FOWLP is a chip packaging technology that is used to package an IC, while the IC is still part of the wafer.
This report aims to provide a comprehensive presentation of the global market for Fan-out Wafer Level Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fan-out Wafer Level Packaging. This report contains market size and forecasts of Fan-out Wafer Level Packaging in global, including the following market information:
Global Fan-out Wafer Level Packaging Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The global Fan-out Wafer Level Packaging market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
In terms of geography, APAC led the global FOWLP market. According to analysts, the region will continue to dominate this market during the forecast period as well and this will mainly attribute to the presence of major semiconductor industries in the region.
We surveyed the Fan-out Wafer Level Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Fan-out Wafer Level Packaging Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Fan-out Wafer Level Packaging Market Segment Percentages, by Type, 2022 (%)
200mm Wafer Level Packaging
300mm Wafer Level Packaging
Other
Global Fan-out Wafer Level Packaging Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Fan-out Wafer Level Packaging Market Segment Percentages, by Application, 2022 (%)
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC
Other
Global Fan-out Wafer Level Packaging Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Fan-out Wafer Level Packaging Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Fan-out Wafer Level Packaging revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Fan-out Wafer Level Packaging revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
STATS ChipPAC
TSMC
Texas Instruments
Rudolph Technologies
SEMES
SUSS MicroTec
STMicroelectronics
Veeco/CNT
Outline of Major Chapters:
Chapter 1: Introduces the definition of Fan-out Wafer Level Packaging, market overview.
Chapter 2: Global Fan-out Wafer Level Packaging market size in revenue.
Chapter 3: Detailed analysis of Fan-out Wafer Level Packaging company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Fan-out Wafer Level Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
TABLE OF CONTENTS
1 Introduction to Research & Analysis Reports
1.1 Fan-out Wafer Level Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Fan-out Wafer Level Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Fan-out Wafer Level Packaging Overall Market Size
2.1 Global Fan-out Wafer Level Packaging Market Size: 2022 VS 2029
2.2 Global Fan-out Wafer Level Packaging Market Size, Prospects & Forecasts: 2018-2029
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top Fan-out Wafer Level Packaging Players in Global Market
3.2 Top Global Fan-out Wafer Level Packaging Companies Ranked by Revenue
3.3 Global Fan-out Wafer Level Packaging Revenue by Companies
3.4 Top 3 and Top 5 Fan-out Wafer Level Packaging Companies in Global Market, by Revenue in 2022
3.5 Global Companies Fan-out Wafer Level Packaging Product Type
3.6 Tier 1, Tier 2 and Tier 3 Fan-out Wafer Level Packaging Players in Global Market
3.6.1 List of Global Tier 1 Fan-out Wafer Level Packaging Companies
3.6.2 List of Global Tier 2 and Tier 3 Fan-out Wafer Level Packaging Companies
4 Market Sights by Product
4.1 Overview
4.1.1 By Type - Global Fan-out Wafer Level Packaging Market Size Markets, 2022 & 2029
4.1.2 200mm Wafer Level Packaging
4.1.3 300mm Wafer Level Packaging
4.1.4 Other
4.2 By Type - Global Fan-out Wafer Level Packaging Revenue & Forecasts
4.2.1 By Type - Global Fan-out Wafer Level Packaging Revenue, 2018-2023
4.2.2 By Type - Global Fan-out Wafer Level Packaging Revenue, 2024-2029
4.2.3 By Type - Global Fan-out Wafer Level Packaging Revenue Market Share, 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global Fan-out Wafer Level Packaging Market Size, 2022 & 2029
5.1.2 CMOS Image Sensor
5.1.3 Wireless Connectivity
5.1.4 Logic and Memory IC
5.1.5 MEMS and Sensor
5.1.6 Analog and Mixed IC
5.1.7 Other
5.2 By Application - Global Fan-out Wafer Level Packaging Revenue & Forecasts
5.2.1 By Application - Global Fan-out Wafer Level Packaging Revenue, 2018-2023
5.2.2 By Application - Global Fan-out Wafer Level Packaging Revenue, 2024-2029
