This report aims to provide a comprehensive presentation of the global market for 3D-IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D-IC Packaging. This report contains market size and forecasts of 3D-IC Packaging in global, including the following market information:
Global 3D-IC Packaging Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The global 3D-IC Packaging market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is to reach $ Million.
TSV Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of 3D-IC Packaging include Synopsys, Cadence, XMC, United Microelectronics Corp, TSMC, SPIL, STMicroelectronics, ASE Group and Amkor Technology, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the 3D-IC Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global 3D-IC Packaging Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global 3D-IC Packaging Market Segment Percentages, by Type, 2022 (%)
TSV
TGV
Silicon Interposer
Global 3D-IC Packaging Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global 3D-IC Packaging Market Segment Percentages, by Application, 2022 (%)
Consumer Electronics
Medical Devices
Automotive
Others
Global 3D-IC Packaging Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global 3D-IC Packaging Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies 3D-IC Packaging revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies 3D-IC Packaging revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Synopsys
Cadence
XMC
United Microelectronics Corp
TSMC
SPIL
STMicroelectronics
ASE Group
Amkor Technology
Intel Corporation
GlobalFoundries
Invensas
Toshiba Corporation
Micron Technology
Xilinx
Outline of Major Chapters:
Chapter 1: Introduces the definition of 3D-IC Packaging, market overview.
Chapter 2: Global 3D-IC Packaging market size in revenue.
Chapter 3: Detailed analysis of 3D-IC Packaging company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of 3D-IC Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
TABLE OF CONTENTS
1 Introduction to Research & Analysis Reports
1.1 3D-IC Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global 3D-IC Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global 3D-IC Packaging Overall Market Size
2.1 Global 3D-IC Packaging Market Size: 2022 VS 2029
2.2 Global 3D-IC Packaging Market Size, Prospects & Forecasts: 2018-2029
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top 3D-IC Packaging Players in Global Market
3.2 Top Global 3D-IC Packaging Companies Ranked by Revenue
3.3 Global 3D-IC Packaging Revenue by Companies
3.4 Top 3 and Top 5 3D-IC Packaging Companies in Global Market, by Revenue in 2022
3.5 Global Companies 3D-IC Packaging Product Type
3.6 Tier 1, Tier 2 and Tier 3 3D-IC Packaging Players in Global Market
3.6.1 List of Global Tier 1 3D-IC Packaging Companies
3.6.2 List of Global Tier 2 and Tier 3 3D-IC Packaging Companies
4 Market Sights by Product
4.1 Overview
4.1.1 By Type - Global 3D-IC Packaging Market Size Markets, 2022 & 2029
4.1.2 TSV
4.1.3 TGV
4.1.4 Silicon Interposer
4.2 By Type - Global 3D-IC Packaging Revenue & Forecasts
4.2.1 By Type - Global 3D-IC Packaging Revenue, 2018-2023
4.2.2 By Type - Global 3D-IC Packaging Revenue, 2024-2029
4.2.3 By Type - Global 3D-IC Packaging Revenue Market Share, 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global 3D-IC Packaging Market Size, 2022 & 2029
5.1.2 Consumer Electronics
5.1.3 Medical Devices
5.1.4 Automotive
5.1.5 Others
5.2 By Application - Global 3D-IC Packaging Revenue & Forecasts
5.2.1 By Application - Global 3D-IC Packaging Revenue, 2018-2023
5.2.2 By Application - Global 3D-IC Packaging Revenue, 2024-2029
5.2.3 By Application - Global 3D-IC Packaging Revenue Market Share, 2018-2029
6 Sights by Region
6.1 By Region - Global 3D-IC Packaging Market Size, 2022 & 2029
6.2 By Region - Global 3D-IC Packaging Revenue & Forecasts
