3D IC & 2.5D IC Packaging Market Size, Share, Price, Trend and Forecast 2022 to 2028

The "India 3D IC & 2.5D IC Packaging Market" size was valued at US$ 1.78 billion in 2024 and is projected to reach US$ 4.23 billion by 2030, at a CAGR of 15.5%.

3D IC & 2.5D IC Packaging in India: These advanced semiconductor packaging technologies integrate multiple chips to enhance performance, reduce size, and improve power efficiency. 3D IC packaging stacks chips vertically with interconnects, achieving high integration density, while 2.5D IC packaging places chips side-by-side on an interposer, offering flexibility with improved thermal management. In India, these technologies are gaining traction due to growing demand for high-performance electronics, driven by industries like IoT, AI, and telecommunications.

Advanced semiconductor packaging technologies for three-dimensional and 2.5-dimensional integrated circuits.

The Indian market shows rapid growth, driven by high-performance computing needs. Data center applications lead demand, with AI processors showing fastest growth. Through-silicon via technology advancing. Thermal management improving.

This report contains market size and forecasts of 3D IC & 2.5D IC Packaging in India, including the following market information:

India 3D IC & 2.5D IC Packaging Market Revenue, 2019-2024, 2024-2030, ($ millions)
India 3D IC & 2.5D IC Packaging Market Sales, 2019-2024, 2024-2030,
India Top five 3D IC & 2.5D IC Packaging companies in 2023 (%)

Report Includes

This report presents an overview of India market for 3D IC & 2.5D IC Packaging , sales, revenue and price. Analyses of the India market trends, with historic market revenue/sales data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.

This report focuses on the 3D IC & 2.5D IC Packaging sales, revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the India 3D IC & 2.5D IC Packaging market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues.

This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.

This report analyzes the segments data by Type, and by Sales Channels, sales, revenue, and price, from 2019 to 2030. Evaluation and forecast the market size for Humidifier sales, projected growth trends, production technology, sales channels and end-user industry.

By Type

3D TSV
2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

By Applications

Automotive
Consumer electronics
Medical devices
Military & aerospace
Telecommunication
Industrial sector and smart technologies

Key Companies

Intel Corporation
Samsung Electronics Co., Ltd.
Advanced Semiconductor Engineering, Inc.
Taiwan Semiconductor Manufacturing Company, Limited
United Microelectronics Corporation
Qualcomm Incorporated
Broadcom Inc.
Micron Technology, Inc.
STMicroelectronics
ASE Group

Including or excluding key companies relevant to your analysis.

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies 3D IC & 2.5D IC Packaging revenues in Indian market, 2019-2024 (Estimated), ($ millions)
Key companies 3D IC & 2.5D IC Packaging revenues share in Indian market, 2023 (%)
Key companies 3D IC & 2.5D IC Packaging sales in Indian market, 2019-2024 (Estimated),
Key companies 3D IC & 2.5D IC Packaging sales share in Indian market, 2023 (%)

Key Indicators Analysed

Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2019-2030 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.
Indian Market Analysis: The report includes Indian market status and outlook 2019-2030. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.
Market Trends: Market key trends which include Increased Competition and Continuous Innovations.
Opportunities and Drivers: Identifying the Growing Demands and New Technology
Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.

Key Benefits of This Market Research:

Industry drivers, restraints, and opportunities covered in the study
Neutral perspective on the market performance
Recent industry trends and developments
Competitive landscape & strategies of key players
Potential & niche segments and regions exhibiting promising growth covered
Historical, current, and projected market size, in terms of value
In-depth analysis of the 3D IC & 2.5D IC Packaging Market
Overview of the regional outlook of the 3D IC & 2.5D IC Packaging Market

Key Reasons to Buy this Report:

