The global Fan-Out Wafer Level Packaging market was valued at US$ 1409.5 million in 2022 and is projected to reach US$ 4829.4 million by 2029, at a CAGR of 19.2% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The Fan-Out WLP technique involves cutting and separating the chip and then embedding the chip inside the panel. The procedure is to attach the chip face down to the Carrier, and the chip spacing should conform to the Pitch specification of the circuit design, while the receiver performs Molding to form a Panel. Follow-up will be separation, sealant panel and a vehicle for sealant panel Wafer shape, also called reconstruct Wafer (Reconstituted Wafer), can be widely used standard Wafer process, need is formed on the sealant panel circuit design. Since the area of the sealing panel is larger than that of the chip, not only can I/O contacts be made into the wafer area by Fan-In method; It can also be Fanned Out on a plastic mold to accommodate more I/O contacts.
This report aims to provide a comprehensive presentation of the global market for Fan-Out Wafer Level Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fan-Out Wafer Level Packaging. This report contains market size and forecasts of Fan-Out Wafer Level Packaging in global, including the following market information:
Global Fan-Out Wafer Level Packaging Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The industry's leading producers are TSMC, ASE Technology Holding Co., and JCET Group, which accounted for 44.97%, 16.03% and 11.81% of revenue in 2019, respectively.
We surveyed the Fan-Out Wafer Level Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Fan-Out Wafer Level Packaging Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Fan-Out Wafer Level Packaging Market Segment Percentages, by Type, 2022 (%)
- High Density Fan-Out Package
- Core Fan-Out Package
Global Fan-Out Wafer Level Packaging Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Fan-Out Wafer Level Packaging Market Segment Percentages, by Application, 2022 (%)
- CMOS Image Sensor
- A Wireless Connection
- Logic and Memory Integrated Circuits
- Mems and Sensors
- Analog and Hybrid Integrated Circuits
- Others
Global Fan-Out Wafer Level Packaging Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Fan-Out Wafer Level Packaging Market Segment Percentages, By Region and Country, 2022 (%)
- North America
- US
- Canada
- Mexico
- Europe
- Germany
- France
- U.K.
- Italy
- Russia
- Nordic Countries
- Benelux
- Rest of Europe
- Asia
- China
- Japan
- South Korea
- Southeast Asia
- India
- Rest of Asia
- South America
- Brazil
- Argentina
- Rest of South America
- Middle East & Africa
- Turkey
- Israel
- Saudi Arabia
- UAE
- Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
- Key companies Fan-Out Wafer Level Packaging revenues in global market, 2018-2023 (estimated), ($ millions)
- Key companies Fan-Out Wafer Level Packaging revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
- TSMC
- ASE Technology Holding Co.
- JCET Group
- Amkor Technology
- Siliconware Technology (SuZhou) Co.
- Nepes
Outline of Major Chapters:
- Chapter 1: Introduces the definition of Fan-Out Wafer Level Packaging, market overview.
- Chapter 2: Global Fan-Out Wafer Level Packaging market size in revenue.
- Chapter 3: Detailed analysis of Fan-Out Wafer Level Packaging company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
- Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
- Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
- Chapter 6: Sales of Fan-Out Wafer Level Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
- Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
- Chapter 8: The main points and conclusions of the report.