5.2.3 By Application - Global Fan-out Wafer Level Packaging Revenue Market Share, 2018-2029
6 Sights by Region
6.1 By Region - Global Fan-out Wafer Level Packaging Market Size, 2022 & 2029
6.2 By Region - Global Fan-out Wafer Level Packaging Revenue & Forecasts
6.2.1 By Region - Global Fan-out Wafer Level Packaging Revenue, 2018-2023
6.2.2 By Region - Global Fan-out Wafer Level Packaging Revenue, 2024-2029
6.2.3 By Region - Global Fan-out Wafer Level Packaging Revenue Market Share, 2018-2029
6.3 North America
6.3.1 By Country - North America Fan-out Wafer Level Packaging Revenue, 2018-2029
6.3.2 US Fan-out Wafer Level Packaging Market Size, 2018-2029
6.3.3 Canada Fan-out Wafer Level Packaging Market Size, 2018-2029
6.3.4 Mexico Fan-out Wafer Level Packaging Market Size, 2018-2029
6.4 Europe
6.4.1 By Country - Europe Fan-out Wafer Level Packaging Revenue, 2018-2029
6.4.2 Germany Fan-out Wafer Level Packaging Market Size, 2018-2029
6.4.3 France Fan-out Wafer Level Packaging Market Size, 2018-2029
6.4.4 U.K. Fan-out Wafer Level Packaging Market Size, 2018-2029
6.4.5 Italy Fan-out Wafer Level Packaging Market Size, 2018-2029
6.4.6 Russia Fan-out Wafer Level Packaging Market Size, 2018-2029
6.4.7 Nordic Countries Fan-out Wafer Level Packaging Market Size, 2018-2029
6.4.8 Benelux Fan-out Wafer Level Packaging Market Size, 2018-2029
6.5 Asia
6.5.1 By Region - Asia Fan-out Wafer Level Packaging Revenue, 2018-2029
6.5.2 China Fan-out Wafer Level Packaging Market Size, 2018-2029
6.5.3 Japan Fan-out Wafer Level Packaging Market Size, 2018-2029
6.5.4 South Korea Fan-out Wafer Level Packaging Market Size, 2018-2029
6.5.5 Southeast Asia Fan-out Wafer Level Packaging Market Size, 2018-2029
6.5.6 India Fan-out Wafer Level Packaging Market Size, 2018-2029
6.6 South America
6.6.1 By Country - South America Fan-out Wafer Level Packaging Revenue, 2018-2029
6.6.2 Brazil Fan-out Wafer Level Packaging Market Size, 2018-2029
6.6.3 Argentina Fan-out Wafer Level Packaging Market Size, 2018-2029
6.7 Middle East & Africa
6.7.1 By Country - Middle East & Africa Fan-out Wafer Level Packaging Revenue, 2018-2029
6.7.2 Turkey Fan-out Wafer Level Packaging Market Size, 2018-2029
6.7.3 Israel Fan-out Wafer Level Packaging Market Size, 2018-2029
6.7.4 Saudi Arabia Fan-out Wafer Level Packaging Market Size, 2018-2029
6.7.5 UAE Fan-out Wafer Level Packaging Market Size, 2018-2029
7 Fan-out Wafer Level Packaging Companies Profiles
7.1 STATS ChipPAC
7.1.1 STATS ChipPAC Company Summary
7.1.2 STATS ChipPAC Business Overview
7.1.3 STATS ChipPAC Fan-out Wafer Level Packaging Major Product Offerings
7.1.4 STATS ChipPAC Fan-out Wafer Level Packaging Revenue in Global Market (2018-2023)
7.1.5 STATS ChipPAC Key News & Latest Developments
7.2 TSMC
7.2.1 TSMC Company Summary
7.2.2 TSMC Business Overview
7.2.3 TSMC Fan-out Wafer Level Packaging Major Product Offerings
7.2.4 TSMC Fan-out Wafer Level Packaging Revenue in Global Market (2018-2023)
7.2.5 TSMC Key News & Latest Developments
7.3 Texas Instruments
7.3.1 Texas Instruments Company Summary
7.3.2 Texas Instruments Business Overview
7.3.3 Texas Instruments Fan-out Wafer Level Packaging Major Product Offerings
7.3.4 Texas Instruments Fan-out Wafer Level Packaging Revenue in Global Market (2018-2023)
7.3.5 Texas Instruments Key News & Latest Developments
7.4 Rudolph Technologies
7.4.1 Rudolph Technologies Company Summary
7.4.2 Rudolph Technologies Business Overview
7.4.3 Rudolph Technologies Fan-out Wafer Level Packaging Major Product Offerings
7.4.4 Rudolph Technologies Fan-out Wafer Level Packaging Revenue in Global Market (2018-2023)
7.4.5 Rudolph Technologies Key News & Latest Developments
7.5 SEMES
7.5.1 SEMES Company Summary
7.5.2 SEMES Business Overview
7.5.3 SEMES Fan-out Wafer Level Packaging Major Product Offerings
7.5.4 SEMES Fan-out Wafer Level Packaging Revenue in Global Market (2018-2023)
7.5.5 SEMES Key News & Latest Developments
7.6 SUSS MicroTec
7.6.1 SUSS MicroTec Company Summary
7.6.2 SUSS MicroTec Business Overview
7.6.3 SUSS MicroTec Fan-out Wafer Level Packaging Major Product Offerings
7.6.4 SUSS MicroTec Fan-out Wafer Level Packaging Revenue in Global Market (2018-2023)
7.6.5 SUSS MicroTec Key News & Latest Developments
7.7 STMicroelectronics
7.7.1 STMicroelectronics Company Summary