Access to date statistics compiled by our researchers. These provide you with historical and forecast data, which is analyzed to tell you why your market is set to change
This enables you to anticipate market changes to remain ahead of your competitors
You will be able to copy data from the Excel spreadsheet straight into your marketing plans, business presentations or other strategic documents
The concise analysis, clear graph, and table format will enable you to pinpoint the information you require quickly
Provision of market value (USD Billion) data for each segment and sub-segment
Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market
Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region
Competitive landscape which incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions, and acquisitions in the past five years of companies profiled
Extensive company profiles comprising of company overview, company insights, product benchmarking, and SWOT analysis for the major market players
The current as well as the future market outlook of the industry concerning recent developments which involve growth opportunities and drivers as well as challenges and restraints of both emerging as well as developed regions
Includes in-depth analysis of the market from various perspectives through Porter’s five forces analysis
Provides insight into the market through Value Chain
Market dynamics scenario, along with growth opportunities of the market in the years to come
6-month post-sales analyst support

We offer additional regional and global reports that are similar:

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1 STUDY COVERAGE

1.1 3D IC & 2.5D IC Packaging Product Introduction

1.2 Market by Type

1.2.1 Indian 3D IC & 2.5D IC Packaging Market Size Growth Rate by Type, 2019 VS 2023 VS 2030

1.2.2 3D TSV

1.2.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

1.3 Market by Application

1.3.1 India 3D IC & 2.5D IC Packaging Market Size Growth Rate by Application, 2019 VS 2023 VS 2030

1.3.2   Automotive

1.3.3   Consumer electronics

1.3.4   Medical devices

1.3.5   Military & aerospace

1.3.6   Telecommunication

1.3.7   Industrial sector and smart technologies

1.4 India 3D IC & 2.5D IC Packaging Sales Estimates and Forecasts 2019-2030

1.5 India 3D IC & 2.5D IC Packaging Hydrocephalus Shunts Revenue Estimates and Forecasts 2019-2030

1.6 Study Objectives

1.7 Years Considered

2 COMPETITION BY MANUFACTURERS

2.1 India 3D IC & 2.5D IC Packaging Sales by Manufacturers

2.1.1 India 3D IC & 2.5D IC Packaging Sales by Manufacturers (2019-2024)

2.1.2 India 3D IC & 2.5D IC Packaging Sales Market Share by Manufacturers (2019-2024)

2.1.3 Top Largest Manufacturers of 3D IC & 2.5D IC Packaging in 2023 in India

2.2 India 3D IC & 2.5D IC Packaging Revenue by Manufacturers

2.2.1 India 3D IC & 2.5D IC Packaging Revenue by Manufacturers (2019-2024)

2.2.2 India 3D IC & 2.5D IC Packaging Revenue Market Share by Manufacturers (2019-2024)

2.2.3 India Top Companies by 3D IC & 2.5D IC Packaging Revenue in 2023

2.3 India 3D IC & 2.5D IC Packaging Sales Price by Manufacturers (2019-2024)

2.4 Analysis of Competitive Landscape

2.4.1 Manufacturers Market Concentration Ratio (CR3 and HHI)

2.4.2 India 3D IC & 2.5D IC Packaging by Company Type (Tier 1, Tier 2, and Tier 3)

2.4.3 India 3D IC & 2.5D IC Packaging Manufacturers Geographical Distribution

2.5 Mergers & Acquisitions, Expansion Plans

3 India 3D IC & 2.5D IC Packaging MARKET SIZE BY REGION