6.2.1 By Region - Global 3D-IC Packaging Revenue, 2018-2023
6.2.2 By Region - Global 3D-IC Packaging Revenue, 2024-2029
6.2.3 By Region - Global 3D-IC Packaging Revenue Market Share, 2018-2029
6.3 North America
6.3.1 By Country - North America 3D-IC Packaging Revenue, 2018-2029
6.3.2 US 3D-IC Packaging Market Size, 2018-2029
6.3.3 Canada 3D-IC Packaging Market Size, 2018-2029
6.3.4 Mexico 3D-IC Packaging Market Size, 2018-2029
6.4 Europe
6.4.1 By Country - Europe 3D-IC Packaging Revenue, 2018-2029
6.4.2 Germany 3D-IC Packaging Market Size, 2018-2029
6.4.3 France 3D-IC Packaging Market Size, 2018-2029
6.4.4 U.K. 3D-IC Packaging Market Size, 2018-2029
6.4.5 Italy 3D-IC Packaging Market Size, 2018-2029
6.4.6 Russia 3D-IC Packaging Market Size, 2018-2029
6.4.7 Nordic Countries 3D-IC Packaging Market Size, 2018-2029
6.4.8 Benelux 3D-IC Packaging Market Size, 2018-2029
6.5 Asia
6.5.1 By Region - Asia 3D-IC Packaging Revenue, 2018-2029
6.5.2 China 3D-IC Packaging Market Size, 2018-2029
6.5.3 Japan 3D-IC Packaging Market Size, 2018-2029
6.5.4 South Korea 3D-IC Packaging Market Size, 2018-2029
6.5.5 Southeast Asia 3D-IC Packaging Market Size, 2018-2029
6.5.6 India 3D-IC Packaging Market Size, 2018-2029
6.6 South America
6.6.1 By Country - South America 3D-IC Packaging Revenue, 2018-2029
6.6.2 Brazil 3D-IC Packaging Market Size, 2018-2029
6.6.3 Argentina 3D-IC Packaging Market Size, 2018-2029
6.7 Middle East & Africa
6.7.1 By Country - Middle East & Africa 3D-IC Packaging Revenue, 2018-2029
6.7.2 Turkey 3D-IC Packaging Market Size, 2018-2029
6.7.3 Israel 3D-IC Packaging Market Size, 2018-2029
6.7.4 Saudi Arabia 3D-IC Packaging Market Size, 2018-2029
6.7.5 UAE 3D-IC Packaging Market Size, 2018-2029
7 3D-IC Packaging Companies Profiles
7.1 Synopsys
7.1.1 Synopsys Company Summary
7.1.2 Synopsys Business Overview
7.1.3 Synopsys 3D-IC Packaging Major Product Offerings
7.1.4 Synopsys 3D-IC Packaging Revenue in Global Market (2018-2023)
7.1.5 Synopsys Key News & Latest Developments
7.2 Cadence
7.2.1 Cadence Company Summary
7.2.2 Cadence Business Overview
7.2.3 Cadence 3D-IC Packaging Major Product Offerings
7.2.4 Cadence 3D-IC Packaging Revenue in Global Market (2018-2023)
7.2.5 Cadence Key News & Latest Developments
7.3 XMC
7.3.1 XMC Company Summary
7.3.2 XMC Business Overview
7.3.3 XMC 3D-IC Packaging Major Product Offerings
7.3.4 XMC 3D-IC Packaging Revenue in Global Market (2018-2023)
7.3.5 XMC Key News & Latest Developments
7.4 United Microelectronics Corp
7.4.1 United Microelectronics Corp Company Summary
7.4.2 United Microelectronics Corp Business Overview
7.4.3 United Microelectronics Corp 3D-IC Packaging Major Product Offerings
7.4.4 United Microelectronics Corp 3D-IC Packaging Revenue in Global Market (2018-2023)
7.4.5 United Microelectronics Corp Key News & Latest Developments
7.5 TSMC
7.5.1 TSMC Company Summary
7.5.2 TSMC Business Overview
7.5.3 TSMC 3D-IC Packaging Major Product Offerings
7.5.4 TSMC 3D-IC Packaging Revenue in Global Market (2018-2023)
7.5.5 TSMC Key News & Latest Developments
7.6 SPIL
7.6.1 SPIL Company Summary
7.6.2 SPIL Business Overview
7.6.3 SPIL 3D-IC Packaging Major Product Offerings
7.6.4 SPIL 3D-IC Packaging Revenue in Global Market (2018-2023)
7.6.5 SPIL Key News & Latest Developments
7.7 STMicroelectronics
7.7.1 STMicroelectronics Company Summary
7.7.2 STMicroelectronics Business Overview
7.7.3 STMicroelectronics 3D-IC Packaging Major Product Offerings
7.7.4 STMicroelectronics 3D-IC Packaging Revenue in Global Market (2018-2023)
7.7.5 STMicroelectronics Key News & Latest Developments
7.8 ASE Group
7.8.1 ASE Group Company Summary
7.8.2 ASE Group Business Overview
7.8.3 ASE Group 3D-IC Packaging Major Product Offerings
7.8.4 ASE Group 3D-IC Packaging Revenue in Global Market (2018-2023)
7.8.5 ASE Group Key News & Latest Developments