TABLE OF CONTENTS
1 Introduction to Research & Analysis Reports
1.1 Fan-Out Wafer Level Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Fan-Out Wafer Level Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Fan-Out Wafer Level Packaging Overall Market Size
2.1 Global Fan-Out Wafer Level Packaging Market Size: 2022 VS 2029
2.2 Global Fan-Out Wafer Level Packaging Market Size, Prospects & Forecasts: 2018-2029
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top Fan-Out Wafer Level Packaging Players in Global Market
3.2 Top Global Fan-Out Wafer Level Packaging Companies Ranked by Revenue
3.3 Global Fan-Out Wafer Level Packaging Revenue by Companies
3.4 Top 3 and Top 5 Fan-Out Wafer Level Packaging Companies in Global Market, by Revenue in 2022
3.5 Global Companies Fan-Out Wafer Level Packaging Product Type
3.6 Tier 1, Tier 2 and Tier 3 Fan-Out Wafer Level Packaging Players in Global Market
3.6.1 List of Global Tier 1 Fan-Out Wafer Level Packaging Companies
3.6.2 List of Global Tier 2 and Tier 3 Fan-Out Wafer Level Packaging Companies
4 Market Sights by Product
4.1 Overview
4.1.1 By Type - Global Fan-Out Wafer Level Packaging Market Size Markets, 2022 & 2029
4.1.2 High Density Fan-Out Package
4.1.3 Core Fan-Out Package
4.2 By Type - Global Fan-Out Wafer Level Packaging Revenue & Forecasts
4.2.1 By Type - Global Fan-Out Wafer Level Packaging Revenue, 2018-2023
4.2.2 By Type - Global Fan-Out Wafer Level Packaging Revenue, 2024-2029
4.2.3 By Type - Global Fan-Out Wafer Level Packaging Revenue Market Share, 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global Fan-Out Wafer Level Packaging Market Size, 2022 & 2029
5.1.2 CMOS Image Sensor
5.1.3 A Wireless Connection
5.1.4 Logic and Memory Integrated Circuits
5.1.5 Mems and Sensors
5.1.6 Analog and Hybrid Integrated Circuits
5.1.7 Others
5.2 By Application - Global Fan-Out Wafer Level Packaging Revenue & Forecasts
5.2.1 By Application - Global Fan-Out Wafer Level Packaging Revenue, 2018-2023
5.2.2 By Application - Global Fan-Out Wafer Level Packaging Revenue, 2024-2029
5.2.3 By Application - Global Fan-Out Wafer Level Packaging Revenue Market Share, 2018-2029
6 Sights by Region
6.1 By Region - Global Fan-Out Wafer Level Packaging Market Size, 2022 & 2029
6.2 By Region - Global Fan-Out Wafer Level Packaging Revenue & Forecasts
6.2.1 By Region - Global Fan-Out Wafer Level Packaging Revenue, 2018-2023
6.2.2 By Region - Global Fan-Out Wafer Level Packaging Revenue, 2024-2029
6.2.3 By Region - Global Fan-Out Wafer Level Packaging Revenue Market Share, 2018-2029
6.3 North America
6.3.1 By Country - North America Fan-Out Wafer Level Packaging Revenue, 2018-2029
6.3.2 US Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.3.3 Canada Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.3.4 Mexico Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.4 Europe
6.4.1 By Country - Europe Fan-Out Wafer Level Packaging Revenue, 2018-2029
6.4.2 Germany Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.4.3 France Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.4.4 U.K. Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.4.5 Italy Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.4.6 Russia Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.4.7 Nordic Countries Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.4.8 Benelux Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.5 Asia
6.5.1 By Region - Asia Fan-Out Wafer Level Packaging Revenue, 2018-2029
6.5.2 China Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.5.3 Japan Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.5.4 South Korea Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.5.5 Southeast Asia Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.5.6 India Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.6 South America
6.6.1 By Country - South America Fan-Out Wafer Level Packaging Revenue, 2018-2029
6.6.2 Brazil Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.6.3 Argentina Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.7 Middle East & Africa
6.7.1 By Country - Middle East & Africa Fan-Out Wafer Level Packaging Revenue, 2018-2029
6.7.2 Turkey Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.7.3 Israel Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.7.4 Saudi Arabia Fan-Out Wafer Level Packaging Market Size, 2018-2029