7.7.2 STMicroelectronics Business Overview
7.7.3 STMicroelectronics Fan-out Wafer Level Packaging Major Product Offerings
7.7.4 STMicroelectronics Fan-out Wafer Level Packaging Revenue in Global Market (2018-2023)
7.7.5 STMicroelectronics Key News & Latest Developments
7.8 Veeco/CNT
7.8.1 Veeco/CNT Company Summary
7.8.2 Veeco/CNT Business Overview
7.8.3 Veeco/CNT Fan-out Wafer Level Packaging Major Product Offerings
7.8.4 Veeco/CNT Fan-out Wafer Level Packaging Revenue in Global Market (2018-2023)
7.8.5 Veeco/CNT Key News & Latest Developments
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer
LIST OF TABLES & FIGURES
List of Tables
Table 1. Fan-out Wafer Level Packaging Market Opportunities & Trends in Global Market
Table 2. Fan-out Wafer Level Packaging Market Drivers in Global Market
Table 3. Fan-out Wafer Level Packaging Market Restraints in Global Market
Table 4. Key Players of Fan-out Wafer Level Packaging in Global Market
Table 5. Top Fan-out Wafer Level Packaging Players in Global Market, Ranking by Revenue (2022)
Table 6. Global Fan-out Wafer Level Packaging Revenue by Companies, (US$, Mn), 2018-2023
Table 7. Global Fan-out Wafer Level Packaging Revenue Share by Companies, 2018-2023
Table 8. Global Companies Fan-out Wafer Level Packaging Product Type
Table 9. List of Global Tier 1 Fan-out Wafer Level Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 10. List of Global Tier 2 and Tier 3 Fan-out Wafer Level Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 11. By Type ? Global Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Table 12. By Type - Fan-out Wafer Level Packaging Revenue in Global (US$, Mn), 2018-2023
Table 13. By Type - Fan-out Wafer Level Packaging Revenue in Global (US$, Mn), 2024-2029
Table 14. By Application ? Global Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Table 15. By Application - Fan-out Wafer Level Packaging Revenue in Global (US$, Mn), 2018-2023
Table 16. By Application - Fan-out Wafer Level Packaging Revenue in Global (US$, Mn), 2024-2029
Table 17. By Region ? Global Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Table 18. By Region - Global Fan-out Wafer Level Packaging Revenue (US$, Mn), 2018-2023
Table 19. By Region - Global Fan-out Wafer Level Packaging Revenue (US$, Mn), 2024-2029
Table 20. By Country - North America Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 21. By Country - North America Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 22. By Country - Europe Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 23. By Country - Europe Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 24. By Region - Asia Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 25. By Region - Asia Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 26. By Country - South America Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 27. By Country - South America Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 28. By Country - Middle East & Africa Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 29. By Country - Middle East & Africa Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 30. STATS ChipPAC Company Summary
Table 31. STATS ChipPAC Fan-out Wafer Level Packaging Product Offerings
Table 32. STATS ChipPAC Fan-out Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 33. STATS ChipPAC Key News & Latest Developments
Table 34. TSMC Company Summary
Table 35. TSMC Fan-out Wafer Level Packaging Product Offerings
Table 36. TSMC Fan-out Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 37. TSMC Key News & Latest Developments
Table 38. Texas Instruments Company Summary
Table 39. Texas Instruments Fan-out Wafer Level Packaging Product Offerings
Table 40. Texas Instruments Fan-out Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 41. Texas Instruments Key News & Latest Developments
Table 42. Rudolph Technologies Company Summary
Table 43. Rudolph Technologies Fan-out Wafer Level Packaging Product Offerings
Table 44. Rudolph Technologies Fan-out Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 45. Rudolph Technologies Key News & Latest Developments
Table 46. SEMES Company Summary
Table 47. SEMES Fan-out Wafer Level Packaging Product Offerings
Table 48. SEMES Fan-out Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 49. SEMES Key News & Latest Developments