7.9 Amkor Technology
7.9.1 Amkor Technology Company Summary
7.9.2 Amkor Technology Business Overview
7.9.3 Amkor Technology 3D-IC Packaging Major Product Offerings
7.9.4 Amkor Technology 3D-IC Packaging Revenue in Global Market (2018-2023)
7.9.5 Amkor Technology Key News & Latest Developments
7.10 Intel Corporation
7.10.1 Intel Corporation Company Summary
7.10.2 Intel Corporation Business Overview
7.10.3 Intel Corporation 3D-IC Packaging Major Product Offerings
7.10.4 Intel Corporation 3D-IC Packaging Revenue in Global Market (2018-2023)
7.10.5 Intel Corporation Key News & Latest Developments
7.11 GlobalFoundries
7.11.1 GlobalFoundries Company Summary
7.11.2 GlobalFoundries Business Overview
7.11.3 GlobalFoundries 3D-IC Packaging Major Product Offerings
7.11.4 GlobalFoundries 3D-IC Packaging Revenue in Global Market (2018-2023)
7.11.5 GlobalFoundries Key News & Latest Developments
7.12 Invensas
7.12.1 Invensas Company Summary
7.12.2 Invensas Business Overview
7.12.3 Invensas 3D-IC Packaging Major Product Offerings
7.12.4 Invensas 3D-IC Packaging Revenue in Global Market (2018-2023)
7.12.5 Invensas Key News & Latest Developments
7.13 Toshiba Corporation
7.13.1 Toshiba Corporation Company Summary
7.13.2 Toshiba Corporation Business Overview
7.13.3 Toshiba Corporation 3D-IC Packaging Major Product Offerings
7.13.4 Toshiba Corporation 3D-IC Packaging Revenue in Global Market (2018-2023)
7.13.5 Toshiba Corporation Key News & Latest Developments
7.14 Micron Technology
7.14.1 Micron Technology Company Summary
7.14.2 Micron Technology Business Overview
7.14.3 Micron Technology 3D-IC Packaging Major Product Offerings
7.14.4 Micron Technology 3D-IC Packaging Revenue in Global Market (2018-2023)
7.14.5 Micron Technology Key News & Latest Developments
7.15 Xilinx
7.15.1 Xilinx Company Summary
7.15.2 Xilinx Business Overview
7.15.3 Xilinx 3D-IC Packaging Major Product Offerings
7.15.4 Xilinx 3D-IC Packaging Revenue in Global Market (2018-2023)
7.15.5 Xilinx Key News & Latest Developments
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer
LIST OF TABLES & FIGURES
List of Tables
Table 1. 3D-IC Packaging Market Opportunities & Trends in Global Market
Table 2. 3D-IC Packaging Market Drivers in Global Market
Table 3. 3D-IC Packaging Market Restraints in Global Market
Table 4. Key Players of 3D-IC Packaging in Global Market
Table 5. Top 3D-IC Packaging Players in Global Market, Ranking by Revenue (2022)
Table 6. Global 3D-IC Packaging Revenue by Companies, (US$, Mn), 2018-2023
Table 7. Global 3D-IC Packaging Revenue Share by Companies, 2018-2023
Table 8. Global Companies 3D-IC Packaging Product Type
Table 9. List of Global Tier 1 3D-IC Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 10. List of Global Tier 2 and Tier 3 3D-IC Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 11. By Type ? Global 3D-IC Packaging Revenue, (US$, Mn), 2022 & 2029
Table 12. By Type - 3D-IC Packaging Revenue in Global (US$, Mn), 2018-2023
Table 13. By Type - 3D-IC Packaging Revenue in Global (US$, Mn), 2024-2029
Table 14. By Application ? Global 3D-IC Packaging Revenue, (US$, Mn), 2022 & 2029
Table 15. By Application - 3D-IC Packaging Revenue in Global (US$, Mn), 2018-2023
Table 16. By Application - 3D-IC Packaging Revenue in Global (US$, Mn), 2024-2029
Table 17. By Region ? Global 3D-IC Packaging Revenue, (US$, Mn), 2022 & 2029
Table 18. By Region - Global 3D-IC Packaging Revenue (US$, Mn), 2018-2023
Table 19. By Region - Global 3D-IC Packaging Revenue (US$, Mn), 2024-2029
Table 20. By Country - North America 3D-IC Packaging Revenue, (US$, Mn), 2018-2023
Table 21. By Country - North America 3D-IC Packaging Revenue, (US$, Mn), 2024-2029
Table 22. By Country - Europe 3D-IC Packaging Revenue, (US$, Mn), 2018-2023
Table 23. By Country - Europe 3D-IC Packaging Revenue, (US$, Mn), 2024-2029
