This report contains market size and forecasts of 3D-IC Packaging in Global, including the following market information:
Global 3D-IC Packaging Market Revenue, 2018-2023, 2023-2030, ($ millions)
Global top five companies in 2022 (%)
The global 3D-IC Packaging market was valued at US$ million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million by 2030.
TSV Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of 3D-IC Packaging include Synopsys, Cadence, XMC, United Microelectronics Corp, TSMC, SPIL, STMicroelectronics, ASE Group and Amkor Technology, etc. In 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the 3D-IC Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global 3D-IC Packaging Market, by Type, 2018-2023, 2023-2030 ($ millions)
Global 3D-IC Packaging Market Segment Percentages, by Type, 2022 (%)
TSV
TGV
Silicon Interposer
Global 3D-IC Packaging Market, by Application, 2018-2023, 2023-2030 ($ millions)
Global 3D-IC Packaging Market Segment Percentages, by Application, 2022 (%)
Consumer Electronics
Medical Devices
Automotive
Others
Global 3D-IC Packaging Market, By Region and Country, 2018-2023, 2023-2030 ($ Millions)
Global 3D-IC Packaging Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies 3D-IC Packaging revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies 3D-IC Packaging revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Synopsys
Cadence
XMC
United Microelectronics Corp
TSMC
SPIL
STMicroelectronics
ASE Group
Amkor Technology
Intel Corporation
GlobalFoundries
Invensas
Toshiba Corporation
Micron Technology
Xilinx
TABLE OF CONTENTS
1 Introduction to Research & Analysis Reports
1.1 3D-IC Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global 3D-IC Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global 3D-IC Packaging Overall Market Size
2.1 Global 3D-IC Packaging Market Size: 2022 VS 2030
2.2 Global 3D-IC Packaging Market Size, Prospects & Forecasts: 2018-2030
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top 3D-IC Packaging Players in Global Market
3.2 Top Global 3D-IC Packaging Companies Ranked by Revenue
3.3 Global 3D-IC Packaging Revenue by Companies
3.4 Top 3 and Top 5 3D-IC Packaging Companies in Global Market, by Revenue in 2022
3.5 Global Companies 3D-IC Packaging Product Type
3.6 Tier 1, Tier 2 and Tier 3 3D-IC Packaging Players in Global Market
3.6.1 List of Global Tier 1 3D-IC Packaging Companies
3.6.2 List of Global Tier 2 and Tier 3 3D-IC Packaging Companies
4 Market Sights by Product
4.1 Overview
4.1.1 by Type - Global 3D-IC Packaging Market Size Markets, 2022 & 2030
4.1.2 TSV
4.1.3 TGV
4.1.4 Silicon Interposer
4.2 By Type - Global 3D-IC Packaging Revenue & Forecasts
4.2.1 By Type - Global 3D-IC Packaging Revenue, 2018-2023
4.2.2 By Type - Global 3D-IC Packaging Revenue, 2023-2030
4.2.3 By Type - Global 3D-IC Packaging Revenue Market Share, 2018-2030
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global 3D-IC Packaging Market Size, 2022 & 2030
5.1.2 Consumer Electronics
5.1.3 Medical Devices
5.1.4 Automotive
5.1.5 Others
5.2 By Application - Global 3D-IC Packaging Revenue & Forecasts
5.2.1 By Application - Global 3D-IC Packaging Revenue, 2018-2023
5.2.2 By Application - Global 3D-IC Packaging Revenue, 2023-2030
5.2.3 By Application - Global 3D-IC Packaging Revenue Market Share, 2018-2030
6 Sights by Region
6.1 By Region - Global 3D-IC Packaging Market Size, 2022 & 2030
6.2 By Region - Global 3D-IC Packaging Revenue & Forecasts
6.2.1 By Region - Global 3D-IC Packaging Revenue, 2018-2023
6.2.2 By Region - Global 3D-IC Packaging Revenue, 2023-2030
6.2.3 By Region - Global 3D-IC Packaging Revenue Market Share, 2018-2030
6.3 North America
6.3.1 By Country - North America 3D-IC Packaging Revenue, 2018-2030
6.3.2 US 3D-IC Packaging Market Size, 2018-2030
6.3.3 Canada 3D-IC Packaging Market Size, 2018-2030
6.3.4 Mexico 3D-IC Packaging Market Size, 2018-2030
6.4 Europe
6.4.1 By Country - Europe 3D-IC Packaging Revenue, 2018-2030
6.4.2 Germany 3D-IC Packaging Market Size, 2018-2030
6.4.3 France 3D-IC Packaging Market Size, 2018-2030
6.4.4 U.K. 3D-IC Packaging Market Size, 2018-2030
6.4.5 Italy 3D-IC Packaging Market Size, 2018-2030
6.4.6 Russia 3D-IC Packaging Market Size, 2018-2030
6.4.7 Nordic Countries 3D-IC Packaging Market Size, 2018-2030
6.4.8 Benelux 3D-IC Packaging Market Size, 2018-2030
6.5 Asia