Table 50. SUSS MicroTec Company Summary
Table 51. SUSS MicroTec Fan-out Wafer Level Packaging Product Offerings
Table 52. SUSS MicroTec Fan-out Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 53. SUSS MicroTec Key News & Latest Developments
Table 54. STMicroelectronics Company Summary
Table 55. STMicroelectronics Fan-out Wafer Level Packaging Product Offerings
Table 56. STMicroelectronics Fan-out Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 57. STMicroelectronics Key News & Latest Developments
Table 58. Veeco/CNT Company Summary
Table 59. Veeco/CNT Fan-out Wafer Level Packaging Product Offerings
Table 60. Veeco/CNT Fan-out Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 61. Veeco/CNT Key News & Latest Developments
List of Figures
Figure 1. Fan-out Wafer Level Packaging Segment by Type in 2022
Figure 2. Fan-out Wafer Level Packaging Segment by Application in 2022
Figure 3. Global Fan-out Wafer Level Packaging Market Overview: 2022
Figure 4. Key Caveats
Figure 5. Global Fan-out Wafer Level Packaging Market Size: 2022 VS 2029 (US$, Mn)
Figure 6. Global Fan-out Wafer Level Packaging Revenue, 2018-2029 (US$, Mn)
Figure 7. The Top 3 and 5 Players Market Share by Fan-out Wafer Level Packaging Revenue in 2022
Figure 8. By Type - Global Fan-out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 9. By Application - Global Fan-out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 10. By Type - Global Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Figure 11. By Type - Global Fan-out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 12. By Application - Global Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Figure 13. By Application - Global Fan-out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 14. By Region - Global Fan-out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 15. By Country - North America Fan-out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 16. US Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 17. Canada Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 18. Mexico Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 19. By Country - Europe Fan-out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 20. Germany Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 21. France Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 22. U.K. Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 23. Italy Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 24. Russia Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 25. Nordic Countries Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 26. Benelux Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 27. By Region - Asia Fan-out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 28. China Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 29. Japan Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 30. South Korea Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 31. Southeast Asia Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 32. India Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 33. By Country - South America Fan-out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 34. Brazil Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 35. Argentina Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 36. By Country - Middle East & Africa Fan-out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 37. Turkey Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 38. Israel Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 39. Saudi Arabia Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 40. UAE Fan-out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 41. STATS ChipPAC Fan-out Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 42. TSMC Fan-out Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 43. Texas Instruments Fan-out Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 44. Rudolph Technologies Fan-out Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 45. SEMES Fan-out Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 46. SUSS MicroTec Fan-out Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 47. STMicroelectronics Fan-out Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 48. Veeco/CNT Fan-out Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