Table 24. By Region - Asia 3D-IC Packaging Revenue, (US$, Mn), 2018-2023
Table 25. By Region - Asia 3D-IC Packaging Revenue, (US$, Mn), 2024-2029
Table 26. By Country - South America 3D-IC Packaging Revenue, (US$, Mn), 2018-2023
Table 27. By Country - South America 3D-IC Packaging Revenue, (US$, Mn), 2024-2029
Table 28. By Country - Middle East & Africa 3D-IC Packaging Revenue, (US$, Mn), 2018-2023
Table 29. By Country - Middle East & Africa 3D-IC Packaging Revenue, (US$, Mn), 2024-2029
Table 30. Synopsys Company Summary
Table 31. Synopsys 3D-IC Packaging Product Offerings
Table 32. Synopsys 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 33. Synopsys Key News & Latest Developments
Table 34. Cadence Company Summary
Table 35. Cadence 3D-IC Packaging Product Offerings
Table 36. Cadence 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 37. Cadence Key News & Latest Developments
Table 38. XMC Company Summary
Table 39. XMC 3D-IC Packaging Product Offerings
Table 40. XMC 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 41. XMC Key News & Latest Developments
Table 42. United Microelectronics Corp Company Summary
Table 43. United Microelectronics Corp 3D-IC Packaging Product Offerings
Table 44. United Microelectronics Corp 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 45. United Microelectronics Corp Key News & Latest Developments
Table 46. TSMC Company Summary
Table 47. TSMC 3D-IC Packaging Product Offerings
Table 48. TSMC 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 49. TSMC Key News & Latest Developments
Table 50. SPIL Company Summary
Table 51. SPIL 3D-IC Packaging Product Offerings
Table 52. SPIL 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 53. SPIL Key News & Latest Developments
Table 54. STMicroelectronics Company Summary
Table 55. STMicroelectronics 3D-IC Packaging Product Offerings
Table 56. STMicroelectronics 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 57. STMicroelectronics Key News & Latest Developments
Table 58. ASE Group Company Summary
Table 59. ASE Group 3D-IC Packaging Product Offerings
Table 60. ASE Group 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 61. ASE Group Key News & Latest Developments
Table 62. Amkor Technology Company Summary
Table 63. Amkor Technology 3D-IC Packaging Product Offerings
Table 64. Amkor Technology 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 65. Amkor Technology Key News & Latest Developments
Table 66. Intel Corporation Company Summary
Table 67. Intel Corporation 3D-IC Packaging Product Offerings
Table 68. Intel Corporation 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 69. Intel Corporation Key News & Latest Developments
Table 70. GlobalFoundries Company Summary
Table 71. GlobalFoundries 3D-IC Packaging Product Offerings
Table 72. GlobalFoundries 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 73. GlobalFoundries Key News & Latest Developments
Table 74. Invensas Company Summary
Table 75. Invensas 3D-IC Packaging Product Offerings
Table 76. Invensas 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 77. Invensas Key News & Latest Developments
Table 78. Toshiba Corporation Company Summary
Table 79. Toshiba Corporation 3D-IC Packaging Product Offerings
Table 80. Toshiba Corporation 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 81. Toshiba Corporation Key News & Latest Developments
Table 82. Micron Technology Company Summary
Table 83. Micron Technology 3D-IC Packaging Product Offerings
Table 84. Micron Technology 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 85. Micron Technology Key News & Latest Developments
Table 86. Xilinx Company Summary
Table 87. Xilinx 3D-IC Packaging Product Offerings
Table 88. Xilinx 3D-IC Packaging Revenue (US$, Mn) & (2018-2023)
Table 89. Xilinx Key News & Latest Developments
List of Figures
