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Europe 3D IC & 2.5D IC Packaging market size was valued at US$ 1.23 billion in 2024 and is projected to reach US$ 2.56 billion by 2030, at a CAGR of 13.0% during the forecast period 2024-2030. Advanced semiconductor packaging technologies for stacking integrated circuits vertically or horizontally. Rapid growth supported by demand for high-performance computing and miniaturization. Increasing adoption in AI, 5G, and data center applications. Development of innovative thermal management and interconnect solutions for improved 3D/2.5D IC performance.

Report Includes

This report is an essential reference for who looks for detailed information on Europe 3D IC & 2.5D IC Packaging. The report covers data on Europe markets including historical and future trends for supply, market size, prices, trading, competition and value chain as well as Europe major vendors¡¯ information. In addition to the data part, the report also provides overview of 3D IC & 2.5D IC Packaging, including classification, application, manufacturing technology, industry chain analysis and latest market dynamics. Finally, a customization report in order to meet user's requirements is also available.

This report aims to provide a comprehensive presentation of the Europe 3D IC & 2.5D IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC & 2.5D IC Packaging. This report contains market size and forecasts of 3D IC & 2.5D IC Packaging in Europe, including the following market information:
We surveyed the 3D IC & 2.5D IC Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

by Country

•    Germany
•    United Kingdom
•    France
•    Italy
•    Spain
•    Netherlands
•    Belgium

by Products type:

•    3D TSV
•    2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

by Application:

•    Automotive
•    Consumer electronics
•    Medical devices
•    Military & aerospace
•    Telecommunication
•    Industrial sector and smart technologies

key players include: (At least 8-10 companies included)

•    STMicroelectronics (Switzerland)
•    Infineon Technologies AG (Germany)
•    ASE Group (Netherlands)
•    AMS AG (Austria)
•    S