copper Substrate Market, Global Outlook and Forecast 2023-2029

  • Published on : 09 July 2023
  • Pages :71
  • Report Code:SMR-7750853

Download Report PDF Instantly

Leave This Empty:

Secure

Report overview

The global Direct Bonded Copper Substrate market was valued at US$ 284.3 million in 2022 and is projected to reach US$ 506.9 million by 2029, at a CAGR of 8.6% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic.
This report studies the Al2O3 DBC ceramic substrate.
This report aims to provide a comprehensive presentation of the global market for Direct Bonded Copper Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Direct Bonded Copper Substrate. This report contains market size and forecasts of Direct Bonded Copper Substrate in global, including the following market information:
Global Direct Bonded Copper Substrate Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Direct Bonded Copper Substrate Market Sales, 2018-2023, 2024-2029, (K Sqm)

Global top five Direct Bonded Copper Substrate companies in 2022 (%)
In global alumina DBC substrate production market,Europe took the main share(about 41%)South Korea took 29% share.
The global market is dominated by few players, two of the world's largest manufacturers occupy for over 60% of global market share in 2019. Rogers/Curamik is the largest producer.
We surveyed the Direct Bonded Copper Substrate manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:

Global Direct Bonded Copper Substrate Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global Direct Bonded Copper Substrate Market Segment Percentages, by Type, 2022 (%)
  • AlN DBC Ceramic Substrate
  • Al2O3 DBC Ceramic Substrate
Global Direct Bonded Copper Substrate Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global Direct Bonded Copper Substrate Market Segment Percentages, by Application, 2022 (%)
  • IGBT Modules
  • Automotive
  • Home Appliances and CPV
  • Aerospace and Others
Global Direct Bonded Copper Substrate Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global Direct Bonded Copper Substrate Market Segment Percentages, By Region and Country, 2022 (%)
  • North America
  • US
  • Canada
  • Mexico
  • Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Russia
  • Nordic Countries
  • Benelux
  • Rest of Europe
  • Asia
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Rest of Asia
  • South America
  • Brazil
  • Argentina
  • Rest of South America
  • Middle East & Africa
  • Turkey
  • Israel
  • Saudi Arabia
  • UAE
  • Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
  • Key companies Direct Bonded Copper Substrate revenues in global market, 2018-2023 (Estimated), ($ millions)
  • Key companies Direct Bonded Copper Substrate revenues share in global market, 2022 (%)
  • Key companies Direct Bonded Copper Substrate sales in global market, 2018-2023 (Estimated), (K Sqm)
  • Key companies Direct Bonded Copper Substrate sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
  • Rogers/Curamik
  • KCC
  • Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics)
  • Heraeus Electronics
  • Nanjing Zhongjiang New Material Science & Technology
  • NGK Electronics Devices
  • Littelfuse IXYS
  • Remtec
  • Stellar Industries Corp
  • Tong Hsing (acquired HCS)
  • Zibo Linzi Yinhe High-Tech Development
Outline of Major Chapters:
  • Chapter 1: Introduces the definition of Direct Bonded Copper Substrate, market overview.
  • Chapter 2: Global Direct Bonded Copper Substrate market size in revenue and volume.
  • Chapter 3: Detailed analysis of Direct Bonded Copper Substrate manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 6: Sales of Direct Bonded Copper Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Global Direct Bonded Copper Substrate capacity by region & country.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 11: The main points and conclusions of the report.