Figure 1. 3D-IC Packaging Segment by Type in 2022
Figure 2. 3D-IC Packaging Segment by Application in 2022
Figure 3. Global 3D-IC Packaging Market Overview: 2022
Figure 4. Key Caveats
Figure 5. Global 3D-IC Packaging Market Size: 2022 VS 2029 (US$, Mn)
Figure 6. Global 3D-IC Packaging Revenue, 2018-2029 (US$, Mn)
Figure 7. The Top 3 and 5 Players Market Share by 3D-IC Packaging Revenue in 2022
Figure 8. By Type - Global 3D-IC Packaging Revenue Market Share, 2018-2029
Figure 9. By Application - Global 3D-IC Packaging Revenue Market Share, 2018-2029
Figure 10. By Type - Global 3D-IC Packaging Revenue, (US$, Mn), 2022 & 2029
Figure 11. By Type - Global 3D-IC Packaging Revenue Market Share, 2018-2029
Figure 12. By Application - Global 3D-IC Packaging Revenue, (US$, Mn), 2022 & 2029
Figure 13. By Application - Global 3D-IC Packaging Revenue Market Share, 2018-2029
Figure 14. By Region - Global 3D-IC Packaging Revenue Market Share, 2018-2029
Figure 15. By Country - North America 3D-IC Packaging Revenue Market Share, 2018-2029
Figure 16. US 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 17. Canada 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 18. Mexico 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 19. By Country - Europe 3D-IC Packaging Revenue Market Share, 2018-2029
Figure 20. Germany 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 21. France 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 22. U.K. 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 23. Italy 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 24. Russia 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 25. Nordic Countries 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 26. Benelux 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 27. By Region - Asia 3D-IC Packaging Revenue Market Share, 2018-2029
Figure 28. China 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 29. Japan 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 30. South Korea 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 31. Southeast Asia 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 32. India 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 33. By Country - South America 3D-IC Packaging Revenue Market Share, 2018-2029
Figure 34. Brazil 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 35. Argentina 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 36. By Country - Middle East & Africa 3D-IC Packaging Revenue Market Share, 2018-2029
Figure 37. Turkey 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 38. Israel 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 39. Saudi Arabia 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 40. UAE 3D-IC Packaging Revenue, (US$, Mn), 2018-2029
Figure 41. Synopsys 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 42. Cadence 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 43. XMC 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 44. United Microelectronics Corp 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 45. TSMC 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 46. SPIL 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 47. STMicroelectronics 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 48. ASE Group 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 49. Amkor Technology 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 50. Intel Corporation 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 51. GlobalFoundries 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 52. Invensas 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 53. Toshiba Corporation 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 54. Micron Technology 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 55. Xilinx 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