6.7.5 UAE Fan-Out Wafer Level Packaging Market Size, 2018-2029
7 Fan-Out Wafer Level Packaging Companies Profiles
7.1 TSMC
7.1.1 TSMC Company Summary
7.1.2 TSMC Business Overview
7.1.3 TSMC Fan-Out Wafer Level Packaging Major Product Offerings
7.1.4 TSMC Fan-Out Wafer Level Packaging Revenue in Global Market (2018-2023)
7.1.5 TSMC Key News & Latest Developments
7.2 ASE Technology Holding Co.
7.2.1 ASE Technology Holding Co. Company Summary
7.2.2 ASE Technology Holding Co. Business Overview
7.2.3 ASE Technology Holding Co. Fan-Out Wafer Level Packaging Major Product Offerings
7.2.4 ASE Technology Holding Co. Fan-Out Wafer Level Packaging Revenue in Global Market (2018-2023)
7.2.5 ASE Technology Holding Co. Key News & Latest Developments
7.3 JCET Group
7.3.1 JCET Group Company Summary
7.3.2 JCET Group Business Overview
7.3.3 JCET Group Fan-Out Wafer Level Packaging Major Product Offerings
7.3.4 JCET Group Fan-Out Wafer Level Packaging Revenue in Global Market (2018-2023)
7.3.5 JCET Group Key News & Latest Developments
7.4 Amkor Technology
7.4.1 Amkor Technology Company Summary
7.4.2 Amkor Technology Business Overview
7.4.3 Amkor Technology Fan-Out Wafer Level Packaging Major Product Offerings
7.4.4 Amkor Technology Fan-Out Wafer Level Packaging Revenue in Global Market (2018-2023)
7.4.5 Amkor Technology Key News & Latest Developments
7.5 Siliconware Technology (SuZhou) Co.
7.5.1 Siliconware Technology (SuZhou) Co. Company Summary
7.5.2 Siliconware Technology (SuZhou) Co. Business Overview
7.5.3 Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Major Product Offerings
7.5.4 Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Revenue in Global Market (2018-2023)
7.5.5 Siliconware Technology (SuZhou) Co. Key News & Latest Developments
7.6 Nepes
7.6.1 Nepes Company Summary
7.6.2 Nepes Business Overview
7.6.3 Nepes Fan-Out Wafer Level Packaging Major Product Offerings
7.6.4 Nepes Fan-Out Wafer Level Packaging Revenue in Global Market (2018-2023)
7.6.5 Nepes Key News & Latest Developments
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer
LIST OF TABLES & FIGURES
List of Tables
Table 1. Fan-Out Wafer Level Packaging Market Opportunities & Trends in Global Market
Table 2. Fan-Out Wafer Level Packaging Market Drivers in Global Market
Table 3. Fan-Out Wafer Level Packaging Market Restraints in Global Market
Table 4. Key Players of Fan-Out Wafer Level Packaging in Global Market
Table 5. Top Fan-Out Wafer Level Packaging Players in Global Market, Ranking by Revenue (2022)
Table 6. Global Fan-Out Wafer Level Packaging Revenue by Companies, (US$, Mn), 2018-2023
Table 7. Global Fan-Out Wafer Level Packaging Revenue Share by Companies, 2018-2023
Table 8. Global Companies Fan-Out Wafer Level Packaging Product Type
Table 9. List of Global Tier 1 Fan-Out Wafer Level Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 10. List of Global Tier 2 and Tier 3 Fan-Out Wafer Level Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 11. By Type ? Global Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Table 12. By Type - Fan-Out Wafer Level Packaging Revenue in Global (US$, Mn), 2018-2023
Table 13. By Type - Fan-Out Wafer Level Packaging Revenue in Global (US$, Mn), 2024-2029
Table 14. By Application ? Global Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Table 15. By Application - Fan-Out Wafer Level Packaging Revenue in Global (US$, Mn), 2018-2023
Table 16. By Application - Fan-Out Wafer Level Packaging Revenue in Global (US$, Mn), 2024-2029
Table 17. By Region ? Global Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Table 18. By Region - Global Fan-Out Wafer Level Packaging Revenue (US$, Mn), 2018-2023
Table 19. By Region - Global Fan-Out Wafer Level Packaging Revenue (US$, Mn), 2024-2029
Table 20. By Country - North America Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 21. By Country - North America Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 22. By Country - Europe Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 23. By Country - Europe Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 24. By Region - Asia Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 25. By Region - Asia Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 26. By Country - South America Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 27. By Country - South America Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 28. By Country - Middle East & Africa Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2023
Table 29. By Country - Middle East & Africa Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2024-2029
Table 30. TSMC Company Summary
Table 31. TSMC Fan-Out Wafer Level Packaging Product Offerings