6.5.1 By Region - Asia 3D-IC Packaging Revenue, 2018-2030
6.5.2 China 3D-IC Packaging Market Size, 2018-2030
6.5.3 Japan 3D-IC Packaging Market Size, 2018-2030
6.5.4 South Korea 3D-IC Packaging Market Size, 2018-2030
6.5.5 Southeast Asia 3D-IC Packaging Market Size, 2018-2030
6.5.6 India 3D-IC Packaging Market Size, 2018-2030
6.6 South America
6.6.1 By Country - South America 3D-IC Packaging Revenue, 2018-2030
6.6.2 Brazil 3D-IC Packaging Market Size, 2018-2030
6.6.3 Argentina 3D-IC Packaging Market Size, 2018-2030
6.7 Middle East & Africa
6.7.1 By Country - Middle East & Africa 3D-IC Packaging Revenue, 2018-2030
6.7.2 Turkey 3D-IC Packaging Market Size, 2018-2030
6.7.3 Israel 3D-IC Packaging Market Size, 2018-2030
6.7.4 Saudi Arabia 3D-IC Packaging Market Size, 2018-2030
6.7.5 UAE 3D-IC Packaging Market Size, 2018-2030
7 Players Profiles
7.1 Synopsys
7.1.1 Synopsys Corporate Summary
7.1.2 Synopsys Business Overview
7.1.3 Synopsys 3D-IC Packaging Major Product Offerings
7.1.4 Synopsys 3D-IC Packaging Revenue in Global Market (2018-2023)
7.1.5 Synopsys Key News
7.2 Cadence
7.2.1 Cadence Corporate Summary
7.2.2 Cadence Business Overview
7.2.3 Cadence 3D-IC Packaging Major Product Offerings
7.2.4 Cadence 3D-IC Packaging Revenue in Global Market (2018-2023)
7.2.5 Cadence Key News
7.3 XMC
7.3.1 XMC Corporate Summary
7.3.2 XMC Business Overview
7.3.3 XMC 3D-IC Packaging Major Product Offerings
7.3.4 XMC 3D-IC Packaging Revenue in Global Market (2018-2023)
7.3.5 XMC Key News
7.4 United Microelectronics Corp
7.4.1 United Microelectronics Corp Corporate Summary
7.4.2 United Microelectronics Corp Business Overview
7.4.3 United Microelectronics Corp 3D-IC Packaging Major Product Offerings
7.4.4 United Microelectronics Corp 3D-IC Packaging Revenue in Global Market (2018-2023)
7.4.5 United Microelectronics Corp Key News
7.5 TSMC
7.5.1 TSMC Corporate Summary
7.5.2 TSMC Business Overview
7.5.3 TSMC 3D-IC Packaging Major Product Offerings
7.5.4 TSMC 3D-IC Packaging Revenue in Global Market (2018-2023)
7.5.5 TSMC Key News
7.6 SPIL
7.6.1 SPIL Corporate Summary
7.6.2 SPIL Business Overview
7.6.3 SPIL 3D-IC Packaging Major Product Offerings
7.6.4 SPIL 3D-IC Packaging Revenue in Global Market (2018-2023)
7.6.5 SPIL Key News
7.7 STMicroelectronics
7.7.1 STMicroelectronics Corporate Summary
7.7.2 STMicroelectronics Business Overview
7.7.3 STMicroelectronics 3D-IC Packaging Major Product Offerings
7.7.4 STMicroelectronics 3D-IC Packaging Revenue in Global Market (2018-2023)
7.7.5 STMicroelectronics Key News
7.8 ASE Group
7.8.1 ASE Group Corporate Summary
7.8.2 ASE Group Business Overview
7.8.3 ASE Group 3D-IC Packaging Major Product Offerings
7.8.4 ASE Group 3D-IC Packaging Revenue in Global Market (2018-2023)
7.8.5 ASE Group Key News
7.9 Amkor Technology
7.9.1 Amkor Technology Corporate Summary
7.9.2 Amkor Technology Business Overview
7.9.3 Amkor Technology 3D-IC Packaging Major Product Offerings
7.9.4 Amkor Technology 3D-IC Packaging Revenue in Global Market (2018-2023)
7.9.5 Amkor Technology Key News
7.10 Intel Corporation
7.10.1 Intel Corporation Corporate Summary
7.10.2 Intel Corporation Business Overview
7.10.3 Intel Corporation 3D-IC Packaging Major Product Offerings
7.10.4 Intel Corporation 3D-IC Packaging Revenue in Global Market (2018-2023)
7.10.5 Intel Corporation Key News
7.11 GlobalFoundries
7.11.1 GlobalFoundries Corporate Summary
7.11.2 GlobalFoundries Business Overview
7.11.3 GlobalFoundries 3D-IC Packaging Major Product Offerings
7.11.4 GlobalFoundries 3D-IC Packaging Revenue in Global Market (2018-2023)
7.11.5 GlobalFoundries Key News
7.12 Invensas
7.12.1 Invensas Corporate Summary
7.12.2 Invensas Business Overview
7.12.3 Invensas 3D-IC Packaging Major Product Offerings
7.12.4 Invensas 3D-IC Packaging Revenue in Global Market (2018-2023)
7.12.5 Invensas Key News
7.13 Toshiba Corporation
7.13.1 Toshiba Corporation Corporate Summary
7.13.2 Toshiba Corporation Business Overview
7.13.3 Toshiba Corporation 3D-IC Packaging Major Product Offerings
7.13.4 Toshiba Corporation 3D-IC Packaging Revenue in Global Market (2018-2023)
7.13.5 Toshiba Corporation Key News
7.14 Micron Technology
7.14.1 Micron Technology Corporate Summary
7.14.2 Micron Technology Business Overview
7.14.3 Micron Technology 3D-IC Packaging Major Product Offerings
7.14.4 Micron Technology 3D-IC Packaging Revenue in Global Market (2018-2023)
