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Europe 3D IC & 2.5D IC Packaging market size was valued at US$ 1.23 billion in 2024 and is projected to reach US$ 2.56 billion by 2030, at a CAGR of 13.0% during the forecast period 2024-2030. Advanced semiconductor packaging technologies for stacking integrated circuits vertically or horizontally. Rapid growth supported by demand for high-performance computing and miniaturization. Increasing adoption in AI, 5G, and data center applications. Development of innovative thermal management and interconnect solutions for improved 3D/2.5D IC performance.
Report Includes
This report is an essential reference for who looks for detailed information on Europe 3D IC & 2.5D IC Packaging. The report covers data on Europe markets including historical and future trends for supply, market size, prices, trading, competition and value chain as well as Europe major vendors¡¯ information. In addition to the data part, the report also provides overview of 3D IC & 2.5D IC Packaging, including classification, application, manufacturing technology, industry chain analysis and latest market dynamics. Finally, a customization report in order to meet user's requirements is also available.
This report aims to provide a comprehensive presentation of the Europe 3D IC & 2.5D IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC & 2.5D IC Packaging. This report contains market size and forecasts of 3D IC & 2.5D IC Packaging in Europe, including the following market information:
We surveyed the 3D IC & 2.5D IC Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
• Germany
• United Kingdom
• France
• Italy
• Spain
• Netherlands
• Belgium
• 3D TSV
• 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
• Automotive
• Consumer electronics
• Medical devices
• Military & aerospace
• Telecommunication
• Industrial sector and smart technologies
• STMicroelectronics (Switzerland)
• Infineon Technologies AG (Germany)
• ASE Group (Netherlands)
• AMS AG (Austria)
• S
1.1 Product Overview and Scope of 3D IC & 2.5D IC Packaging
1.2.1 Europe Market Size YoY Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 3D TSV
1.2.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
1.3.1 Europe Market Size YoY Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Automotive
1.3.3 Consumer electronics
1.3.4 Medical devices
1.3.5 Military & aerospace
1.3.6 Telecommunication
1.3.7 Industrial sector and smart technologies
1.4 Europe Market Growth Prospects
1.4.1 Europe Revenue Estimates and Forecasts (2019-2030)
1.4.2 Europe Production Estimates and Forecasts (2019-2030)
2.1 Industry Trends
2.1.1 SWOT Analysis
2.1.2 PESTEL Analysis
2.1.3 Porter’s Five Forces Analysis
2.2 Potential Market and Growth Potential Analysis
3.1 Europe Production by Manufacturers (2019-2023)
3.2 Europe Revenue Market Share by Manufacturers (2019-2023)
3.3 Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.4 Europe Average Price by Manufacturers (2019-2023)
3.5 Manufacturers Production Sites, Area Served, Product Type
3.6 Market Competitive Situation and Trends
3.6.1 Market Concentration Rate
3.6.2 Europe 5 and 10 Largest Players Market Share by Revenue
3.6.3 Mergers & Acquisitions, Expansion
4.1 Europe Production
4.1.1 Europe Production YoY Growth Rate (2019-2023)
4.1.2 Europe Production, Revenue, Price and Gross Margin (2019-2024)
5.1 Europe
5.1.1 Europe Consumption by Country
5.1.2 Europe Sales, Consumption, Export, Import (2019-2023)
5.1.1 Germany
5.2.2 United Kingdom
5.3.3 France
5.4.4 Italy
5.5.5 Spain
5.6.6 Netherlands
5.7.7 Belgium
6.1 Europe Production Market Share by Type (2019-2024)
6.2 Europe Revenue Market Share by Type (2019-2024)
6.3 Europe Price by Type (2019-2024)
7.1 Europe Production Market Share by Application (2019-2024)
7.2 Europe Revenue Market Share by Application (2019-2024)
7.3 Europe Price by Application (2019-2024)
8.1 STMicroelectronics (Switzerland)
8.1.1 STMicroelectronics (Switzerland) Corporation Information
8.1.2 STMicroelectronics (Switzerland) Product Portfolio
8.1.3 STMicroelectronics (Switzerland) Production Capacity, Revenue, Price and Gross Margin (2019-2024)
8.1.4 STMicroelectronics (Switzerland) Main Business and Markets Served
8.1.5 STMicroelectronics (Switzerland) Recent Developments/Updates
8.2 Infineon Technologies AG (Germany)
8.2.1 Infineon Technologies AG (Germany) Corporation Information
8.2.2 Infineon Technologies AG (Germany) Product Portfolio
8.2.3 Infineon Technologies AG (Germany) Production Capacity, Revenue, Price and Gross Margin (2019-2024)
8.2.4 Infineon Technologies AG (Germany) Main Business and Markets Served
8.2.5 Infineon Technologies AG (Germany) Recent Developments/Updates
8.3 ASE Group (Netherlands)
8.3.1 ASE Group (Netherlands) Corporation Information
8.3.2 ASE Group (Netherlands) Product Portfolio
8.3.3 ASE Group (Netherlands) Production Capacity, Revenue, Price and Gross Margin (2019-2024)
8.3.4 ASE Group (Netherlands) Main Business and Markets Served
8.3.5 ASE Group (Netherlands) Recent Developments/Updates
8.4 AMS AG (Austria)
8.4.1 AMS AG (Austria) Corporation Information
8.4.2 AMS AG (Austria) Product Portfolio
8.4.3 AMS AG (Austria) Production Capacity, Revenue, Price and Gross Margin (2019-2024)
8.4.4 AMS AG (Austria) Main Business and Markets Served
8.4.5 AMS AG (Austria) Recent Developments/Updates
8.5 S
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