3.1 3D IC & 2.5D IC Packaging Market Size by Region: 2019-2030

3.1.1 India 3D IC & 2.5D IC Packaging Sales by Region: 2019-2024

3.1.2 India 3D IC & 2.5D IC Packaging Sales Forecast by Region (2025-2030)

3.1.3 India 3D IC & 2.5D IC Packaging Revenue by Region: 2019-2024

3.1.4 India 3D IC & 2.5D IC Packaging Revenue Forecast by Region (2025-2030)

4 MARKET SIZE BY TYPE

4.1 India 3D IC & 2.5D IC Packaging Sales by Type

4.1.1 India 3D IC & 2.5D IC Packaging Historical Sales by Type (2019-2024)

4.1.2 India 3D IC & 2.5D IC Packaging Forecasted Sales by Type (2025-2030)

4.1.3 India 3D IC & 2.5D IC Packaging Sales Market Share by Type (2019-2030)

4.2 India 3D IC & 2.5D IC Packaging Revenue by Type

4.2.1 India 3D IC & 2.5D IC Packaging Historical Revenue by Type (2019-2024)

4.2.2 India 3D IC & 2.5D IC Packaging Forecasted Revenue by Type (2025-2030)

4.2.3 India 3D IC & 2.5D IC Packaging Revenue Market Share by Type (2019-2030)

4.3 India 3D IC & 2.5D IC Packaging Price by Type

4.3.1 India 3D IC & 2.5D IC Packaging Price by Type (2019-2024)

4.3.2 India 3D IC & 2.5D IC Packaging Price Forecast by Type (2025-2030)

5 MARKET SIZE BY APPLICATION

5.1 India 3D IC & 2.5D IC Packaging Sales by Application

5.1.1 India 3D IC & 2.5D IC Packaging Historical Sales by Application (2019-2024)

5.1.2 India 3D IC & 2.5D IC Packaging Forecasted Sales by Application (2025-2030)

5.1.3 India 3D IC & 2.5D IC Packaging Sales Market Share by Application (2019-2030)

5.2 India 3D IC & 2.5D IC Packaging Revenue by Application

5.2.1 India 3D IC & 2.5D IC Packaging Historical Revenue by Application (2019-2024)

5.2.2 India 3D IC & 2.5D IC Packaging Forecasted Revenue by Application (2025-2030)

5.2.3 India 3D IC & 2.5D IC Packaging Revenue Market Share by Application (2019-2030)

5.3 India 3D IC & 2.5D IC Packaging Price by Application

5.3.1 India 3D IC & 2.5D IC Packaging Price by Application (2019-2024)

5.3.2 India 3D IC & 2.5D IC Packaging Price Forecast by Application (2025-2030)

6. CORPORATE PROFILE

6.1 Intel Corporation

6.1.1 Intel Corporation Corporation Information

6.1.2 Intel Corporation Overview

6.1.3 Intel Corporation in India: 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2019-2024)

6.1.4 Intel Corporation 3D IC & 2.5D IC Packaging Product Introduction

6.1.5 Intel Corporation Recent Developments

6.2 Samsung Electronics Co., Ltd.

6.2.1 Samsung Electronics Co., Ltd. Corporation Information

6.2.2 Samsung Electronics Co., Ltd. Overview

6.2.3 Samsung Electronics Co., Ltd. in India: 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2019-2024)

6.2.4 Samsung Electronics Co., Ltd. 3D IC & 2.5D IC Packaging Product Introduction

6.2.5 Samsung Electronics Co., Ltd. Recent Developments

6.3 Advanced Semiconductor Engineering, Inc.

6.3.1 Advanced Semiconductor Engineering, Inc. Corporation Information

6.3.2 Advanced Semiconductor Engineering, Inc. Overview

6.3.3 Advanced Semiconductor Engineering, Inc. in India: 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2019-2024)

6.3.4 Advanced Semiconductor Engineering, Inc. 3D IC & 2.5D IC Packaging Product Introduction

6.3.5 Advanced Semiconductor Engineering, Inc. Recent Developments

6.4 Taiwan Semiconductor Manufacturing Company, Limited

6.4.1 Taiwan Semiconductor Manufacturing Company, Limited Corporation Information

6.4.2 Taiwan Semiconductor Manufacturing Company, Limited Overview

6.4.3 Taiwan Semiconductor Manufacturing Company, Limited in India: 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2019-2024)

