Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.
This report aims to provide a comprehensive presentation of the global market for Fan-in Wafer Level Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fan-in Wafer Level Packaging. This report contains market size and forecasts of Fan-in Wafer Level Packaging in global, including the following market information:
Global Fan-in Wafer Level Packaging Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The global Fan-in Wafer Level Packaging market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The analog and mixed IC segment accounted for the major shares and dominated the market. The demand for analog ICs from different segments such as consumer electronics, communications, and automotive and the increasing adoption of smartphones, phablets, and tablets, will fuel the growth of the market segment in the coming years. Additionally, technological advancements in the semiconductor industry that demand the need to ensure the robust performance of advanced ICs will also drive the demand for fan-in WLP packaging.
We surveyed the Fan-in Wafer Level Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Fan-in Wafer Level Packaging Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Fan-in Wafer Level Packaging Market Segment Percentages, by Type, 2022 (%)
200mm Wafer Level Packaging
300mm Wafer Level Packaging
Other
Global Fan-in Wafer Level Packaging Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Fan-in Wafer Level Packaging Market Segment Percentages, by Application, 2022 (%)
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC
Other
Global Fan-in Wafer Level Packaging Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Fan-in Wafer Level Packaging Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Fan-in Wafer Level Packaging revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Fan-in Wafer Level Packaging revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
STATS ChipPAC
STMicroelectronics
TSMC
Texas Instruments
Rudolph Technologies
SEMES
SUSS MicroTec
Veeco/CNT
FlipChip International
Outline of Major Chapters:
Chapter 1: Introduces the definition of Fan-in Wafer Level Packaging, market overview.
Chapter 2: Global Fan-in Wafer Level Packaging market size in revenue.
Chapter 3: Detailed analysis of Fan-in Wafer Level Packaging company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Fan-in Wafer Level Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
TABLE OF CONTENTS
1 Introduction to Research & Analysis Reports
1.1 Fan-in Wafer Level Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Fan-in Wafer Level Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Fan-in Wafer Level Packaging Overall Market Size
2.1 Global Fan-in Wafer Level Packaging Market Size: 2022 VS 2029
2.2 Global Fan-in Wafer Level Packaging Market Size, Prospects & Forecasts: 2018-2029
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top Fan-in Wafer Level Packaging Players in Global Market
3.2 Top Global Fan-in Wafer Level Packaging Companies Ranked by Revenue
3.3 Global Fan-in Wafer Level Packaging Revenue by Companies
3.4 Top 3 and Top 5 Fan-in Wafer Level Packaging Companies in Global Market, by Revenue in 2022
3.5 Global Companies Fan-in Wafer Level Packaging Product Type
3.6 Tier 1, Tier 2 and Tier 3 Fan-in Wafer Level Packaging Players in Global Market
3.6.1 List of Global Tier 1 Fan-in Wafer Level Packaging Companies
3.6.2 List of Global Tier 2 and Tier 3 Fan-in Wafer Level Packaging Companies
4 Market Sights by Product
4.1 Overview
4.1.1 By Type - Global Fan-in Wafer Level Packaging Market Size Markets, 2022 & 2029
4.1.2 200mm Wafer Level Packaging
4.1.3 300mm Wafer Level Packaging
4.1.4 Other
4.2 By Type - Global Fan-in Wafer Level Packaging Revenue & Forecasts
4.2.1 By Type - Global Fan-in Wafer Level Packaging Revenue, 2018-2023
4.2.2 By Type - Global Fan-in Wafer Level Packaging Revenue, 2024-2029
4.2.3 By Type - Global Fan-in Wafer Level Packaging Revenue Market Share, 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global Fan-in Wafer Level Packaging Market Size, 2022 & 2029
5.1.2 CMOS Image Sensor
5.1.3 Wireless Connectivity
5.1.4 Logic and Memory IC
5.1.5 MEMS and Sensor
5.1.6 Analog and Mixed IC
5.1.7 Other
5.2 By Application - Global Fan-in Wafer Level Packaging Revenue & Forecasts
5.2.1 By Application - Global Fan-in Wafer Level Packaging Revenue, 2018-2023
5.2.2 By Application - Global Fan-in Wafer Level Packaging Revenue, 2024-2029