Table 32. TSMC Fan-Out Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 33. TSMC Key News & Latest Developments
Table 34. ASE Technology Holding Co. Company Summary
Table 35. ASE Technology Holding Co. Fan-Out Wafer Level Packaging Product Offerings
Table 36. ASE Technology Holding Co. Fan-Out Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 37. ASE Technology Holding Co. Key News & Latest Developments
Table 38. JCET Group Company Summary
Table 39. JCET Group Fan-Out Wafer Level Packaging Product Offerings
Table 40. JCET Group Fan-Out Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 41. JCET Group Key News & Latest Developments
Table 42. Amkor Technology Company Summary
Table 43. Amkor Technology Fan-Out Wafer Level Packaging Product Offerings
Table 44. Amkor Technology Fan-Out Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 45. Amkor Technology Key News & Latest Developments
Table 46. Siliconware Technology (SuZhou) Co. Company Summary
Table 47. Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Product Offerings
Table 48. Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 49. Siliconware Technology (SuZhou) Co. Key News & Latest Developments
Table 50. Nepes Company Summary
Table 51. Nepes Fan-Out Wafer Level Packaging Product Offerings
Table 52. Nepes Fan-Out Wafer Level Packaging Revenue (US$, Mn) & (2018-2023)
Table 53. Nepes Key News & Latest Developments
List of Figures
Figure 1. Fan-Out Wafer Level Packaging Segment by Type in 2022
Figure 2. Fan-Out Wafer Level Packaging Segment by Application in 2022
Figure 3. Global Fan-Out Wafer Level Packaging Market Overview: 2022
Figure 4. Key Caveats
Figure 5. Global Fan-Out Wafer Level Packaging Market Size: 2022 VS 2029 (US$, Mn)
Figure 6. Global Fan-Out Wafer Level Packaging Revenue, 2018-2029 (US$, Mn)
Figure 7. The Top 3 and 5 Players Market Share by Fan-Out Wafer Level Packaging Revenue in 2022
Figure 8. By Type - Global Fan-Out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 9. By Application - Global Fan-Out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 10. By Type - Global Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Figure 11. By Type - Global Fan-Out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 12. By Application - Global Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2022 & 2029
Figure 13. By Application - Global Fan-Out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 14. By Region - Global Fan-Out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 15. By Country - North America Fan-Out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 16. US Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 17. Canada Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 18. Mexico Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 19. By Country - Europe Fan-Out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 20. Germany Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 21. France Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 22. U.K. Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 23. Italy Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 24. Russia Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 25. Nordic Countries Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 26. Benelux Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 27. By Region - Asia Fan-Out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 28. China Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 29. Japan Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 30. South Korea Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 31. Southeast Asia Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 32. India Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 33. By Country - South America Fan-Out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 34. Brazil Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 35. Argentina Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 36. By Country - Middle East & Africa Fan-Out Wafer Level Packaging Revenue Market Share, 2018-2029
Figure 37. Turkey Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 38. Israel Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 39. Saudi Arabia Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 40. UAE Fan-Out Wafer Level Packaging Revenue, (US$, Mn), 2018-2029
Figure 41. TSMC Fan-Out Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 42. ASE Technology Holding Co. Fan-Out Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 43. JCET Group Fan-Out Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 44. Amkor Technology Fan-Out Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 45. Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 46. Nepes Fan-Out Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
