Report overview
Thermal Pad (also called thermally conductive pad or thermal interface pad) are a preformed square or rectangle of solid material (often silicone based) commonly used underside of the heatsink to aid the conduction of heat away from the component being cooled (such as CPU or another chip) and into the heatsink.
This report aims to provide a comprehensive presentation of the global market for Thermal Putty Pads, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thermal Putty Pads. This report contains market size and forecasts of Thermal Putty Pads in global, including the following market information:
Global Thermal Putty Pads Market Revenue, 2018-2023, 2024-2032, ($ millions)
Global Thermal Putty Pads Market Sales, 2018-2023, 2024-2032, (K Units)
Global top five Thermal Putty Pads companies in 2022 (%)
The global Thermal Putty Pads market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
PG25A Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Thermal Putty Pads include Henkel Adhesives, Caplinq, Honeywell, Graco Inc., Nagelstudio EverGreen, SZTensan and OSCO Ltd, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Thermal Putty Pads manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Thermal Putty Pads Market, by Type, 2018-2023, 2024-2032 ($ Millions) & (K Units)
Global Thermal Putty Pads Market Segment Percentages, by Type, 2022 (%)
PG25A
PG45A
PG80A
XR-PG130A
Global Thermal Putty Pads Market, by Application, 2018-2023, 2024-2032 ($ Millions) & (K Units)
Global Thermal Putty Pads Market Segment Percentages, by Application, 2022 (%)
Electronic
Machinery
Others
Global Thermal Putty Pads Market, By Region and Country, 2018-2023, 2024-2032 ($ Millions) & (K Units)
Global Thermal Putty Pads Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Thermal Putty Pads revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Thermal Putty Pads revenues share in global market, 2022 (%)
Key companies Thermal Putty Pads sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Thermal Putty Pads sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Henkel Adhesives
Caplinq
Honeywell
Graco Inc.
Nagelstudio EverGreen
SZTensan
OSCO Ltd
Outline of Major Chapters:
Chapter 1: Introduces the definition of Thermal Putty Pads, market overview.
Chapter 2: Global Thermal Putty Pads market size in revenue and volume.
Chapter 3: Detailed analysis of Thermal Putty Pads manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Thermal Putty Pads in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Thermal Putty Pads capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