5.2.3 By Application - Global Fan-in Wafer Level Packaging Revenue Market Share, 2018-2029
6 Sights by Region
6.1 By Region - Global Fan-in Wafer Level Packaging Market Size, 2022 & 2029
6.2 By Region - Global Fan-in Wafer Level Packaging Revenue & Forecasts
6.2.1 By Region - Global Fan-in Wafer Level Packaging Revenue, 2018-2023
6.2.2 By Region - Global Fan-in Wafer Level Packaging Revenue, 2024-2029
6.2.3 By Region - Global Fan-in Wafer Level Packaging Revenue Market Share, 2018-2029
6.3 North America
6.3.1 By Country - North America Fan-in Wafer Level Packaging Revenue, 2018-2029
6.3.2 US Fan-in Wafer Level Packaging Market Size, 2018-2029
6.3.3 Canada Fan-in Wafer Level Packaging Market Size, 2018-2029
6.3.4 Mexico Fan-in Wafer Level Packaging Market Size, 2018-2029
6.4 Europe
6.4.1 By Country - Europe Fan-in Wafer Level Packaging Revenue, 2018-2029
6.4.2 Germany Fan-in Wafer Level Packaging Market Size, 2018-2029
6.4.3 France Fan-in Wafer Level Packaging Market Size, 2018-2029
6.4.4 U.K. Fan-in Wafer Level Packaging Market Size, 2018-2029
6.4.5 Italy Fan-in Wafer Level Packaging Market Size, 2018-2029
6.4.6 Russia Fan-in Wafer Level Packaging Market Size, 2018-2029
6.4.7 Nordic Countries Fan-in Wafer Level Packaging Market Size, 2018-2029
6.4.8 Benelux Fan-in Wafer Level Packaging Market Size, 2018-2029
6.5 Asia
6.5.1 By Region - Asia Fan-in Wafer Level Packaging Revenue, 2018-2029
6.5.2 China Fan-in Wafer Level Packaging Market Size, 2018-2029
6.5.3 Japan Fan-in Wafer Level Packaging Market Size, 2018-2029
6.5.4 South Korea Fan-in Wafer Level Packaging Market Size, 2018-2029
6.5.5 Southeast Asia Fan-in Wafer Level Packaging Market Size, 2018-2029
6.5.6 India Fan-in Wafer Level Packaging Market Size, 2018-2029
6.6 South America
6.6.1 By Country - South America Fan-in Wafer Level Packaging Revenue, 2018-2029
6.6.2 Brazil Fan-in Wafer Level Packaging Market Size, 2018-2029
6.6.3 Argentina Fan-in Wafer Level Packaging Market Size, 2018-2029
6.7 Middle East & Africa
6.7.1 By Country - Middle East & Africa Fan-in Wafer Level Packaging Revenue, 2018-2029
6.7.2 Turkey Fan-in Wafer Level Packaging Market Size, 2018-2029
6.7.3 Israel Fan-in Wafer Level Packaging Market Size, 2018-2029
6.7.4 Saudi Arabia Fan-in Wafer Level Packaging Market Size, 2018-2029
6.7.5 UAE Fan-in Wafer Level Packaging Market Size, 2018-2029
7 Fan-in Wafer Level Packaging Companies Profiles
7.1 STATS ChipPAC
7.1.1 STATS ChipPAC Company Summary
7.1.2 STATS ChipPAC Business Overview
7.1.3 STATS ChipPAC Fan-in Wafer Level Packaging Major Product Offerings
7.1.4 STATS ChipPAC Fan-in Wafer Level Packaging Revenue in Global Market (2018-2023)
7.1.5 STATS ChipPAC Key News & Latest Developments
7.2 STMicroelectronics
7.2.1 STMicroelectronics Company Summary
7.2.2 STMicroelectronics Business Overview
7.2.3 STMicroelectronics Fan-in Wafer Level Packaging Major Product Offerings
7.2.4 STMicroelectronics Fan-in Wafer Level Packaging Revenue in Global Market (2018-2023)
7.2.5 STMicroelectronics Key News & Latest Developments
7.3 TSMC
7.3.1 TSMC Company Summary
7.3.2 TSMC Business Overview
7.3.3 TSMC Fan-in Wafer Level Packaging Major Product Offerings
7.3.4 TSMC Fan-in Wafer Level Packaging Revenue in Global Market (2018-2023)
7.3.5 TSMC Key News & Latest Developments
7.4 Texas Instruments
7.4.1 Texas Instruments Company Summary
7.4.2 Texas Instruments Business Overview
7.4.3 Texas Instruments Fan-in Wafer Level Packaging Major Product Offerings
7.4.4 Texas Instruments Fan-in Wafer Level Packaging Revenue in Global Market (2018-2023)
7.4.5 Texas Instruments Key News & Latest Developments
7.5 Rudolph Technologies
7.5.1 Rudolph Technologies Company Summary
7.5.2 Rudolph Technologies Business Overview
7.5.3 Rudolph Technologies Fan-in Wafer Level Packaging Major Product Offerings
7.5.4 Rudolph Technologies Fan-in Wafer Level Packaging Revenue in Global Market (2018-2023)
7.5.5 Rudolph Technologies Key News & Latest Developments
7.6 SEMES
7.6.1 SEMES Company Summary
7.6.2 SEMES Business Overview
7.6.3 SEMES Fan-in Wafer Level Packaging Major Product Offerings
7.6.4 SEMES Fan-in Wafer Level Packaging Revenue in Global Market (2018-2023)
7.6.5 SEMES Key News & Latest Developments
7.7 SUSS MicroTec
7.7.1 SUSS MicroTec Company Summary
7.7.2 SUSS MicroTec Business Overview
7.7.3 SUSS MicroTec Fan-in Wafer Level Packaging Major Product Offerings
7.7.4 SUSS MicroTec Fan-in Wafer Level Packaging Revenue in Global Market (2018-2023)
7.7.5 SUSS MicroTec Key News & Latest Developments
