Report overview
Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and packaging process.
This report aims to provide a comprehensive presentation of the global market for Wire Bonder Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wire Bonder Equipment. This report contains market size and forecasts of Wire Bonder Equipment in global, including the following market information:
Global Wire Bonder Equipment Market Revenue, 2018-2023, 2024-2030, ($ millions)
Global Wire Bonder Equipment Market Sales, 2018-2023, 2024-2030, (Units)
Global top five Wire Bonder Equipment companies in 2022 (%)
The global Wire Bonder Equipment market was valued at US$ 1048.4 million in 2022 and is projected to reach US$ 1157.7 million by 2029, at a CAGR of 1.4% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
According to the report, one of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is characterized by relationship-based sales. The selling price of such equipment is usually in the range of $100,000-$1,000,000. Therefore, manufacturers look to develop long-standing relations with customers buying their product offerings. The outlook of building such relations is to ensure repeat purchases by offering discounts and incentives for future orders. This is mostly practiced on those customers who account for around 5-10% of the equipment manufacturers sales.
We surveyed the Wire Bonder Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wire Bonder Equipment Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (Units)
Global Wire Bonder Equipment Market Segment Percentages, by Type, 2022 (%)
Ball Bonders
Stud-Bump Bonders
Others
Global Wire Bonder Equipment Market, by Application, 2018-2023, 2024-2030 ($ Millions) & (Units)
Global Wire Bonder Equipment Market Segment Percentages, by Application, 2022 (%)
Industrial
Manufacture
Others
Global Wire Bonder Equipment Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions) & (Units)
Global Wire Bonder Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wire Bonder Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Wire Bonder Equipment revenues share in global market, 2022 (%)
Key companies Wire Bonder Equipment sales in global market, 2018-2023 (Estimated), (Units)
Key companies Wire Bonder Equipment sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASM Pacific Technology
Kulicke& Soffa
Palomar Technologies
Besi
DIAS Automation
F&K Delvotec Bondtechnik
Hesse
Hybond
SHINKAWA Electric
Toray Engineering
West Bond
Outline of Major Chapters:
Chapter 1: Introduces the definition of Wire Bonder Equipment, market overview.
Chapter 2: Global Wire Bonder Equipment market size in revenue and volume.
Chapter 3: Detailed analysis of Wire Bonder Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Wire Bonder Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Wire Bonder Equipment capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