7.14.5 Micron Technology Key News
7.15 Xilinx
7.15.1 Xilinx Corporate Summary
7.15.2 Xilinx Business Overview
7.15.3 Xilinx 3D-IC Packaging Major Product Offerings
7.15.4 Xilinx 3D-IC Packaging Revenue in Global Market (2018-2023)
7.15.5 Xilinx Key News
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer
LIST OF TABLES & FIGURES
List of Tables
Table 1. 3D-IC Packaging Market Opportunities & Trends in Global Market
Table 2. 3D-IC Packaging Market Drivers in Global Market
Table 3. 3D-IC Packaging Market Restraints in Global Market
Table 4. Key Players of 3D-IC Packaging in Global Market
Table 5. Top 3D-IC Packaging Players in Global Market, Ranking by Revenue (2022)
Table 6. Global 3D-IC Packaging Revenue by Companies, (US$, Mn), 2018-2023
Table 7. Global 3D-IC Packaging Revenue Share by Companies, 2018-2023
Table 8. Global Companies 3D-IC Packaging Product Type
Table 9. List of Global Tier 1 3D-IC Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 10. List of Global Tier 2 and Tier 3 3D-IC Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 11. By Type ? Global 3D-IC Packaging Revenue, (US$, Mn), 2022 & 2030
Table 12. By Type - 3D-IC Packaging Revenue in Global (US$, Mn), 2018-2023
Table 13. By Type - 3D-IC Packaging Revenue in Global (US$, Mn), 2023-2030
Table 14. By Application ? Global 3D-IC Packaging Revenue, (US$, Mn), 2022 & 2030
Table 15. By Application - 3D-IC Packaging Revenue in Global (US$, Mn), 2018-2023
Table 16. By Application - 3D-IC Packaging Revenue in Global (US$, Mn), 2023-2030
Table 17. By Region ? Global 3D-IC Packaging Revenue, (US$, Mn), 2022 & 2030
Table 18. By Region - Global 3D-IC Packaging Revenue (US$, Mn), 2018-2023
Table 19. By Region - Global 3D-IC Packaging Revenue (US$, Mn), 2023-2030
Table 20. By Country - North America 3D-IC Packaging Revenue, (US$, Mn), 2018-2023
Table 21. By Country - North America 3D-IC Packaging Revenue, (US$, Mn), 2023-2030
Table 22. By Country - Europe 3D-IC Packaging Revenue, (US$, Mn), 2018-2023
Table 23. By Country - Europe 3D-IC Packaging Revenue, (US$, Mn), 2023-2030
Table 24. By Region - Asia 3D-IC Packaging Revenue, (US$, Mn), 2018-2023
Table 25. By Region - Asia 3D-IC Packaging Revenue, (US$, Mn), 2023-2030
Table 26. By Country - South America 3D-IC Packaging Revenue, (US$, Mn), 2018-2023
Table 27. By Country - South America 3D-IC Packaging Revenue, (US$, Mn), 2023-2030
Table 28. By Country - Middle East & Africa 3D-IC Packaging Revenue, (US$, Mn), 2018-2023
Table 29. By Country - Middle East & Africa 3D-IC Packaging Revenue, (US$, Mn), 2023-2030
Table 30. Synopsys Corporate Summary
Table 31. Synopsys 3D-IC Packaging Product Offerings
Table 32. Synopsys 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
Table 33. Cadence Corporate Summary
Table 34. Cadence 3D-IC Packaging Product Offerings
Table 35. Cadence 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
Table 36. XMC Corporate Summary
Table 37. XMC 3D-IC Packaging Product Offerings
Table 38. XMC 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
Table 39. United Microelectronics Corp Corporate Summary
Table 40. United Microelectronics Corp 3D-IC Packaging Product Offerings
Table 41. United Microelectronics Corp 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
Table 42. TSMC Corporate Summary
Table 43. TSMC 3D-IC Packaging Product Offerings
Table 44. TSMC 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
Table 45. SPIL Corporate Summary
Table 46. SPIL 3D-IC Packaging Product Offerings
Table 47. SPIL 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
Table 48. STMicroelectronics Corporate Summary
Table 49. STMicroelectronics 3D-IC Packaging Product Offerings
Table 50. STMicroelectronics 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
Table 51. ASE Group Corporate Summary
Table 52. ASE Group 3D-IC Packaging Product Offerings
Table 53. ASE Group 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
Table 54. Amkor Technology Corporate Summary
Table 55. Amkor Technology 3D-IC Packaging Product Offerings
Table 56. Amkor Technology 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
Table 57. Intel Corporation Corporate Summary
Table 58. Intel Corporation 3D-IC Packaging Product Offerings
Table 59. Intel Corporation 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
Table 60. GlobalFoundries Corporate Summary