7.8 Veeco/CNT
7.8.1 Veeco/CNT Company Summary
7.8.2 Veeco/CNT Business Overview
7.8.3 Veeco/CNT Fan-in Wafer Level Packaging Major Product Offerings
7.8.4 Veeco/CNT Fan-in Wafer Level Packaging Revenue in Global Market (2018-2023)
7.8.5 Veeco/CNT Key News & Latest Developments
7.9 FlipChip International
7.9.1 FlipChip International Company Summary
7.9.2 FlipChip International Business Overview
7.9.3 FlipChip International Fan-in Wafer Level Packaging Major Product Offerings
7.9.4 FlipChip International Fan-in Wafer Level Packaging Revenue in Global Market (2018-2023)
7.9.5 FlipChip International Key News & Latest Developments
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer
LIST OF TABLES & FIGURES
List of Tables
Table 1. Fan-in Wafer Level Packaging Market Opportunities & Trends in Global Market
Table 2. Fan-in Wafer Level Packaging Market Drivers in Global Market
Table 3. Fan-in Wafer Level Packaging Market Restraints in Global Market
Table 4. Key Players of Fan-in Wafer Level Packaging in Global Market
Table 5. Top Fan-in Wafer Level Packaging Players in Global Market, Ranking by Revenue (2022)
Table 6. Global Fan-in Wafer Level Packaging Revenue by Companies, (US$, Mn), 2018-2023
Table 7. Global Fan-in Wafer Level Packaging Revenue Share by Companies, 2018-2023
Table 8. Global Companies Fan-in Wafer Level Packaging Product Type
Table 9. List of Global Tier 1 Fan-in Wafer Level Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 10. List of Global Tier 2 and Tier 3 Fan-in Wafer Level Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 11. By Type ? Global Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Table 12. By Type - Fan-in Wafer Level Packaging Revenue in Global (US$, Mn), 2018-2023
Table 13. By Type - Fan-in Wafer Level Packaging Revenue in Global (US$, Mn), 2024-2029
Table 14. By Application ? Global Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Table 15. By Application - Fan-in Wafer Level Packaging Revenue in Global (US$, Mn), 2018-2023
Table 16. By Application - Fan-in Wafer Level Packaging Revenue in Global (US$, Mn), 2024-2029
Table 17. By Region ? Global Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Table 18. By Region - Global Fan-in Wafer Level Packaging Revenue (US$, Mn), 2018-2023
Table 19. By Region - Global Fan-in Wafer Level Packaging Revenue (US$, Mn), 2024-2029
Table 20. By Country - North America Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 21. By Country - North America Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 22. By Country - Europe Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 23. By Country - Europe Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 24. By Region - Asia Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 25. By Region - Asia Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 26. By Country - South America Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 27. By Country - South America Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 28. By Country - Middle East & Africa Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 29. By Country - Middle East & Africa Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 30. STATS ChipPAC Company Summary
Table 31. STATS ChipPAC Fan-in Wafer Level Packaging Product Offerings
Table 32. STATS ChipPAC Fan-in Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 33. STATS ChipPAC Key News & Latest Developments
Table 34. STMicroelectronics Company Summary
Table 35. STMicroelectronics Fan-in Wafer Level Packaging Product Offerings
Table 36. STMicroelectronics Fan-in Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 37. STMicroelectronics Key News & Latest Developments
Table 38. TSMC Company Summary
Table 39. TSMC Fan-in Wafer Level Packaging Product Offerings
Table 40. TSMC Fan-in Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 41. TSMC Key News & Latest Developments
Table 42. Texas Instruments Company Summary
Table 43. Texas Instruments Fan-in Wafer Level Packaging Product Offerings
Table 44. Texas Instruments Fan-in Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 45. Texas Instruments Key News & Latest Developments
Table 46. Rudolph Technologies Company Summary
Table 47. Rudolph Technologies Fan-in Wafer Level Packaging Product Offerings
Table 48. Rudolph Technologies Fan-in Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 49. Rudolph Technologies Key News & Latest Developments
Table 50. SEMES Company Summary
Table 51. SEMES Fan-in Wafer Level Packaging Product Offerings
