Report overview
The global Thin Wafers Temporary Bonding Equipment market size is estimated to be $165 million in 2023, and will reach $327 million by 2032, growing at a CAGR of 7.9% during the forecast period from 2024 to 2032.
This report studies the Thin Wafers Temporary Bonding Equipment market, covering market size for segment by type (Semi-Automatic Bonding Equipment, Fully Automatic Bonding Equipment, etc.), by application (Advanced Packaging, MEMS, etc.), by sales channel (Direct Channel, Distribution Channel), by player (Tokyo Ohka Kogyo (TOK), SUSS MicroTec, EV Group, AML, TAZMO, etc.) and by region (North America, Europe, Asia-Pacific, South America and Middle East & Africa).
This report provides detailed historical analysis of global market for Thin Wafers Temporary Bonding Equipment from 2018-2023, and provides extensive market forecasts from 2024-2032 by region/country and subsectors. It covers the sales/revenue/value, gross margin, historical growth and future perspectives in the Thin Wafers Temporary Bonding Equipment market.
Leading Players of Thin Wafers Temporary Bonding Equipment including:
Tokyo Ohka Kogyo (TOK)
SUSS MicroTec
EV Group
AML
TAZMO
Ayumi Industry
Shanghai Micro Electronics Equipment (SMEE)
...
Market split by Type:
Semi-Automatic Bonding Equipment
Fully Automatic Bonding Equipment
Market split by Application:
Advanced Packaging
MEMS
CMOS
Others
Market split by Sales Channel:
Direct Channel
Distribution Channel
Market split by Region/Country:
North America (United States and Canada)
Europe (Germany, UK, France, Italy, Spain, and Russia, etc.)
Asia-Pacific (China, Japan, Korea, India, Australia, and Southeast Asia, etc.)
South America (Brazil, Mexico, and Argentina, etc.)
Middle East & Africa (Turkey, UAE, Saudi Arabia, and South Africa, etc.)
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