Table 61. GlobalFoundries 3D-IC Packaging Product Offerings
Table 62. GlobalFoundries 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
Table 63. Invensas Corporate Summary
Table 64. Invensas 3D-IC Packaging Product Offerings
Table 65. Invensas 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
Table 66. Toshiba Corporation Corporate Summary
Table 67. Toshiba Corporation 3D-IC Packaging Product Offerings
Table 68. Toshiba Corporation 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
Table 69. Micron Technology Corporate Summary
Table 70. Micron Technology 3D-IC Packaging Product Offerings
Table 71. Micron Technology 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
Table 72. Xilinx Corporate Summary
Table 73. Xilinx 3D-IC Packaging Product Offerings
Table 74. Xilinx 3D-IC Packaging Revenue (US$, Mn), (2018-2023)
List of Figures
Figure 1. 3D-IC Packaging Segment by Type in 2022
Figure 2. 3D-IC Packaging Segment by Application in 2022
Figure 3. Global 3D-IC Packaging Market Overview: 2022
Figure 4. Key Caveats
Figure 5. Global 3D-IC Packaging Market Size: 2022 VS 2030 (US$, Mn)
Figure 6. Global 3D-IC Packaging Revenue, 2018-2030 (US$, Mn)
Figure 7. The Top 3 and 5 Players Market Share by 3D-IC Packaging Revenue in 2022
Figure 8. By Type - Global 3D-IC Packaging Revenue Market Share, 2018-2030
Figure 9. By Application - Global 3D-IC Packaging Revenue Market Share, 2018-2030
Figure 10. By Region - Global 3D-IC Packaging Revenue Market Share, 2018-2030
Figure 11. By Country - North America 3D-IC Packaging Revenue Market Share, 2018-2030
Figure 12. US 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 13. Canada 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 14. Mexico 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 15. By Country - Europe 3D-IC Packaging Revenue Market Share, 2018-2030
Figure 16. Germany 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 17. France 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 18. U.K. 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 19. Italy 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 20. Russia 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 21. Nordic Countries 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 22. Benelux 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 23. By Region - Asia 3D-IC Packaging Revenue Market Share, 2018-2030
Figure 24. China 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 25. Japan 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 26. South Korea 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 27. Southeast Asia 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 28. India 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 29. By Country - South America 3D-IC Packaging Revenue Market Share, 2018-2030
Figure 30. Brazil 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 31. Argentina 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 32. By Country - Middle East & Africa 3D-IC Packaging Revenue Market Share, 2018-2030
Figure 33. Turkey 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 34. Israel 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 35. Saudi Arabia 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 36. UAE 3D-IC Packaging Revenue, (US$, Mn), 2018-2030
Figure 37. Synopsys 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 38. Cadence 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 39. XMC 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 40. United Microelectronics Corp 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 41. TSMC 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 42. SPIL 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 43. STMicroelectronics 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 44. ASE Group 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 45. Amkor Technology 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 46. Intel Corporation 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 47. GlobalFoundries 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 48. Invensas 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 49. Toshiba Corporation 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 50. Micron Technology 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 51. Xilinx 3D-IC Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