Table 52. SEMES Fan-in Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 53. SEMES Key News & Latest Developments
Table 54. SUSS MicroTec Company Summary
Table 55. SUSS MicroTec Fan-in Wafer Level Packaging Product Offerings
Table 56. SUSS MicroTec Fan-in Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 57. SUSS MicroTec Key News & Latest Developments
Table 58. Veeco/CNT Company Summary
Table 59. Veeco/CNT Fan-in Wafer Level Packaging Product Offerings
Table 60. Veeco/CNT Fan-in Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 61. Veeco/CNT Key News & Latest Developments
Table 62. FlipChip International Company Summary
Table 63. FlipChip International Fan-in Wafer Level Packaging Product Offerings
Table 64. FlipChip International Fan-in Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 65. FlipChip International Key News & Latest Developments
List of Figures
Figure 1. Fan-in Wafer Level Packaging Segment by Type in 2022
Figure 2. Fan-in Wafer Level Packaging Segment by Application in 2022
Figure 3. Global Fan-in Wafer Level Packaging Market Overview: 2022
Figure 4. Key Caveats
Figure 5. Global Fan-in Wafer Level Packaging Market Size: 2022 VS 2029 (US$, Mn)
Figure 6. Global Fan-in Wafer Level Packaging Revenue, 2018-2029 (US$, Mn)
Figure 7. The Top 3 and 5 Players Market Share by Fan-in Wafer Level Packaging Revenue in 2022
Figure 8. By Type - Global Fan-in Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 9. By Application - Global Fan-in Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 10. By Type - Global Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Figure 11. By Type - Global Fan-in Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 12. By Application - Global Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Figure 13. By Application - Global Fan-in Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 14. By Region - Global Fan-in Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 15. By Country - North America Fan-in Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 16. US Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 17. Canada Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 18. Mexico Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 19. By Country - Europe Fan-in Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 20. Germany Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 21. France Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 22. U.K. Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 23. Italy Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 24. Russia Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 25. Nordic Countries Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 26. Benelux Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 27. By Region - Asia Fan-in Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 28. China Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 29. Japan Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 30. South Korea Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 31. Southeast Asia Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 32. India Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 33. By Country - South America Fan-in Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 34. Brazil Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 35. Argentina Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 36. By Country - Middle East & Africa Fan-in Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 37. Turkey Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 38. Israel Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 39. Saudi Arabia Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 40. UAE Fan-in Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 41. STATS ChipPAC Fan-in Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 42. STMicroelectronics Fan-in Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 43. TSMC Fan-in Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 44. Texas Instruments Fan-in Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 45. Rudolph Technologies Fan-in Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 46. SEMES Fan-in Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 47. SUSS MicroTec Fan-in Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 48. Veeco/CNT Fan-in Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 49. FlipChip International Fan-in Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
