Report overview
The global Packaging Substrates market was valued at US$ million in 2023 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2023, While China is Forecast to Reach $ Million.
Organic Substrate Materials Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Packaging Substrates include IBIDEN CO.,LTD., KOBE STEEL,LTD, Kyocera Group, Samsung Group, SIMMTECH Co.,Ltd, Daeduck Group, Unimicron, Nan Ya PCB Co.,Ltd. and KINSUS, etc. in 2023, the global top five players have a share approximately % in terms of revenue.
The packaging substrate is the largest part of the packaging material cost, and it mainly plays the role of carrying and protecting the chip and connecting the upper chip and the lower circuit board. The packaging substrate can protect, fix, and support the chip, enhance the heat conduction and heat dissipation performance of the chip, and also connect the chip and the printed circuit board to realize electrical and physical connections, power distribution, signal distribution, and communication between the internal and external circuits of the chip. Packaging substrates can usually be divided into three types of substrates: organic, inorganic and composite.The organic substrate has a low dielectric constant and is easy to process, which is suitable for high-frequency signal transmission with low thermal conductivity requirements; the non-polar substrate is supported by inorganic ceramics, which has good heat resistance, easy wiring and dimensional stability, but there are certain limitations in cost and material toxicity ; Composite substrates are based on the characteristics of different requirements to compound different organic and inorganic materials. In the future, organic and composite substrates are expected to be mainstream substrate materials...
This report aims to provide a comprehensive presentation of the global market for Packaging Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Packaging Substrates. This report contains market size and forecasts of Packaging Substrates in global, including the following market information:
Global Packaging Substrates Market Revenue, 2019-2024, 2025-2030, ($ millions)
Global Packaging Substrates Market Sales, 2019-2024, 2025-2030, (Tons)
Global top five Packaging Substrates companies in 2023 (%)
We surveyed the Packaging Substrates manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Packaging Substrates Market, by Type, 2019-2024, 2025-2030 ($ Millions) & (Tons)
Global Packaging Substrates Market Segment Percentages, by Type, 2023 (%)
Organic Substrate Materials
Electrodeless Substrate Materials
Composite Substrate Materials
Global Packaging Substrates Market, by Application, 2019-2024, 2025-2030 ($ Millions) & (Tons)
Global Packaging Substrates Market Segment Percentages, by Application, 2023 (%)
Aerospace
Semiconductors and Electronics
Automobiles and Parts
Other
Global Packaging Substrates Market, By Region and Country, 2019-2024, 2025-2030 ($ Millions) & (Tons)
Global Packaging Substrates Market Segment Percentages, By Region and Country, 2023 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Packaging Substrates revenues in global market, 2019-2024 (Estimated), ($ millions)
Key companies Packaging Substrates revenues share in global market, 2023 (%)
Key companies Packaging Substrates sales in global market, 2019-2024 (Estimated), (Tons)
Key companies Packaging Substrates sales share in global market, 2023 (%)
Further, the report presents profiles of competitors in the market, key players include:
IBIDEN CO.,LTD.
KOBE STEEL,LTD
Kyocera Group
Samsung Group
SIMMTECH Co.,Ltd
Daeduck Group
Unimicron
Nan Ya PCB Co.,Ltd.
KINSUS
AVIC International Holdings Limited(Shennan Circuits Co.,Ltd.)
Shenzhen Xingsen Express Circuit Technology Co.,Ltd.
Outline of Major Chapters:
Chapter 1: Introduces the definition of Packaging Substrates, market overview.
Chapter 2: Global Packaging Substrates market size in revenue and volume.
Chapter 3: Detailed analysis of Packaging Substrates manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Packaging Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Packaging Substrates capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