6.4.4 Taiwan Semiconductor Manufacturing Company, Limited 3D IC & 2.5D IC Packaging Product Introduction

6.4.5 Taiwan Semiconductor Manufacturing Company, Limited Recent Developments

6.5 United Microelectronics Corporation

6.5.1 United Microelectronics Corporation Corporation Information

6.5.2 United Microelectronics Corporation Overview

6.5.3 United Microelectronics Corporation in India: 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2019-2024)

6.5.4 United Microelectronics Corporation 3D IC & 2.5D IC Packaging Product Introduction

6.5.5 United Microelectronics Corporation Recent Developments

6.6 Qualcomm Incorporated

6.6.1 Qualcomm Incorporated Corporation Information

6.6.2 Qualcomm Incorporated Overview

6.6.3 Qualcomm Incorporated in India: 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2019-2024)

6.6.4 Qualcomm Incorporated 3D IC & 2.5D IC Packaging Product Introduction

6.6.5 Qualcomm Incorporated Recent Developments

6.7 Broadcom Inc.

6.7.1 Broadcom Inc. Corporation Information

6.7.2 Broadcom Inc. Overview

6.7.3 Broadcom Inc. in India: 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2019-2024)

6.7.4 Broadcom Inc. 3D IC & 2.5D IC Packaging Product Introduction

6.7.5 Broadcom Inc. Recent Developments

6.8 Micron Technology, Inc.

6.8.1 Micron Technology, Inc. Corporation Information

6.8.2 Micron Technology, Inc. Overview

6.8.3 Micron Technology, Inc. in India: 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2019-2024)

6.8.4 Micron Technology, Inc. 3D IC & 2.5D IC Packaging Product Introduction

6.8.5 Micron Technology, Inc. Recent Developments

6.9 STMicroelectronics

6.9.1 STMicroelectronics Corporation Information

6.9.2 STMicroelectronics Overview

6.9.3 STMicroelectronics in India: 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2019-2024)

6.9.4STMicroelectronics 3D IC & 2.5D IC Packaging Product Introduction

6.9.5 STMicroelectronics Recent Developments

6.10 ASE Group

6.10.1 ASE Group Corporation Information

6.10.2 ASE Group Overview

6.10.3 ASE Group in India: 3D IC & 2.5D IC Packaging Sales, Price, Revenue and Gross Margin (2019-2024)

6.10.4 ASE Group 3D IC & 2.5D IC Packaging Product Introduction

6.10.5 ASE Group Recent Developments

7 INDUSTRY CHAIN AND SALES CHANNELS ANALYSIS

7.1 3D IC & 2.5D IC Packaging Industry Chain Analysis

7.2 3D IC & 2.5D IC Packaging Key Raw Materials

7.2.1 Key Raw Materials

7.2.2 Raw Materials Key Suppliers

7.3 3D IC & 2.5D IC Packaging Production Mode & Process

7.4 3D IC & 2.5D IC Packaging Sales and Marketing

7.4.1 3D IC & 2.5D IC Packaging Sales Channels

7.4.2 3D IC & 2.5D IC Packaging Distributors

7.5 3D IC & 2.5D IC Packaging Customers

8 3D IC & 2.5D IC Packaging MARKET DYNAMICS

8.1.1 3D IC & 2.5D IC Packaging Industry Trends

8.1.2 3D IC & 2.5D IC Packaging Market Drivers

8.1.3 3D IC & 2.5D IC Packaging Market Challenges

8.1.4 3D IC & 2.5D IC Packaging Market Restraints

9 KEY FINDINGS IN THE India 3D IC & 2.5D IC Packaging STUDY

10 APPENDIX

10.1 Research Methodology

10.1.1 Methodology/Research Approach

10.1.2 Data Source

10.2 Author Details

10.3 Disclaimer

LIST OF TABLES & FIGURES

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India 3D IC & 2.5D IC Packaging Market Outlook and Forecast 2024-2030