Report overview
The global Thermal Copper Pillar Bump market was valued at US$ million in 2023 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2023, While China is Forecast to Reach $ Million.
Standard Cu Pillar Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Thermal Copper Pillar Bump include Intel, Samsung, LB Semicon Inc, DuPont, FINECS, Amkor Technology, SHINKO ELECTRIC INDUSTRIES CO.,LTD., ASE and Raytek Semiconductor,Inc., etc. in 2023, the global top five players have a share approximately % in terms of revenue.
The Thermal Copper Pillar Bump, also known as the thermal bump or TCPB, is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular Copper Pillar Bumps) for use in electronics and optoelectronic packaging, including flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semi-conductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical structure for connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality on the surface of a chip or other electrical component...
This report aims to provide a comprehensive presentation of the global market for Thermal Copper Pillar Bump, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thermal Copper Pillar Bump. This report contains market size and forecasts of Thermal Copper Pillar Bump in global, including the following market information:
Global Thermal Copper Pillar Bump Market Revenue, 2019-2024, 2025-2030, ($ millions)
Global Thermal Copper Pillar Bump Market Sales, 2019-2024, 2025-2030, (K Units)
Global top five Thermal Copper Pillar Bump companies in 2023 (%)
We surveyed the Thermal Copper Pillar Bump manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Thermal Copper Pillar Bump Market, by Type, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global Thermal Copper Pillar Bump Market Segment Percentages, by Type, 2023 (%)
Standard Cu Pillar
Fine Pitch Cu Pillar
Micro-Bumps
Others
Global Thermal Copper Pillar Bump Market, by Application, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global Thermal Copper Pillar Bump Market Segment Percentages, by Application, 2023 (%)
Consumer Electronics
Automobile
Industrial Equipment
Medical Insurance
Military and Defense
Aeronautics and Astronautics
Telecom
Global Thermal Copper Pillar Bump Market, By Region and Country, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global Thermal Copper Pillar Bump Market Segment Percentages, By Region and Country, 2023 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Thermal Copper Pillar Bump revenues in global market, 2019-2024 (Estimated), ($ millions)
Key companies Thermal Copper Pillar Bump revenues share in global market, 2023 (%)
Key companies Thermal Copper Pillar Bump sales in global market, 2019-2024 (Estimated), (K Units)
Key companies Thermal Copper Pillar Bump sales share in global market, 2023 (%)
Further, the report presents profiles of competitors in the market, key players include:
Intel
Samsung
LB Semicon Inc
DuPont
FINECS
Amkor Technology
SHINKO ELECTRIC INDUSTRIES CO.,LTD.
ASE
Raytek Semiconductor,Inc.
Sigurd Microelectronics Corporation
Nepes
SJ Group Co Ltd
ChipMOS TECHNOLOGIES
Element Solutions
Jiangsu Changjiang Electronics Tech Co
Outline of Major Chapters:
Chapter 1: Introduces the definition of Thermal Copper Pillar Bump, market overview.
Chapter 2: Global Thermal Copper Pillar Bump market size in revenue and volume.
Chapter 3: Detailed analysis of Thermal Copper Pillar Bump manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Thermal Copper Pillar Bump in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Thermal Copper Pillar Bump capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
