Report overview
Thermal interface material is a kind of material applied between power devices and electronic radiators. It is mainly used to fill the micro voids and uneven holes on the surface caused by the connection or contact between the two materials to improve the heat dissipation performance.
This report aims to provide a comprehensive presentation of the global market for Thermal Interface Materials for Electronics Cooling, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thermal Interface Materials for Electronics Cooling. This report contains market size and forecasts of Thermal Interface Materials for Electronics Cooling in global, including the following market information:
Global Thermal Interface Materials for Electronics Cooling Market Revenue, 2018-2023, 2024-2032, ($ millions)
Global Thermal Interface Materials for Electronics Cooling Market Sales, 2018-2023, 2024-2032, (Ton)
Global top five Thermal Interface Materials for Electronics Cooling companies in 2022 (%)
The global Thermal Interface Materials for Electronics Cooling market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global Thermal Interface Materials key players are mainly located in US, Europe and Japan, like Dow, Panasonic, Parker Hannifin, Shin-Etsu Chemical, Laird, Henkel, Fujipoly, Tanyuan Technology and DuPont, etc. Global top five players hold a share nearly 40 percent.
We surveyed the Thermal Interface Materials for Electronics Cooling manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Thermal Interface Materials for Electronics Cooling Market, by Type, 2018-2023, 2024-2032 ($ Millions) & (Ton)
Global Thermal Interface Materials for Electronics Cooling Market Segment Percentages, by Type, 2022 (%)
Greases
Elastomeric Pads
Thermal Tapes
Phase Change Materials
Other
Global Thermal Interface Materials for Electronics Cooling Market, by Application, 2018-2023, 2024-2032 ($ Millions) & (Ton)
Global Thermal Interface Materials for Electronics Cooling Market Segment Percentages, by Application, 2022 (%)
Electronics
Power Devices
Others
Global Thermal Interface Materials for Electronics Cooling Market, By Region and Country, 2018-2023, 2024-2032 ($ Millions) & (Ton)
Global Thermal Interface Materials for Electronics Cooling Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Thermal Interface Materials for Electronics Cooling revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Thermal Interface Materials for Electronics Cooling revenues share in global market, 2022 (%)
Key companies Thermal Interface Materials for Electronics Cooling sales in global market, 2018-2023 (Estimated), (Ton)
Key companies Thermal Interface Materials for Electronics Cooling sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Dow
Panasonic
Parker Hannifin
Shin-Etsu Chemical
Laird
Henkel
Fujipoly
DuPont
Aavid (Boyd Corporation)
3M
Wacker
H.B. Fuller Company
Denka Company Limited
Dexerials Corporation
Tanyuan Technology
Jones Tech PLC
Shenzhen FRD Science & Technology
Outline of Major Chapters:
Chapter 1: Introduces the definition of Thermal Interface Materials for Electronics Cooling, market overview.
Chapter 2: Global Thermal Interface Materials for Electronics Cooling market size in revenue and volume.
Chapter 3: Detailed analysis of Thermal Interface Materials for Electronics Cooling manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Thermal Interface Materials for Electronics Cooling in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Thermal Interface Materials for Electronics Cooling capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
