Report overview
The underfill adhesive is a kind of chemical glue (the main component is epoxy resin) to fill the bottom of the BGA packaging mode chip, using the curing form of heating, the BGA bottom void area (general cover general cover more than 80%) to fill, so as to achieve the purpose of reinforcement.
This report aims to provide a comprehensive presentation of the global market for Underfill Adhesives, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Underfill Adhesives. This report contains market size and forecasts of Underfill Adhesives in global, including the following market information:
Global Underfill Adhesives Market Revenue, 2018-2023, 2024-2030, ($ millions)
Global Underfill Adhesives Market Sales, 2018-2023, 2024-2030, (MT)
Global top five Underfill Adhesives companies in 2022 (%)
The global Underfill Adhesives market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Single Component Underfill Adhesives Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Underfill Adhesives include Panacol, Buhnen, Henkel, Epoxy International, Lord Corporation, Panasonic, Master Bond, AI Technology and Darbond Technology, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Underfill Adhesives manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Underfill Adhesives Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (MT)
Global Underfill Adhesives Market Segment Percentages, by Type, 2022 (%)
Single Component Underfill Adhesives
Two-Component Underfill Adhesives
Global Underfill Adhesives Market, by Application, 2018-2023, 2024-2030 ($ Millions) & (MT)
Global Underfill Adhesives Market Segment Percentages, by Application, 2022 (%)
Ball Grid Arrays
Chip Scale Packaging
Land Grid Arrays
Global Underfill Adhesives Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions) & (MT)
Global Underfill Adhesives Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Underfill Adhesives revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Underfill Adhesives revenues share in global market, 2022 (%)
Key companies Underfill Adhesives sales in global market, 2018-2023 (Estimated), (MT)
Key companies Underfill Adhesives sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Panacol
Buhnen
Henkel
Epoxy International
Lord Corporation
Panasonic
Master Bond
AI Technology
Darbond Technology
Outline of Major Chapters:
Chapter 1: Introduces the definition of Underfill Adhesives, market overview.
Chapter 2: Global Underfill Adhesives market size in revenue and volume.
Chapter 3: Detailed analysis of Underfill Adhesives manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Underfill Adhesives in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Underfill Adhesives capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
